• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2003년도 제21회 추계학술대회 논문집
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• pp.230-237
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• 2003

로켓의 신뢰성을 위해서 토출관의 접합계면을 평가하기위한 초음파 시험법을 개발하였다. 본 연구의 주된 목적은 철피와 FRP 사이의 에폭시 접합계면에서 미접착 부위와 미충전 부위를 찾아내는 것이다. 미접착부나 미충전부를 찾아내기 위해서 고주파수 초음파 펄스-에코를 이용하여 철피와 에폭시 접착제 사이의 경계면에서 반사되는 초음파 신호를 측정하였다. 결함이 있는 부위의 gap의 크기를 평가하기 위해서 저주파 초음파를 이용하여 공진이 일어나도록 철피를 가진하였다. 이러한 기법을 이용하여 양산품을 검사하기 위한 자동화 장치를 개발하였다. 검사기법을 검증하기 위해서 초음파 시험을 수행한 토출관을 절단하여 현미경으로 gap을 측정하였다.

• Restorative Dentistry and Endodontics
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• 제24권4호
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• pp.546-553
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• 1999

In Older to evaluate the effectiveness of 'One-bottle dentin adhesive system', the shear bond strengths of two fourth generation dentin adhesive systems and two One-bottle systems to the occlusal dentin of the freshly extracted third molars were measured by the regulation of the ISO TR 11405. The fourth generation dentin adhesive systems used in this study were Scotchbond Multi-Purpose Plus and All-Bond 2, and the One-bottle systems were Single Bond and One-Step. The effects of the thickness of hybrid layer and adhesive layer, the diameter of resin tag and the ratio between the diameter of resin tag and that of dentinal tubule were analyzed as the contributing factors of the shear bond strength of dentin bonding systems from the Scanning Electron Microscopic images. The results were as follows: 1. The shear bond strengths of Scotchbond Multi-Purpose, All-Bond 2, and Single Bond were 16.98${\pm}$3.40 MPa, 15.10${\pm}$2.77 MPa and 15.05${\pm}$3.18 MPa, respectively. There were no statistical differences(p>0.05). 2. But, the shear bond strength of One-Step were significantly lower than those of the other groups (11.81${\pm}$1.95 MPa, p<0.05). 3. The thicknesses of hybrid layer and adhesive layer of One-Step were significantly thinner than those of the other groups(p<0.05). The differences of the diameter of resin tag(p=0.0685) and the ratio between the diameter of resin tag and that of dentinal tubule(p=0.2401) were not significant among all the material groups. 4. The thickness of hybrid layer and adhesive layer might be considered as contributing factors of the she at bond strengths of dentin bonding systems, but the diameter of resin tag and the ratio between the diameter of resin tag and that of dentinal tubule might not.

• 접착 및 계면
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• 제4권2호
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• pp.21-29
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• 2003

Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

• 마이크로전자및패키징학회지
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• 제16권1호
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• pp.27-31
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• 2009

본 논문에서는 웨이퍼 레벨 기술을 이용한 CIS용 폴리머 접합 기술을 연구하고 접합 후의 warpage 분석과 개별 패키지의 신뢰성 테스트를 수행하였다. 균일한 접합 높이를 유지하기 위하여 glass 웨이퍼 상에 dam을 형성하고 접합용 폴리머 층을 patterning하여 Si과 glass 웨이퍼의 접합 테스트를 수행하였다. Si 웨이퍼의 접합온도, 접합 압력 그리고 접합 층이 낮을수록 warpage 결과가 감소하였으며 접합시간과 승온 시간이 짧을수록 warpage 결과가 증가하는 것을 확인하였다. 접합 된 웨이퍼를 dicing 하여 각 개별 칩 단위로 TC, HTC, Humidity soak의 신뢰성 테스트를 수행하였으며 warpage 결과가 패키지의 신뢰성 결과에 미치는 영향은 미비한 것으로 확인되었다.

• Applied Microscopy
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• 제45권3호
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• pp.144-149
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• 2015

Nothobranchius guentheri and Nothobranchius patrizii have special life cycle to sustain the dry season. So, we investigated the fertilized eggs morphology, and compared ultrastructures of surface structures and the cross section of fertilized egg envelopes using light and electron microscopes to determine whether these fertilized eggs and egg envelopes show the species specificity or have special structure to sustain the dry season. These fertilized eggs were spherical, yellowish, demersal and adhesive, and had a one-sided large oil droplet. The whip-like structures, adhesive filament were distributed throughout egg envelope in both species. But, that of N. guentheri was covered with fibrous structures, and that of N. patrizii was smooth. The egg envelope consisted of two distinct layers: an outer, electron-dense layer containing adhesive filaments and an inner layer of 16 to 17 horizontal electron-dense lamellae alternating with 15 to 16 interlamellae of lower electron density in both species. The external shapes of fertilized egg and section of fertilized egg envelope were same, but ultrastructure of adhesive filaments on the outer surface was concluded to show species specificity. Our data indicate that the ultrastructural differences of adhesive filament and outer surface of fertilized egg envelope show species specificity although these species belong to same genus.

• Computers and Concrete
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• 제15권3호
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• pp.337-355
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• 2015

In this scientific work, an improved analytical solution for adhesive stresses in a concrete beam bonded with the FRP plate is developed by including the effect of the adherend shear deformations. The analysis is based on the deformation compatibility approach where both the shear and normal stresses are assumed to be invariant across the adhesive layer thickness. The shear stress distribution is supposed to be parabolic across the depth of the adherends in computing the adhesive shear stress and Timoshenko's beam theory is employed in predicting adhesive normal stress to consider the shear deformation. Numerical results from the present analysis are presented both to demonstrate the advantages of the present solution over existing ones and to illustrate the main characteristics of adhesive stress distributions.

• 한국터널지하공간학회 논문집
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• 제7권4호
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• pp.305-311
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• 2005

암반에 건설되는 대단면 터널에서 숏크리트의 부착강도는 암반탈락 방지와 발파진동에 의한 숏크리트 탈락방지에 매우 중요하다. 그럼에도 불구하고 숏크리트 부착강도는 압축강도에 비하여 설계 및 시공단계에서 중요한 요소로 고려되지 않았다. 따라서 본 연구의 목적은 숏크리트 부착강도가 대단면 암반 터널의 안정성에 미치는 영향을 분석하는 것이다. 먼저, Holmgren의 punch-loaded 시험조건을 모사한 수치해석 모델을 이용하여 다양한 부착강도에 대한 매개변수연구를 수행하였다. 그 결과, 숏크리트의 최대지지력은 숏크리트층과 블록간의 부착 강도와 선형 비례관계를 보임을 확인하였다. 또한, 숏크리트층과 굴착면에 부착강도를 고려하는 경우와 기존의 완전부착 조건에 대한 개별요소해석을 수행하여 숏크리트 부착강도의 영향을 검토하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
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• pp.51-53
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• 2004

An analytical method is developed which focused on the end effects for determining the thermal stress distribution in an laminated beam bonded with adhesive layer. This method gives the stress distribution which satisfy the stress-free boundary condition at edge completely. Numerical example, in which an Al-Cu beam bonded with solder(Pb-Sn) is treated, shows that the shear and peeling stresses at the interfaces are significant near the edge and become negligible in the interior region.

• 보존과학회지
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• 제34권3호
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• pp.143-155
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• 2018

본 연구에서는 전통적으로 토벽화 마감층 제작에 사용된 것으로 여겨지는 천연 보강 매제인 아교, 전분풀, 도박풀을 3%, 5%, 7%, 10% 농도로 적용하여 흙 반죽의 작업성부터 완성된 마감층의 물성 및 내후성까지 전반적으로 평가하였다. 연구 결과, 농도 5% 이하의 전분풀과 3%의 도박풀을 배합하였을 때 마감층의 제작에 유리하였다. 아교를 배합한 흙 반죽은 농도가 높을수록 건조하고 쉽게 부서져 작업성이 매우 떨어졌으나 저농도의 아교를 배합할 경우 표면 안정성이 높아 3% 이하의 저농도에서 보강 매제로 사용되었을 가능성이 있었다. 전분풀은 작업성과 강도 보강의 효과가 뛰어났으나 7% 이상의 농도로 사용할 시 동결융해에 의한 표면 안정성이 떨어졌다. 도박풀의 경우 강도 보강의 효과가 있었으나 5% 농도 이상에서는 균열이 발생하였고 농도 3%의 경우에는 균열이 발생하지 않고 동결융해 후에도 표면이 안정하여 보강 매제로서 적합한 것으로 나타났다. 이는 앞으로 토벽화 마감층의 전통기술 및 재료를 복원하고 보강 매제의 용법을 제시하는데 활용될 수 있을 것으로 기대된다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집A
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.