• 제목/요약/키워드: adhesive force

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Adhesive and frictional behaviors of Mica between nanoscale and microscale (나노스케일과 마이크로스케일 사이에서 Mica 의 점착 및 마찰 거동)

  • Choi D.H.;Hwang W.B.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1151-1154
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    • 2005
  • The size effects for adhesive and frictional characteristics were studied. The specimen was Mica and the AFM tips were SiO2. The radii of SiO2 tip were 280, 380, 930, and 2230 nm on which tribological tests had never been performed. It was found that the adhesive forces and the frictional coefficients increased non-linearly with tip radius. Compared with previous studies at nanoscale and microscale, the results showed behaviors bridging each previous result. It could be said that these results were clues to explain the material behaviors between nanoscale and microscale both in adhesion and friction.

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Adhesive, Friction, and Deformation Behaviors of Pig Skin under Various Exposure Times to Air (돼지피부의 공기노출 시간에 따른 응착, 마찰 및 변형거동)

  • Shin, Hyunduk;Ahn, Hyo-Sok
    • Tribology and Lubricants
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    • v.30 no.1
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    • pp.36-45
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    • 2014
  • Understanding steel/skin contact phenomena is important for the study of object manipulation in robotics and has been a topic of great interest. In this study, pig skin was taken as a surrogate model for human skin, and its adhesive, friction, and deformation behaviors were measured under various exposure times to air. Indentation, friction, and scratch tests were performed at $25^{\circ}C$ and 45% relative humidity. The influences of adhesion and deformation on the coefficient of friction were characterized; the pig skin was found to be sensitive to the sliding velocity and normal load under the controlled experimental conditions.

Molecular Dynamics Simulation of Adhesive Friction of Silicon Asperity (실리콘 돌기의 응착마찰 분자동력학 시뮬레이션)

  • Park, Seung-Ho;Cho, Sung-San
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.5
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    • pp.547-553
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    • 2004
  • A hemispherical asperity moving over a flat plane is simulated based on classical molecular dynamics. The asperity and the plane consist of silicon atoms whose interactions are governed by the Tersoff three-body potential. The gap between the asperity and the plane is maintained to produce attractive normal force in order to investigate the adhesive friction and wear. The simulation focuses on the influence of crystallographic orientation of the contacting surfaces and the moving direction. It is demonstrated that the adhesive friction and wear are lower when crystallographic orientations of the contacting surfaces are different, and also depend on the moving direction relative to the crystal1ographic orientation.

A Study of Adhesive Mechanism of Gecko Adhesion System using Adhesive Beam Contact Model (보 접착 모델을 이용한 게코 접착 시스템의 접착 메커니즘에 대한 연구)

  • Kim, Won-Bae;Cho, Maeng-Hyo
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.23 no.4
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    • pp.403-407
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    • 2010
  • Gecko adhesion system consists of beam-shaped seta and spatula which has the role of adhesive pad. In this paper, adhesion mechanism of gecko adhesion system is performed by using adhesive beam contact model. this model has a feature of non-uniform stress profile on the contact surface and adhesion/detachment mechanism is determined by the tensile stress of the contact region. a spatula tip pad has the role of reduction of maximum tensile stress and adhesive force is increased due to this effect. As for a reverse loading case, maximum compressive stress drops by the spatula effect and this cause unsymmetric loading conditions between adhesion and detachment forces. In this study, finite element method is used for the analysis of adhesive beam contact model and the results for spatula effect are presented.

A Study on the design of separation force measuring system for improvement of semiconductor productivity

  • Park, Kun-Jong
    • Journal of the Korea Society of Computer and Information
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    • v.22 no.10
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    • pp.1-7
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    • 2017
  • In this paper, the separation force measuring system is developed. The separation force aries due to adhesive strength between semiconductor epoxy molding compound(EMC) and the metal plate in semiconductor formed plate. In general, when removing the metal plate in semiconductor formed plate from semiconductor epoxy molding compound, excessive strength can result in a increase in semiconductor defect rates, or conversely, if too little force is exerted on the metal plate in semiconductor formed plate, the semiconductor production rates can decrease. In this study, the design criteria for the selection of the AC servo motor, the role of the ball screw, the relationship between the load cell and the ball screw, and the rate of deceleration are given. In addition, minimizing the reject rate of semiconductors and maximizing the semiconductor production rate are achieved through the standardization of the collected separation force data measured by the proposed system.

Discussion of the relationship between tractive power and braking power in initial time (초기기동시 추진력과 제동력 관계에 대한 고찰)

  • Lee, Gi-Sik;Han, Sung-Ho;Jung, Kwon-Il
    • Proceedings of the KSR Conference
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    • 2009.05a
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    • pp.1643-1648
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    • 2009
  • The braking system of train must posses the large baking effort in order to stop the train safety within the limited traveling distance. but, the excessive braking effort has been deteriorated the ride comfort due to high level of deceleration and jerk, and sometimes occurred the skid. because the applied braking force exceeds the allowable adhesive force. this skid causes not only to increase the a stopping distance but also to deteriorate the safety of train and damage the rall surface by wheel flat. In the present paper, braking force for disk brake of Tilting Train eXpress(TTX) was measured though on convention line test and the traction force was estimated by using the analytic model in skid condition. also, we have discussed the relationship between the bake force and traction force in starting condition.

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Pre-treatment condition and Curing method for Fabrication of Al 7075/CFRP Laminates (Al 7075/CFRP 적층 복합재료 제조를 위한 전처리 조건과 경화방법 연구)

  • 이제헌;김영환
    • Composites Research
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    • v.13 no.4
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    • pp.42-53
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    • 2000
  • A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.

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Adhesive Strength and Interface Characterization of CF/PEKK Composites with PEEK, PEI Adhesives Using High Temperature oven Welding Process (고온 오븐 접합을 적용한 PEEK, PEI 기반 CF/PEKK 복합재의 접착 강도 및 계면 특성 평가)

  • Park, Seong-Jae;Lee, Kyo-Moon;Park, Soo-Jeong;Kim, Yun-Hae
    • Composites Research
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    • v.35 no.2
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    • pp.86-92
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    • 2022
  • This study was conducted to determine the effect of molecular formation of adhesive on interface characterization of thermoplastic composites. Carbonfiber/polyetherketoneketone (CF/PEKK) thermoplastic composites were fusion bonded and PEEK, PEI adhesive bonded using a high-temperature oven welding process. In addition, lap shear strength test and fracture surface analysis using a digital optical microscope and a scanning electron microscope (SEM), and Fourier transform infrared spectroscopy (FTIR) were performed. As a result, the adhesive bonding method improved adhesion strength with interphase having increased molecular formation of ether groups, ketone groups, and imide groups which mainly constitutes the CF/PEKK and adhesives. Furthermore, it was found that the use of PEEK containing more ether groups and ketone groups forms a more strongly bonded interphase and enhances the adhesive force of the CF/PEKK composites.

Evaluation of the Change in Adhesion Strength of GFRP and CFRP with Carbon Nanotube Contents in Epoxy Adhesive with Moisture Change during Curing (에폭시 접착제의 탄소나노튜브 함량과 경화시 습도 변화에 따른 GFRP 및 CFRP의 접착강도 변화 평가)

  • Park, Hee-Woong;Kim, Jong-Hyun;Park, Joung-Man
    • Journal of Adhesion and Interface
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    • v.23 no.1
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    • pp.1-7
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    • 2022
  • As the wind blades become larger, they tend to be made by mixing glass fiber and carbon fiber, and it is important to increase the properties of the adhesive which adheres the two materials. The physical properties of the adhesive vary depending on the content of the additive and curing conditions. In this study, the change in adhesion strength with the difference between the CNT (Carbon Nanotube) content of the epoxy adhesive and the humidity during curing was evaluated. GFRP and CFRP specimens were prepared and adhered using an epoxy adhesive, and to examine changes in characteristics with carbon nanotube contents and with the humidity during curing of the epoxy adhesive, adhesion strength was evaluated by dividing the difference between carbon nanotube content and humidity. To find out the change with the CNT contents, the intelaminar shear strength (ILSS) test was performed by dividing the contents of the CNT into 0, 0.1, 0.3, 0.5, and 1 wt%, and to confirm the change with the humidity conditions, the adhesive was cured by dividing the humidity by 20, 50, and 80%. From the result of the experiment, the adhesive force decreased when the content was excessively large, although the adhesive property was enhanced by adding CNT to the epoxy adhesive. In addition, it was confirmed that the adhesion characteristics were not changed as the humidity increased.