• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.490-490
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• 2011

Graphene, hexagonal network of carbon atoms forming a one-atom thick planar sheet, has been emerged as a fascinating material for future nanoelectronics. Huge attention has been captured by its extraordinary electronic properties, such as bipolar conductance, half integer quantum Hall effect at room temperature, ballistic transport over ${\sim}0.4{\mu}m$ length and extremely high carrier mobility at room temperature. Several approaches have been developed to produce graphene, such as micromechanical cleavage of highly ordered pyrolytic graphite using adhesive tape, chemical reduction of exfoliated graphite oxide, epitaxial growth of graphene on SiC and single crystalline metal substrate, and chemical vapor deposition (CVD) synthesis. In particular, direct synthesis of graphene using metal catalytic substrate in CVD process provides a new way to large-scale production of graphene film for realization of graphene-based electronics. In this method, metal catalytic substrates including Ni and Cu have been used for CVD synthesis of graphene. There are two proposed mechanism of graphene synthesis: carbon diffusion and precipitation for graphene synthesized on Ni, and surface adsorption for graphene synthesized on Cu, namely, self-limiting growth mechanism, which can be divided by difference of carbon solubility of the metals. Here we present that large area, uniform, and layer controllable graphene synthesized on Cu catalytic substrate is achieved by acetylene-assisted CVD. The number of graphene layer can be simply controlled by adjusting acetylene injection time, verified by Raman spectroscopy. Structural features and full details of mechanism for the growth of layer controllable graphene on Cu were systematically explored by transmission electron microscopy, atomic force microscopy, and secondary ion mass spectroscopy.

• Journal of the korean academy of Pediatric Dentistry
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• v.41 no.3
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• pp.218-224
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• 2014

This study was designed to evaluate the effectiveness of 5% sodium fluoride-polyvinyl alcohol (NaF-PVA) tape influencing enamel remineralization by analysing enamel surface microhardness (SMH) and variation of ${\Delta}F$ of QLF. After enamel demineralizing of specimen, these 60 specimens with average KHN of microhardness ranging from 50 to 100 and with ${\Delta}F$ of QLF ranging from -15 to -25 were divided into four groups : group 1 (control group), group 2 (NaF-PVA), group 3 (fluoride varnish, FluoroDose$^{(R)}$ varnish), group 4 (Casein phosphopeptide-amorphous calcium phosphate, Tooth mousse plus$^{TM}$). These specimens were treated with materials and then immersed in artificial saliva. We measured remineralization rate each using surface microhardness (SMH) and Quantitative light-induced fluorescence digital (QLF-D). As a result, NaF-PVA tape is better than group 1, 4 and have comparable remineralization effect with group 3 (p < 0.05).

• Polymer(Korea)
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• v.36 no.2
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• pp.196-201
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• 2012

Electrospinning is a versatile process used to prepare micro or nano sized fibers from various materials dissolved in volatile solvents. This study reports electrospun pullulan fibrous webs fabricated through electrospinning using water as a solvent. The electrospinning conditions such as pullulan (PUL) concentration and applied voltage were optimized in order to obtain smooth electrospun fibers. The concentration of PUL greatly influenced the viscosity and surface tension of PUL solution. PUL beaded electrospun fibers were obtained from PUL solutions with concentrations lower than 5 wt%, while homogenous electrospun fibers were prepared from solutions with high concentration and high viscosity. The average diameters of PUL fibers were decreased to 200 nm when the polymer concentration was kept at 10 wt% and the applied voltage was fixed at 15 kV during electrospinning. PUL electrospun fiber exhibited higher solubility, flexibility, softness and adhesive strength.

• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.91-95
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• 2010

A UV-enhanced atomic layer deposition (UV-ALD) process was developed to deposit $TiO_2$ thin films on Si substrates using titanium isopropoxide(TIP) and $H_2O$ as precursors with UV light. In the UV-ALD process, the surface reactions were found to be self-limiting and complementary enough to yield a uniform, conformal, pure $TiO_2$ thin film on Si substrates at room temperature. The UV light was very effective to obtain the high-quality $TiO_2$ thin films with good adhesive strength on Si substrates. The UV-ALD process was applied to produce uniform and conformal $TiO_2$ coats into deep trenches with high aspect ratio.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.33-36
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• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• Corrosion Science and Technology
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• v.20 no.4
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• pp.204-209
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• 2021

Corrosion failure analysis of the flow plate, which is one of the accessories of the plate heat exchanger in a district heating system, was performed. The flow plate is made of 316 stainless steel, and water at different temperatures in the flow plate exchanges heat in a non-contact manner. The flow plate samples in which water mixing issues occurred were collected. Corrosion-induced pits, oxides, and contaminants were observed at locations where two plates are regularly in contact. The EDS analysis of the surface oxides and contaminants revealed that they were composed of carbon, silicon, and magnesium, which came from chemical adhesives. The IC/ICP analyses showed that the concentration of chloride ions was 30 ~ 40 ppm, which was not sufficient to cause corrosion of stainless steel. In the crevice, a local decrease in dissolved oxygen occurs along with an increase in chloride ions, thus forming an acidic environment. These environments destroyed the passive film of stainless steel, resulting in pits. Moreover, contaminants formed a narrower gap between the two metal plates and inhibited the diffusion of ions, thereby accelerating crevice corrosion.

• Membrane Journal
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• v.33 no.4
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• pp.201-210
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• 2023

Dust filter membranes play a crucial role in human life and various industries, as they contribute to several important aspects of human health, safety, and environmental protection. This study presents the development of a polysulfone@polyphenylene sulfide/polytetrafluoroethylene (PSf@PPS/ePTFE) composite dust filter membrane with excellent thermal stability and adhesion properties for high-temperature conditions. FT-IR analysis confirms successful impregnation of PSf adhesive onto PPS fabric and interaction with ePTFE support. FE-SEM images reveal improved fiber interconnection and adhesion with increased PSf concentration. PSf@PPS/ePTFE-5 exhibits the most suitable porous structure. The composite membrane demonstrates exceptional thermal stability up to 400℃. Peel resistance tests show sufficient adhesion for dust filtration, ensuring reliable performance under tough, high-temperature conditions without compromising air permeability. This membrane offers promising potential for industrial applications. Further optimizations and applications can be explored.

• Journal of Fashion Business
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• v.27 no.4
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• pp.125-140
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• 2023

This study aimed to develop a smart wearable device for assessing the risk angle associated with turtle neck syndrome in patients with Video Display Terminal (VDT) syndrome. Turtle neck syndrome, characterized by forward head posture resulting from upper cross syndrome, leads to thoracic kyphosis. In this research, a stretch sensor was used to monitor the progression of turtle neck syndrome, and the sensor data was analyzed using a Universal Testing Machine (UTM) and the Gauge Factor (GF) calculation method. The scapula and cervical spine angles were measured at five stages, with 15-degree increments from 0° to 60°. During the experimental process, the stretch sensor was attached to the thoracic spine in three different lengths: 30mm, 50mm, and 100mm. Among these, the attachment method yielding the most reliable data was determined by measuring with three techniques (General Trim Adhesive, PU film, and Heat Transfer Machine), and clothing using the heat transfer machine was selected. The experimental results confirmed that the most significant change in thoracic kyphosis occurred at approximately 30° of forward head posture. Prolonged deformity can lead to various issues, highlighting the need for textile sensor solutions. The developed wearable device aims to provide users with real-time feedback on their turtle neck posture and incorporate features that can help prevent or improve the condition.

• Journal of the Korean Wood Science and Technology
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• v.35 no.3
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• pp.36-44
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• 2007

The purpose of this study was to investigate thermal stability, reactivity, and bonding strength of existing epoxy resin mixed with the epoxidized soybean oil (ESBO) in order to use soybean oil economically. In the dry shear test, the marked strengths showed $30.5kgf/cm^2$ at the ratio of ESBO to epoxy resin 9 : 1 and $6.2kgf/cm^2$ at the ratio 8 : 2. The bonding strengths of the others, except mixing ratios 2 : 8 and 1 : 9, exceeded the requirement of Korean plywood standard of $7.0kgf/cm^2$. In the wet shear test, the result was $5.8kgf/cm^2$ at the ratio 9 : 1. There were no thickness swelling and moisture absorption in the water resistance of the film. The value of activation energy, Tg (${\Delta}E$), by DSC analysis showed between $110^{\circ}C$ and $120^{\circ}C$ through all ratios. Epoxy in the epoxy resin fully reacted with the hardener (TETA), but it is difficult to decide that epoxys in the ESBO were reacted directly with the hardener from FT-IR analysis. As the mixing ratio of ESBO increased, the thermal stabilities dropped from TGA analysis. From the comprehensive view on the results of above experiments, it could be confirmed through experiments that the ESBO in the mixed adhesive of epoxy resin/ESBO played a role as an extending agent level of epoxy adhesive, and we were able to know that in order to utilize ESBO as an adhesive, a study should be performed on the condition of hardening, inducible of the hardening reaction.

• Composites Research
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• v.30 no.2
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• pp.138-144
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• 2017

Damage sensing of polymer composite films consisting of poly(dicyclopentadiene) p-DCPD and carbon nanotube (CNT) was studied experimentally. Only up to 1st ring-opening polymerization occurred with the addition of CNT, which made the modified film electrically conductive, while interfering with polymerization. The interfacial adhesion of composite films with varying CNT concentration was evaluated by measuring the wettability using the static contact angle method. 0.5 wt% CNT/p-DCPD was determined to be the optimal condition via electrical dispersion method and tensile test. Dynamic fatigue test was conducted to evaluate the durability of the films by measuring the change in electrical resistance. For the initial three cycles, the change in electrical resistance pattern was similar to the tensile stress-strain curve. The CNT/p-DCPD film was attached to an epoxy matrix to demonstrate its utilization as a sensor for fracture behavior. At the onset of epoxy fracture, electrical resistance showed a drastic increase, which indicated adhesive fracture between sensor and matrix. It leads to prediction of crack and fracture of matrix.