• Elastomers and Composites
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• 제50권2호
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• pp.119-125
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• 2015

Because of their low surface free energy and absence of polar groups at the surface, polyolefins are substrates whose wetting and adhesion are very difficult. Free radical grafting of monomers to backbone polymer is one of the most attractive ways for the chemical modification of polymers. Synthesis of graft copolymer through graft polymerizations of PE and/or PP with phthalic anhydride (PhAn) was made and FTIR spectra of the graft polymer were the examined. And also the effects of phthalic anhydride content on the grafting ratio, thermal properties and contact angle of the graft polymer were examined.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 추계학술대회 초록집
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• pp.53.2-53.2
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• 2010

In this study, we focused on our specialized electrode process for Si back-contact crystalline solar cell. It is different from other well-known back-contact cell process for thermal aspect and specialized process. In general, aluminum makes ohmic contact to the Si wafer and acts as a back surface reflector. And, silver is used for low series resistance metal grid lines. Aluminum was sputtered onto back side of wafer. Next, silver is directly patterned on the wafer by screen printing. The sputtered aluminum was removed by wet etching process after rear silver electrode was formed. In this process, the silver paste must have good printability, electrical property and adhesion strength, before and after the aluminum etching process. Silver paste also needs low temperature firing characteristics to reduce the thermal budget. So it was seriously collected by the products of several company of regarding low temperature firing (below $250^{\circ}C$) and aluminum etching endurance. First of all, silver pastes for etching selectivity were selected to evaluate as low temperature firing condition, electrical properties and adhesive strength. Using the nano- and micron-sized silver paste, so called hybrid type, made low temperature firing. So we could minimize the thermal budget in metallization process. Also the adhesion property greatly depended on the composition of paste, especially added resin and inorganic additives. In this paper, we will show that the metallization process of back-contact solar cell was realized as optimized nano-paste characteristics.

• 마이크로전자및패키징학회지
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• 제22권3호
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• pp.39-44
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• 2015

이방성 전도접착제를 이용하여 Cu/Au 칩 범프를 Cu 기판 배선에 플립칩 실장한 접속부에 대해 CNT-Ag 복합패드가 접속저항에 미치는 영향을 연구하였다. CNT-Ag 복합패드가 내재된 플립칩 접속부가 CNT-Ag 복합패드가 없는 접속부에 비해 더 낮은 접속저항을 나타내었다. 각기 25 MPa, 50 MPa 및 100 MPa의 본딩압력에서 CNT-Ag 복합패드가 내재된 접속부는 $164m{\Omega}$, $141m{\Omega}$ 및 $132m{\Omega}$의 평균 접속저항을 나타내었으며, CNT-Ag 복합패드를 형성하지 않은 접속부는 $200m{\Omega}$, $150m{\Omega}$ 및 $140m{\Omega}$의 평균 접속저항을 나타내었다.

• 대한기계학회논문집A
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• 제25권12호
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• pp.1981-1987
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• 2001

This paper documents the effect of surface treatment of aluminum on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. The optimal treatment condition of the aluminum was determined by measuring the contact angle and T-peel strength as functions of mixture ratio of acetylene gas to nitrogen gas. The mixture ratios used were 1:9, 3:7, 5:5, 7:3, and 9:1 Lap shear tests and T-peel tests were performed using surface-treated alumiunm/CFRP composites and regular alumiunm/CFRP composites. The results showed that the contact angle was minimized and the T-peel strength was maximized iota the mixture ratio of 5:5. The results also showed that the shear strength of surface-treated alumiunm/CFRP composites was 34% greater than that of regular alumiunm/CFRP composites. The T-peel strength of surface-treated alumiunm/CFRP composites was also 5 times greater than that of regular alumiunm/CFRP composites.

• 한국염색가공학회지
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• 제16권5호
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• pp.28-34
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• 2004

The polarizing film application exploits the unique physicochemical properties between PVA(Poly vinyl alcohol) film and CTA(Cellulose triacetate) film. However, hardly any research was aimed at improving the adhesion characteristics of the CTA film by radio frequency(RF) plasma treatment at argon(Ar) gaseous state. In this report, we deal with surface treatment technology for protective CTA film developed specifically for high adhesion applications. After Ar plasma, surface of the films is analyzed by atomic force microscopy(AFM), roughness parameter and peel strength. Furthermore, the wetting properties of the CTA film were studied by contact angle analysis. Results obtained for CTA films treated with a glow discharge showed that this technique is sensitive to newly created physical functions. The roughness and peel strength value increased with an increase in treatment time for initial treatment, but showed decreasing trend for continuous treatment time. The result of contact angle measurement refer that the hydrophilicity of surface was increased. AFM studies indicated that no considerable change of surface morphology occurred up to 3 minutes of treatment time, but a considerable uneven of surface structure resulted from treating time after 5 minutes.

• 접착 및 계면
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• 제4권4호
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• pp.7-14
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• 2003

택(tack)은 아주 가벼운 힘으로 단시간에 피착체와 점착하는 능력이다. 택의 측정기기 중 프로브택(probe tack)은 실험적인 영향인자를 설정할 수 있기에 택의 이론적 고찰이 유리하다. SIS계 핫멜트형 점착제(SIS-based hotmelt PSA)와 수분산성 아크릴 점착제(Water-borne acrylic PSA)를 사용하여 probe가 점착제 표면에 다가가는 속도가 택에 미치는 영향을 살펴보았다.

• 마이크로전자및패키징학회지
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• 제13권2호
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• pp.21-26
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• 2006

NCA의 물성이 미세피치 Chip on glass (COG) 접합부의 신뢰성에 미치는 영향을 연구하였다. Si 위에 Sn을, 유리기판 위에 In을 열증발 방법으로 증착하고 lift-off 방법을 이용하여 $30{\mu}m$ 피치를 가지는 솔더범프를 형성하였으며 열압착 방법으로 $120^{\circ}C$에서 In 범프와 Sn 범프를 접합하였다. 접합할 때 세 종류의 Non conductive adhesive (NCA)를 적용하였다. 신뢰성은 $0^{\circ}C$와 $100^{\circ}C$ 사이로 열충격시험을 2000회까지 실시하여 평가하였다. 4단자 저항측정법을 이용하여 접합부의 저항을 측정하였다. 필러의 양이 증가할수록 열충격시험 후 접합부의 저항이 가장 적게 증가하여 신뢰성이 우수하였다. 필러의 양이 증가할수록 NCA의 열팽창이 작아지기 때문이다.

• 한국재료학회지
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• 제8권12호
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• pp.1138-1145
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• 1998

Ni계 경면합금인 Deloro 50의 마모거동을 15ksi와 30ksi 접촉응력하의 여러 마모조건에서 조사하였다. 상온대기중에서 Deloro 50는 15ksi 응력에서도 극심한 응착마모가 발생하는 매우 낮은 마모저항성을 보였는데 이는 fcc 결정구조를 갖는 Deloro 50 기지상의 경도와 가공경화율이 strain-induced 상변태를 이웅한 hcp 결정구조의 Stellite 6보다 낮기 때문으로 생각된다. 상온 수중에서 Deloro 50는 15ksi 응력에서 Stellite 6와 비슷한 마모저항성을 보였는데 이는 물이 미세요철간의 금속간 접촉을 억제하였기 때문으로 생각된다. 그러나, 30ksi의 높은 접촉응력에서는 상온 대기중길 같은 응착마모가 발생하는 것으로 보아, 30ksi의 높은 응력에서는 물의 응착마모 억제 효과가 없었기 때문으로 생각된다. $300^{\circ}C$ 대기중에서 Deloro 50는 30ksi의 높은 접촉응력에서도 Stellite 6보다 우수한 마모저항성을 보였는데 이는 고온에서 마모시 생성되는 복합산화물층이 효과적으로 금속간 접촉을 방해하여 응착마모를 억제하였기 때문으로 생각된다.

• Journal of Mechanical Science and Technology
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• 제16권10호
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• pp.1222-1228
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• 2002

This research is the development of a flexible tactile sensor array for service robots using PVDF (polyvinylidene fluoride) film for the detection of a contact state in real time. The prototype of the tactile sensor which has 8${\times}$8 array using PVDF film was fabricated. In the fabrication procedure, the electrode patterns and the common electrode of the thin conductive tape were attached to both sides of the 281$\mu\textrm{m}$ thickness PVDF film using conductive adhesive. The sensor was covered with polyester film for insulation and attached to the rubber base for a stable structure. The proposed fabrication method is simple and easy to make the sensor. The sensor has the advantages in the implementing for practical applications because its structure is flexible and the shape of the each tactile element can be designed arbitrarily. The signals of a contact force to the tactile sensor were sensed and processed in the DSP system in which the signals are digitized and filtered. Finally, the signals were integrated for taking the force profile. The processed signals of the output of the sensor were visualized in a personal computer, and the shape and force distribution of the contact object were obtained. The reasonable performance for the detection of the contact state was verified through the sensing examples.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.17-23
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• 2013

신축성 전자패키징 기술개발을 위한 기초연구로서 Cu/Sn 범프에 CNT-Ag 복합패드를 형성한 칩을 이방성 전도접착제를 사용하여 플립칩 본딩한 후, CNT-Ag 복합패드의 유무 및 본딩압력에 따른 플립칩 접속부의 접속저항을 측정하였다. CNT-Ag 복합패드가 형성된 Cu/Sn 칩 범프를 25MPa과 50MPa의 본딩압력으로 플립칩 본딩한 시편들은 접속저항이 너무 높아 측정이 안되었으며, 100MPa의 본딩압력으로 플립칩 본딩한 시편은 $213m{\Omega}$의 평균 접속저항을 나타내었다. 이에 비해 CNT-Ag 복합패드가 없는 Cu/Sn 칩 범프를 사용하여 25MPa, 50 MPa 및 100 MPa의 본딩압력으로 플립칩 본딩한 시편은 각기 $1370m{\Omega}$, $372m{\Omega}$ 및 $112m{\Omega}$의 평균 접속저항을 나타내었다.