• Korean Journal of Materials Research
• /
• v.20 no.6
• /
• pp.319-325
• /
• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Journal of Electrochemical Science and Technology
• /
• v.13 no.2
• /
• pp.227-236
• /
• 2022

The microblade cutting method, so-called SAICAS, is widely used to quantify the adhesion of battery composite electrodes at different depths. However, as the electrode thickness or loading increases, the reliability of adhesion values measured by the conventional method is being called into question more frequently. Thus, herein, a few underestimated parameters, such as friction, deformation energy, side-area effect, and actual peeing area, are carefully revisited with ultrathick composite electrodes of 135 ㎛ (6 mAh cm^-2). Among them, the existence of side areas and the change in actual peeling area are found to have a significant influence on measured horizontal forces. Thus, especially for ultrahigh electrodes, we can devise a new SAICAS measurement standard: 1) the side-area should be precut and 2) the same actual peeling area must be secured for obtaining reliable adhesion at different depths. This guideline will practically help design more robust composite electrodes for high-energy-density batteries.

• Journal of Welding and Joining
• /
• v.18 no.2
• /
• pp.222-222
• /
• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
• /
• v.18 no.2
• /
• pp.95-99
• /
• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• Corrosion Science and Technology
• /
• v.13 no.5
• /
• pp.186-194
• /
• 2014

Establishment of adhesion strength measurement procedure for marine epoxy coatings was conducted in order to ensure reliability of the test results. It was found that (1) the increase in thickness of the substrates would induce increase of pull-off strength. Especially, the increase in adhesion strength with the substrate thickness increment was attributed to the transition of stress mode to the pure tensile mode excluding bending effect. (2) The longer curing time, the higher pull-off strength. It may be due to higher cross-linking density of the coating (3) The pull-off strength increases as coating thickness increases due to the diminishment of bending effect (4) The longer drying time after water immersion, the higher pull-off strength. It may be due to the evaporation of water molecule at the coating-substrate interface.

• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.29A no.9
• /
• pp.15-19
• /
• 1992

Tungsten silicied (WSix) has been widely used for interconnection line to improve the speed and reliability of devices. It is known that WSix formed by silane reduction has poor step coverage and poor adhesion. In this research, WSix by dichlorosilane reduction showed excellent adhesion in cellophane adhesive tape test, and improved step coverage by two times. The crystal structure of the as-deposited WSix film by silane reduction was transformed from the hexagonal to the tetragonal structure during annealing treatment, while that by dichlorosilane reduction kept the stable tetragonal structure. The fluorine concentration in the WSix film by dichlorosilane was lower than that by silane.

• Journal of the Korean Ceramic Society
• /
• v.41 no.10 s.269
• /
• pp.728-734
• /
• 2004

The effect of microstructure of WC-Co substrates which have different WC grain sizes from submicron to 5 $\mu$m on the diamond-substrate adhesion strength was investigated. The substrates were pre-treated by two methods : chemical etching with Murakami's solution and subsequently with $H_2SO_4$, and thermal heat-treatment. The adhesion strength was estimated by degree of peeling after Rockwell indentation. Diamond films of 20 $\mu$m thickness deposited on the heat-treated substrates showed an excellent adhesion strength at the load of 100 kg, which ascribed to the large and elongated WC grains. However, the cutting edge of insert was deformed after heat treatment and the surface morphology of heat treated substrate strongly affected on the surface roughness of the deposited diamond films. On the contrary, the diamond film of 10 $\mu$m in thickness on the chemically etched substrates of average WC grain size over 2 $\mu$m showed good adhesion strength enough not to peel-off under a load of 60 kg. Especially, the substrate of average WC grain size over 5 $\mu$m exhibited much improved reliability of adhesion comparing with the substrate of average grain size under 2 $\mu$m. No substrate deformation was observed in this case after the chemical etching, which is more advantageous and more practical in terms of precious machining than the heat treatment case.

• Elastomers and Composites
• /
• v.40 no.3
• /
• pp.166-173
• /
• 2005

Effect of thermal aging on the weight loss and water absorption of epoxy adhesives was investigated in the presence of three types of different hardeners, such as D-230, G-5022, and HN-2200. Thermal and mechanical properties of the cured epoxy resins were also studied througth the glass transition temperature and shear adhesion strength measurements. Weight losses of DGEBA/D-230 and DGEBA/HN- 2200 systems were not varied. However, the weight of DGEBA/G-5022 system was significantly decreased with increasing the thermal aging time. The water absorption of the specimens was increased as the thermal aging time increased except that using G-5022. DEGBA/HN-2200 system showed higher $T_g$ value than those of other systems, due to the formation of the fine three-dimensional network structure containing aliphatic ring. Shear adhesion strength of all systems was increased with increasing the thermal aging tine, which is attributed to increased degree of cure and fine three-dimensional network structure formation. And $T_g$ values and shear adhesion strength of all specimens exposed to water was decreased as the immersion time increased.

• Journal of Adhesion and Interface
• /
• v.10 no.3
• /
• pp.127-133
• /
• 2009

Acrylic pressure sensitive adhesives (PSAs) are used in various field of high-technology industries such as semiconductor, display, mobile, automobile, and so on. Because of they have high durabilities and can be easily introduced functional groups in their molecular structures. PSA perfomances has an effect on their applications in industry process operation, reliability of final products. In this study, PSA performances as a function of fim thickness which is one of the impact factors effects on PSA performances will be investigated using combinatorial methods. Acrylic PSAs are synthesized using 2-ethylhexyl acrylate and acrylic acid. Thickness-gradient of acrylic PSA sample is made by a micro applicator. We compare general coating method with thickness-gradient coating method and evaluate the reappearance of combinatorial methods compared with existing coating method. Thickness-gradient of acrylic PSA sample shows rough and broad data tendency.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.2
• /
• pp.7-15
• /
• 2008

In this paper, the Chip-On-Flex (COF) assembly process using anisotropic conductive films (ACFs) was investigated and the reliability of COF assemblies using ACFs was evaluated. Thermo-mechanical properties of ACFs such as coefficient of thermal expansion (CTE), storage modulus (E'), and glass transition temperature $(T_g)$ were measured to investigate the effects of ACF material properties on the reliability of COF assemblies using ACFs. In addition, the bonding conditions for COF assemblies using ACFs such as time, temperature, and pressure were optimized. After the COF assemblies using ACFs were fabricated with optimized bonding conditions, reliability tests were then carried out. According to the reliability test results, COF assemblies using the ACF which had lower CTE and higher $T_g$ showed better thermal cycling reliability. Consequently, thermo-mechanical properties of ACFs, especially $T_g$, should be improved for high thermal cycling reliability of COF assemblies using ACFs for compact camera module (CCM) applications.