• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2022년도 가을 학술논문 발표대회
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• pp.83-84
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• 2022

Zero-energy construction is being emphasized due to environmental pollution. However, in the case of external insulation using organic insulation with good insulation performance, there are many studies on inorganic insulation as it shows limitations on fire stability. In addition, as the demand for stone for exterior walls increases, Cellular Light -weight Concrete(CLC) with polymer is used to supplement fire stability and insulation performance, and the construction of stone is complemented by combining organic insulation, inorganic insulation, and stone. In this study, the compressive strength and adhesion in tension of CLC are studied. As a result of the experiment, the compressive strength of 28 days according to the polymer addition rate did not change. The adhesion in tension according to the polymer addition rate tends to increase as the addition rate increases. The target adhesion in tension is 0.8 MPa, but the maximum value of the experiment did not reach the target value, and further research was needed to combine to maintain the density and improve the adhesion in tension.

• 마이크로전자및패키징학회지
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• 제18권4호
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• pp.11-18
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• 2011

3차원 칩 적층 접합에 사용하기 위한 Cu-Cu 금속 저온 접합 공정을 위하여 접합 온도 및 플라즈마 표면 전처리에 따른 열 압착 접합을 수행 하였다. 4점굽힘시험과 CCD 카메라를 이용하여 Cu 접합부의 정량적인 계면접착에너지를 평가하였다. 접합 온도 $250^{\circ}C$, $300^{\circ}C$, $350^{\circ}C$에서 각각 $1.38{\pm}1.06$(상한값), $7.91{\pm}0.27$(하한값), $10.36{\pm}1.01$(하한값) $J/m^2$으로 접합온도 $300^{\circ}C$ 이상에서 계면접착에너지 5 $J/m^2$ 이상의 값을 얻었다. 접합 온도 $300^{\circ}C$ 이하 낮은 온도에서 접합하기 위해 Cu-Cu 열 압착 접합 전 Ar+$H_2$ 플라즈마로 $200^{\circ}C$에서 2분간 표면 전처리 후 $250^{\circ}C$ 조건에서 열 압착 접합할 경우 계면접착에너지 값이 $6.59${\pm}0.03$(하한값) $J/m^2$로 표면 전 처리하지 않은 시험편에 비해 접합 특성이 크게 증가 하였다.

• Advances in aircraft and spacecraft science
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• 제1권1호
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• pp.1-14
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• 2014

Physico-chemical changes of the plasma modified titanium alloy [Ti-6Al-4V] surface were studied with respect to their crystallographic changes by X-Ray Diffraction (XRD) and Scanning Electron Microscope (SEM).The plasma-treatment of surface was carried out to enhance adhesion of high performance nano reinforced epoxy adhesive, a phenomenon that was manifested in subsequent experimental results. The enhancement of adhesion as a consequence of improved spreading and wetting on metal surface was studied by contact angle (sessile drop method) and surface energy determination, which shows a distinct increase in polar component of surface energy. The synergism in bond strength was established by analyzing the lap-shear strength of titanium laminate. The extent of enhancement in thermal stability of the dispersed nanosilica particles reinforced epoxy adhesive was studied by Thermo Gravimetric Analysis (TGA), which shows an increase in onset of degradation and high amount of residuals at the high temperature range under study. The fractured surfaces of the joint were examined by Scanning electron microscope (SEM).

• 한국전기전자재료학회논문지
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• 제19권2호
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• pp.153-157
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• 2006

In this work, the effects of plasma treatment on surface properties of semiconductive silicone rubber were investigated in terms of X-ray photoelectron spectroscopy (XPS) and contact angles, The adhesion characteristics of semiconductive-insulating interface layer of silicone rubber were studied by measuring the T-peel strengths, The results of the chemical analysis showed that C-H bonds were broken due to plasma discharge and Silica-like bonds(SiOx, x=3${\~}$4) increased, It is thought that semiconductive silicone rubber surfaces treated with plasma discharge led to an increase in oxygen-containing functional groups, resulting in improving the degree of adhesion of the semiconductive-insulating interface layer of silicone rubber. However, the oxygen plama for 20 minute produces a damaged oxidized semiconductive silicone rubber layer, which acts as a weak layer producing a decrease in T-peel strength, These results are probably due to the modifications of surface functional groups or polar component of surface free energy of the semiconductive silicone rubber.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.1080-1083
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• 2002

In this paper, we have studied with regard to the use of lasers for modifying the surface properties of silicon in order to improve it's wettability and adhesion characteristics. Using an Nd:YAG pulse laser, the wettability and adhesion characteristics of silicon surface have been developed by an Nd:YAG pulse laser. It was found that the laser treatment of silicon surfaces modified the surface energy. In the result of wetting experiments, by the sessile drop technique using the distilled water, wetting characteristic of silicon after the laser irradiation shows a decreased value of the contact angle. In case of the laser treated silicon surface, laser direct writing of copper lines has been achieved by pyrolytic decomposition of copper formate films$(Cu(HCOO)_2{\cdot}4H_2Q)$, using a focused $Ar^+$ laser beam$(\lambda=514.5nm)$ on the silicon substrates. The deposited patterns were measured by energy dispersive X-ray(EDX), Scanning Electron Microscopy(SEM) and surface profiler($\alpha$-step) to examine the cross section of deposited copper lines and linewidth.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.83-86
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• 2005

In this study, SAM (self-assembled monolayer) was applied as an anti-adhesion layer in the nano molding process, to reduce the surface energy between the nano-stamper and the moldeded polymeric nano patterns. Before depositing SAM on the stamper, the nickel stamper was pretreated to remove oxide on the nickel stamper surface. Then, using the solution deposition method, alkanethiol SAM as an anti-adhesion layer was deposited on nickel surface. To examine the effectiveness of the SAM deposition on the metallic nano stamper, the contact angle and the lateral friction force were measured at the actual processing temperature and pressure for the case of nano compression molding and at the actual UV dose for the case of nano UV molding. The surface energy due to SAM deposition on the nickel nano stamper markedly decreased and the high hydrophobic quality of SAM on the nickel stamper maintained under the actual molding environments.

• Elastomers and Composites
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• 제37권1호
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• pp.49-56
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• 2002

UV 조사시간과 오존유량을 변화시키면서 폴리프로필렌을 UV/오존 산화하였으며 이의 표면특성을 접촉각과 XPS를 이용하여 살펴보았다. 산화된 표면의 노화거동을 공기, 물, 에틸렌 글리콜 하에서 살펴보았으며, 또한 lap shear 실험을 통하여 접착력을 관찰하였다. 극성표면 에너지와 접착력은 UV/오존 처리시간과 오존유량이 증가함에 따라 증가함을 알 수 있었다. 물에서 노화실험을 한 경우 극성표면 에너지의 변화가 없었으나, 공기 하에서 실시한 경우 2-3일 이내에 급격히 감소하여 처리하지 않은 폴리프로필렌의 값에 근접하였다.

• 한국세라믹학회지
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• 제41권6호
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• pp.430-434
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• 2004

The values of fracture energy and mechanical flexural strength of Fiber Reinforced Cement (FRC) with polypropylene (PP) fiber modified by Ion Assisted Reaction (JAR), by which functional groups were grafted on the surface of PP fiber, was improved about 2 times as those of fracture energy and flexural strength of cement reinforced by untreated PP fiber. PP fiber was irradiated in O$_2$ environment by Ar$\^$+/ ion. The contact angle of PP treated by IAR decreased largely when compared with untreated PP. From this result, we expected that surface energy and interfacial adhesion force of treated PP fiber increased. The strain hardening occurred in the strain-stress curve of FRC including PP treated by IAR when compared with that of FRC with untreated PP. These enhanced mechanical properties might be due to strong interaction between hydrophilic group on modified PP fiber and hydroxyl group in cement matrix. This hydrophilic group on surface modified PP fiber was confirmed by XPS analysis. We clearly observed hydration products that were fixed at modified PP fiber due to the strong adhesion force of interface in cement reinforced modified PP by SEM (Scanning Electron Microscopy) study.

• 폴리머
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• 제34권6호
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• pp.560-564
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• 2010

LCD에 사용되는 편광판 제조 시, 치수안정성 및 내습성 향상을 위한 트리아세틸셀룰로오스(TAC) 필름 접착에 적용되는 폴리(비닐 알코올)(PVA) 접착제의 가수화도 및 분자량이 편광판 치수안정성에 미치는 영향을 살펴보았다. TAC 필름과 PVA 편광판의 접착력은 접착제의 탈아세틸화가 70%에서 최대가 되며 PVA 분자량은 가수화도가 70% 이하에서는 접착력에 영향을 미치지 않는 반면 70% 이상에서는 아세틸화에 의한 분자량 감소가 접착력에 영향을 줌을 알 수 있다. 편광판의 치수안정성은 분자량이 낮은 접착제를 사용할 경우 안정적이며 필름과 편광판의 접착력보다는 접착제의 가수화도에 더 의존적임을 확인할 수 있었다.

• Elastomers and Composites
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• 제48권3호
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• pp.190-194
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• 2013

본 연구에서는 피마자유 유래의 sebacic acid를 isophthalic acid 및 glycol과 병용하여 폴리에스터 폴리올을 중합하고 이어서 폴리우레탄 접착제를 제조하였다. 접착력을 측정한 결과에서 sebacic acid를 병용한 폴리올이 adipic acid를 사용한 폴리올 보다 응집에너지가 커서 접착력이 우수하게 나타났고, glycol은 선형구조 보다 메틸기를 포함하는 가지구조가 더 좋은 접착력을 보였다. 쇄연장제는 1,4-butane diol(BD)를 사용한 것이 가장 접착력이 좋게 나타났다. 또한 TGA 측정결과 내열성은 BD가 가장 높고, 1,2-propylene glycol(PG)가 다음, ethylene glycol(EG)가 가장 낮았다. DMA 측정에서 유리전이온도는 PG, EG, BD의 순서로 높게 나타났다.