• Composites Research
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• v.35 no.2
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• pp.80-85
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• 2022

This work presents an experiment study to evaluate the nanoparticle adhesion and surface hydrophobicity characteristics of Teflon-polyurethane top coat depending on the number of multi-wall carbon nanotube (MWCNT) coatings, which is a carbon-based hydrophobic particle. In order to measure the adhesion between the nanoparticles and the top coat, adhesion pull-off test was performed with different MWCNT oxidation times. Static contact angle and roughness measurements were carried out to characterize the surface hydrophobic behavior. Through the roughness evaluation, it was confirmed that the carbon nanotubes were wetted in the Teflon-polyurethane top coat, and the degree carbon nanotube wetting was confirmed through a USB-microscope. As a result, it was found that the larger the degree of wetting, the better the adhesion. From the experimental results, as the hydrophobicity of Teflon-polyurethane increased, the adhesive propertydecreased with the number of coatings. It was possible to improve the adhesive force and determine the number of coatings of carbon nanotubes with optimized hydrophobicity.

• Journal of Adhesion and Interface
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• v.23 no.3
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• pp.59-69
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• 2022

In composite materials, the adhesion and interfacial properties were the most important factors to obtain high performance of mechanical properties. This review paper had been focused on the micromechanical evaluation methods for the interfacial property historically. The interfacial property of fiber-reinforced composites (FRC) could be evaluated using only a single fiber and matrix via various micromechanical testing methods. Self-sensing due to the fracture behavior of FRC could be determined and discussed more critically and clearly using electro-micromechanical evaluation. In this paper, the research trends for micro-mechanical evaluation of composites was summarized, and their practical applications would be suggested in the future.

• Journal of Adhesion and Interface
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• v.10 no.3
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• pp.134-140
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• 2009

The acrylic copolymers with variation in side chain were synthesized based on molecular design. Wettability and adhesion properties on the wafer surface were investigated for these acrylic copolymer pressure sensitive adhesives. Three-dimensional networks of linear acrylic copolymers were produced with epoxy-type Tetra-DX cross-linking agent. The effect of cross-linking on adhesion characteristics was investigated. The side chain of acrylic copolymer played more important role in wettability than the interfacial interaction. As the degree of cross-linking increased, both probe tack and peel strength decreased. Also, heat resistance measured by SAFT increased with cross-linking; however, it showed the deterioration when excess cross-linking agent was added.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• Journal of Adhesion and Interface
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• v.21 no.2
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• pp.65-70
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• 2020

Epoxy adhesive was mainly used to combine different composite materials. Epoxy adhesive was a typical thermosetting resin that can be bonded by changing from a linear structure to a three-dimensional network structure by curing reaction of epoxy and hardener. The curing conditions of epoxy adhesive were different with different types of hardener such as mixing ratio, curing time, and temperature. These curing conditions affected to the adhesive property of epoxy adhesive. In industry, it was difficult to proceed the applying epoxy adhesive and combining two parts immediately. The adhesive property decreased by humidity and pre-curing of epoxy adhesive in waiting time between two processes. In this paper, the glass fiber reinforced composite (GFRC) was combined with epoxy adhesive and adhesion property between epoxy adhesive and GFRCs was evaluated using single lap shear test. The different waiting times and humidity conditions were applied to epoxy adhesive in room temperature and adhesive property decreased as the waiting time increased. In small amount of humidity, the adhesive property increased because a small amount of moisture in the surroundings accelerated the curing reaction. In certain amount of humidity, however, the adhesion property decreased.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.7-12
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• 2018

The effects of Ru deposition temperature and post-annealing conditions on the interfacial adhesion energies of atomic layer deposited (ALD) Ru diffusion barrier layer and Cu thin films for the advanced Cu interconnects applications were systematically investigated. The initial interfacial adhesion energies were 8.55, 9.37, $8.96J/m^2$ for the sample deposited at 225, 270, and $310^{\circ}C$, respectively, which are closely related to the similar microstructures and resistivities of Ru films for ALD Ru deposition temperature variations. And the interfacial adhesion energies showed the relatively stable high values over $7.59J/m^2$ until 250h during post-annealing at $200^{\circ}C$, while dramatically decreased to $1.40J/m^2$ after 500 h. The X-ray photoelectron spectroscopy Cu 2p peak separation analysis showed that there exists good correlation between the interfacial adhesion energy and the interfacial CuO formation. Therefore, ALD Ru seems to be a promising diffusion barrier candidate with reliable interfacial reliability for advanced Cu interconnects.

• Journal of Adhesion and Interface
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• v.4 no.4
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• pp.1-6
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• 2003

After atmospheric pressure plasma treatment of polypropylene(PP) film surface, we measured the contact angle of the surface by using polar solvent (water) and non-polar solvent (diiodomethane). We also calculated the surface free energy of PP film by using the measured values of contact angles. And then we analyzed contact angle and surface free energy with changing the condition of atmospheric pressure plasma treatment. Upon each condition of atmospheric plasma treatment, contact angle and surface free energy showed an optimum value or leveled off.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1744-1748
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• 2007

In this study, the Johnson-Kendall-Roberts (JKR) theory was combined with the instrumented indentation technique (IIT) to evaluate work of adhesion and modulus of elastomeric polymer. Indentation test was used to obtain the load-displacement data for contacts between Tungsten Carbide indenter and elastomeric polymer. And the JKR contact model, contrived to take viscoelastic effects of polymer into account, was applied to compensate the contact area and the elastic modulus which Hertzian contact model would underestimate and overestimate, respectively. Besides, we could obtain the thermodynamic work of adhesion by considering the surface energy in this contact model. In order to define the relation between JKR contact area and applied load without optical measuring of contact area, we used the relation between applied load and contact stiffness by examining the correlation between JKR contact area and stiffness through dimensional analysis with 14 kinds of elastomeric polymer. From this work, it could be demonstrated that the interfacial work of adhesion and elastic modulus of compliant polymer can be obtained from a simple instrumented indentation testing without area measurement, and provided as the main algorithm of compliant polymer characterization.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.