• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5541-5549
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• 2015

This paper introduces a safer and more power efficient heater by using induction heating, to apply to the semiconductor wafer fabrication exhaust gas cleaning system. The exhaust gas cleaning system is currently made with filament heater that generates an endothermic reaction of N2 gas for the removal of moisture. Induction theory, through the bases of theoretical optimization and electronic implementation, is applied in the design of the induction heater specifically for the semiconductor wafer exhaust system. The new induction heating design provides a solution to the issues with the current energy inefficient, unreliable, and unsafe design. A robust and calibrated design of the induction heater is used to optimize the energy consumption. Optimization is based on the calibrated ZVS induction circuit design specified by the resonant frequency of the exhaust pipe. The fail-safe energy limiter embedded in the system uses a voltage regulator through the feedback of the MOSFET control, which allows the system performance to operate within the specification of the N2 Heater unit. A specification and performance comparison from current conventional filament heater is made with the calibrated induction heater design for numerical analysis and the proof of a better design.

• Journal of Korea Water Resources Association
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• v.50 no.1
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• pp.55-64
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• 2017

This study presents a numerical model for simulating turbidity currents using the ULTIMATE scheme. For this, the layer-averaged model is used. The model is applied to laboratory experiments, where the flume is composed of sloping and flat parts, and the characteristics of propagating turbidity currents are investigated. Due to the universal limiter of the ULTIMATE scheme, the frontal part of the turbidity currents at a sharp gradient without numerical oscillations is computed. Simulated turbidity currents propagate super-critically to the end of the flume, and internal hydraulic jumps occur at the break-in-slope after being affected by the downstream boundary. It is found that the hydraulic jumps are computed without numerical oscillations if Courant number is less than 1. In addition, factors that affect propagation velocity of turbidity currents is studied. The particle size less than $9{\mu}m$ does not affect propagation velocity but the buoyancy flux affects clearly. Finally, it is found that the numerical model computes the bed elevation change due to turbidity currents properly. Specifically, a discontinuity in the bed elevation, arisen from the hydraulic jumps and resulting difference in sediment entrainment, is observed.

• Progress in Superconductivity
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• v.7 no.1
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• pp.97-101
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• 2005

Bi-22l2 tubes for fault current limiter (FCL) were fabricated by centrifugal melting process. $SrSO_4$ ($10\;wt.\;\%$) was added to Bi-2212 powder to lower the melting point of Bi-22l2 and to improve the mechanical properties. The BSCCO powder was completely melted at $1300\;^{\circ}C$ using the RF furnace and then poured into rotating steel mold. The steel mold, preheated at $450\;{\circ}C{\sim}550^{\circ}C$ for 2 hour was rotated at $1020{\sim}2520\;RPM$. The solidified BSCCO tube was cooled down to room temperature in the furnace for 48 hours and separated from the mold between Bi-2212 and the mold. $ZrO_2$ solution was used to separate it easily from the mold and Ag tape was attached in the mold inner wall of the mold to analysis electrical property. Bi-22l2 tube was often cracked when the cooling rate was high. BSCCO tubes with $70{\Phi}{\times}100\;mm,\;50{\Phi}{\times}100\;mm$ and $30{\Phi}{\times}150\;mm$ size were fabricated by centrifugal melting process. The $J_{c}s$ of tubes with $50{\Phi}{\times}100\;mm{\times}4.0\;t$ and $50{\Phi}{\times}100\;mm{\times}4.l\;t$ were 178 and $74.2\;A/cm^2$ at 77K, respectively. The processing condition for Bi-2212 tube fabrication was investigated using XRD and SEM analyses.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.100-101
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• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.