• Journal of the Korean Ceramic Society
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• v.39 no.5
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• pp.511-516
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• 2002

Hexagonal $YMnO_3$ thin films were prepared from $Y(NO_3)_3{\cdot}5H_2O$ and $Mn(CH_3CO_2)_2{\cdot}4H_2O$ as starting materials on the Si(100) substrates by the sol-gel method. The crystal structure and the electrical properties of the $YMnO_3$ thin films were investigated as a function of heat treatment temperature, the amount of water(Rw) of hydrolysis and the addition of catalysis. The crystallization of the $YMnO_3$ thin film began at 700${\circ}C$ and completed at 800${\circ}C$ for 1 h. The c-axis (0001) preferred orientation of hexagonal $YMnO_3$ was detected for the $YMnO_3$ thin films with Rw=6 and that was decreased for the $YMnO_3$ thin films with Rw=1 and Rw=12. The crystallinity and preferred orientation of the $YMnO_3$ thin films were depended on the addition of acid and/or alkali catalysis, which, in turn, the preferred orientation of c-axis was decreased and the orthorhombic phase of $YMnO_3$ was detected to the specimens with the addition of catalysis. The $YMnO_3$ thin film with Rw=6 showed good leakage current density of $1.2{\times}10-8 A/cm^2$ at the applied voltage of 0.2V and the leakage current density was not changed drastically with applied voltage.

• Journal of the Korean Ceramic Society
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• v.38 no.5
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• pp.474-478
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• 2001

유기 화학 기상 증착법(MOCVD)을 이용하여 반응기체 $O_2$의 양 및 Y와 Mn의 운반기체 비(Y/Mn)를 변화시켜가며 Si(100) 기판 위에서 MFSFET(metal-ferroelectric-semiconductor field effect transistor) 구조의 YMnO$_3$박막을 증착하였다. 반응기체 $O_2$의 양이 150sccm일 때 Y/Mn=2와 3인 경우 단일상의 육방정계 YMnO$_3$박막이 형성되었다. YMnO$_3$박막의 전기적 특성은 사방정계 YMnO$_3$박막에서는 나타나지 않았으나, 육방정계 YMnO$_3$박막의 경우 결정립 크기에 영향을 받아 단일상의 육방정계 YMnO$_3$박막 중 결정립 크기가 150nm~200nm(Y/Mn=2)인 경우에는 잔류분극이 100nC/$ extrm{cm}^2$인 P-E 이력곡선의 특성을 나타내었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.167-167
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• 2003

Bi가 첨가된 강유전체 YMnO$_3$ (YBM)와 YMnO$_3$을 펄스 레이저 증착법을 이용하여 MgO(111)기판 위에 증착하였다. 증착시 기판온도와 산소분압에 따른 YBM 박막과 YMnO3 박막의 결정성장거동에 대하여 연구하였고, Bi의 첨가량에 따른 YBM 박막의 저온결정성화 효과에 대하여 관찰하였다. YMnO$_3$는 830 $^{\circ}C$이상에서 산소분압이 감소함에 따라서 c축 우선성장 거동을 보였다. 그에 비해 YBM은 700 $^{\circ}C$이상에서 산소분압이 증가함에 따라 c축 우선성장 하는 것을 관찰하였다. 이것은 Bi 첨가효과로 인해 저온결정화와 높은 산소분압에서 c축 우선성장을 하는 것으로 생각된다. Atomic Force Microscopy (AFM)분석과 Secondary Electron Microscopy(SEM)을 통하여 Bi의 첨가량이 증가함에 따라서 표면거칠가 감소하고 grain size가 증가함을 알 수 있었다. Bi의 거동을 살펴 보기 위해 Rutherford Backscattering spectroscopy (RBS)분석을 해보았다. 이 분석을 통해 Bi를 첨가한 YMnO$_3$는 Bi가 표면에 산화물형태로 존재함을 알 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.2
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• pp.93-98
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• 2001

YMnO$_3$ films are excellent gate dielectric materials of ferroelectric random access memories (FRAMs) with MFSFET (metal -ferroelectric-semiconductor field effect transistor) structure because YMnO$_3$ films can be deposited directly on Si substrate and have a relatively low permittivity. Although the patterning of YMnO$_3$ thin films is the requisite for the fabrication of FRAMs, the etch mechanism of YMnO$_3$ thin films has not been reported. In this study, YMnO$_3$thin films were etched with Cl$_2$/Ar gas chemistries in inductively coupled plasma (ICP). The maximum etch rate of YMnO$_3$ film is 285$\AA$/min under Cl$_2$/(Cl$_2$+Ar) of 1.0, RF power of 600 W, dc-bias voltage of -200V, chamber pressure of 15 mTorr and substrate temperature of $25^{\circ}C$. The selectivities of YMnO$_3$ over CeO$_2$ and $Y_2$O$_3$ are 2.85, 1.72, respectively. The selectivities of YMnO$_3$ over PR and Pt are quite low. Chemical reaction in surface of the etched YMnO$_3$ thin films was investigated with X-ray photoelectron spectroscopy (XPS) surface of the selected YMnO$_3$ thin films was investigated with X-ray photoelectron spectroscopy(XPS) and secondary ion mass spectrometry (SIMS). The etch profile was also investigated by scaning electron microscopy(SEM)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.50-53
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• 2002

YMnO$_3$ thin films were spun-coated on the Pt/Ti/SiO$_2$/Si substrates by sol-gel process using alkoxides, and then dried on hot plates from 300 to 450 $^{\circ}C$. The prepared YMnO$_3$ thin films were annealed at 850 $^{\circ}C$ in O$_2$ atmosphere for 1 h. The crystallization of YMnO$_3$ thin films were improved to preferred c-axis orientation and the dielectric characteristics were progressed by increasing the drying temperature. The range of dielectric constant of thin film dried at 450 $^{\circ}C$ is 12.9-22.3 and close to that of YMnO$_3$ single crystal. The ferroelecrtic property of YMnO$_3$ thin film was observed on the YMnO$_3$ films. The maximum remnant polarization (2Pr) of YMnO$_3$ thin films dried at 450 $^{\circ}C$ was about 2.91 ${\mu}$ C/cm2. It was suggested that the drying temperature affect to the initial stage of thin film growth of preferred c-axis orientation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.213-216
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• 2001

Etching behaviors of ferroelectric YMn $O_3$ thin films were studied by an inductively coupled plasma (ICP). Etch characteristic on ferroelectric YMn $O_3$ thin film have been investigated in terms of etch rate, selectivity and etch profile. The maximum etch rate of YMn $O_3$ thin film is 300 $\AA$/min at Ar/C $l_2$ of 2/8, RF power of 800W, dc bias voltage of 200V, chamber pressure of 15mTorr and substrate temperature of 3$0^{\circ}C$. Addition of C $F_4$ gas decrease the etch rate of YMn $O_3$ thin film. From the results of XPS analysis, Y $F_{X}$ compunds were found on the surface of YMn $O_3$ thin film which is etched in Ar/C1/C $F_4$ plasma. The etch profile of YMn $O_3$ film is improved by addition of C $F_4$ gas into the Ar/C $l_2$ plasma. These results suggest that fluoride yttrium acts as a sidewall passivants which reduce the sticking coefficient of chlorine on YMn $O_3$.>.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.429-432
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• 1999

The growth of $\textrm{YMnO}_3$ films directly on Si(100) substrates by RF magnetron sputtering system has been performed. The structural properties of $\textrm{YMnO}_3$ films on Si(100) by rapid thermal annealing(RTA) analysed by XRD(X-ray diffraction). The c-axis oriented $\textrm{YMnO}_3$ peaks were observed deposited in $\textrm{YMnO}_3$/Si(100) structure at RF power of 100W and at a temperature range of $840^{\circ}C$~$870^{\circ}C$ in oxygen ambient.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.755-758
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• 2000

YMnO$_3$films have been deposited with different Rf powers of 60W, 80W, 100W, and 120W. The structural properties of YMnO$_3$films on Si(100) were analysed by XRD(X-ray diffraction). The c-axis oriented peaks of YMnO$_3$were observed deposited in YMnO$_3$/Si(100) structure of RF power at 87$0^{\circ}C$ in oxygen ambient, and the peaks were enlarged by increasing The RF powers. The dielectric constant of the film deposited at 100W and 120W of RF power were about 19, 20 respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.4
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• pp.279-285
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• 2000

High quality crystals of $YMnO_3$, which is interested in non-volatile memory device application, were grown by the floating zone method. Optimum condition for powder synthesis was established to be $1200^{\circ}C$ for 10 hrs and optimum condition for sintering of $YMnO_3$feed-rod was established to be $1500^{\circ}C$ for 10hrs respectively. It was found from non-seeded growth experiment that $YMnO_3$crystal was grown preferentially to the [1010] orientation. The $YMnO_3$single crystal, which was grown to the direction of perpendicular to C-axis, was typically 5mm in diameter, 50 mm in length and showed dark-blue color.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.314-318
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• 2002

The etching behaviors of the ferroelectric $YMnO_3$ thin films were studied by an inductively coupled plasma (ICP). The maximum etch rate of $YMnO_3$ thin film is 300 ${\AA}/min$ at Ar/$Cl_2$of 2/8, RF power of 800W, dc bias voltage of 200V, chamber pressure of 15mTorr and substrate temperature of $30^{\circ}C$. Addition of $CF_4$ gas decrease the etch rate of $YMnO_3$ thin film. From the results of XPS analysis, nonvolatile $YF_x$ compounds were found on the surface of $YMnO_3$ thin film which is etched in Ar/$Cl_2$/CF$_4$plasma. The etch profile of YMnO$_3$film is improved by addition of $CF_4$ gas into the Ar/$Cl_2$ plasma. These results suggest that YF$_{x}$ compound acts as a sidewall passivants which reduce the sticking coefficient of chlorine on $YMnO_3$.