• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.938-941
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• 2000

SrBi$_2$Ta$_2$$O_{9}$(SBT) thin films were etched in Ar/SF$_{6}$ and Ar/CHF$_3$gas plasma using magnetically enhanced inductively coupled plasma(MEICP) system. The etch rates of SBT thin film were 1500$\AA$/min in SF$_{6}$/Ar and 1650 $\AA$/min in Ar/CHF$_3$at a rf power of 600W a dc-bias voltage of -l50V. a chamber pressure of 10 mTorr. In order to examine the chemical reactions on the etched SBT thin film surface , x-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS) were examined. In etching SBT thin film with F-base gas plasma, M(Sr. Bi. Ta)-O bonds are broken by Ar ion bombardment and form SrFand TaF$_2$ by chemical reaction with F. SrF and TaF$_2$are removed more easily by Ar ion bombardmentrdment

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.209-212
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• 2001

Polyimide(PI) films have been considered as the interlayer dielectric materials due to low dielectric constant, low water absorption, high gap-fill and planarization capability. The PI film was etched with using inductively coupled plasma (ICP). The etching characteristics such as etch rate and selectivity were evaluated to gas mixing ratio. High etch rate was 8300$\AA$/min and vertical profile was approximately acquired 90$^{\circ}$ at CF$_4$/(CF$_4$+O$_2$) of 0.2. The selectivies of polyimide to PR and SiO$_2$ were 1.2, 5.9, respectively. The etching profiles of PI films with an aluminum pattern were measured by a scanning electron microscope (SEM). The chemical states on the PI film surface were investigated by x-ray photoelectron spectroscopy (XPS). Radical densities of oxygen and fluorine in different gas mixing ratio of 07CF4 were investigated by optical emission spectrometer (OES).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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• pp.176-178
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• 2002

Surface states of silicone polymer treated by plasma were investigated by the analysis by x-ray photoelectron spectroscopy(XPS) and surface voltage decay after corona charging. Plasma treatment causes the silica -like oxidative layer, which was confirmed with XPS, and lowers surface resistivity with increasing the plasma treatment time. Using the decay time constant of surface voltage, the calculated surface resistivity was compared with the value directly measured by voltage-current method using three electrodes system. A good agreement between two methods was obtained. In addition, we estimated the thermal activation energy for surface conduction, Based on our results, we could understand the relationship between surface chemical states and surface electrical properties.

• Bulletin of the Korean Chemical Society
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• 제9권6호
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• pp.388-393
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• 1988

The chemisorption of CO molecules on polycrystalline nickel surface has been studied by investigating the resulting chemisorbed species with the X-ray photoelectron spectroscopy at temperatures between 300K through 433K. It is found that the adsorbed CO molecules are dissociated by the simple C-O bond cleavage as well as by the disproportionation reaction at temperatures above 373K. The former type dissociation is more favored at low coverages and at elevated temperatures. The isotherms of CO chemisorption are obtained from the xps intensities of C 1s peaks, and then the activation energy of the dissociative adsorption is estimated as a function of the CO exposure. These activation energies are extrapolated to zero coverage to obtain the activation energy of chemisorption in which thermal C-O bond cleavage takes place. The value obtained is 38.1 kJ/mol.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.1-5
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• 2018

Wood Polymer Composites(WPC) have attracted significant attention because of ecological and environmental concerns. However, the structure of Wood Flour containing many hydroxyl groups(-OH) reduces the interface adhesion to Phenol-formaldehyde(PF) and it decreases the mechanical properties of the PF/Wood Flour Composites. The present work involves the modification of Wood Flour using silanes reinforced with Phenol-formaldehyde to enhance the mechanical properties of the composites. The spectroscopic properties of the composites were analyzed using FT-IR, XPS(X-ray Photoelectron Spectroscopy) and the mechanical properties i.e., tensile strength, flexural strength and impact strength were studied. We confirmed the modification effect of silanes by spectroscopic analysis, and the mechanical properties of the composites using wood flour modified by silanes were significantly improved.

• 한국진공학회지
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• 제2권4호
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• pp.399-403
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• 1993

Si(111)7 $\times$ 7 위에 Mg를 흡착시켜 표면구조의 변화를 RHEED(Reflection High Energy Electron diffraction) 와 XPS(X-ray PhotoelectronSpectroscopy)를 이용하여 연구하였다. RT ~20$0^{\circ}C$까지의 기판온도에서 증착량의 증가에 따라 표면구조는 (7$\times$7)에서 diffused (1$\times$1) 그리고 (2 3 3 $\times$2√3√3-R30$^{\circ}$) 구조로 변화하였다. 또한, 기판온도를 증가시킴에 따라 (1$\times$1), three domain(3$\times$1) 등의 구조를 볼 수 있었고, 특히 , $450^{\circ}C$의 기판온도에서는 single domain (3$\times$1) 구조를 최초로 관측하였다. 이렇게 형성된 각 구조에 대한 Mg KLL과 Si2p의 XPS peak intensity ratio를 증착량의 증가에 따라 측정하여 각기 다른 온도에서의 Mg 성장에 대한 메카니즘을 제시하였다.

• 한국진공학회지
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• 제7권s1호
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• pp.78-84
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• 1998

Niobium ions of 380 keV energy have been implanted at 300k in sapphire with a dose of $5\times10^{16}\textrm{ions/cm}^2$ and subsequently thermal annealed up to $1100^{\circ}C$ at reducing atmosphere. The behavior of the radiation damage produced by ion implantation followed by annealing is investigated using optical absorption technique and X-ray photoelectron spectroscopy(XPS). It is found that different defects annealed are dependent on the annealing temperature owing to different mechanisms which are proposed on the basis of the optical absorption measurement, and the implanted niobium in sapphire is in different local environments with different charge states after annealing, which are analyzed by XPS measurements.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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• pp.285-288
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• 1997

Generally the high dielectric films, such as PZT(Pb(Z $r^{1-x}$ $Ti_{x}$ ) $O_3$) and BST(B $a_{l-x}$S $r_{x}$ Ti $O_3$) have been formed on the Pt thin films. However it is generally known that the dry etching of Pt is difficult because of its chemical stability. So, the dry etching of Pt remains at the preliminary work. Therefore, in this study, Pt etching mechanism was investigated with Ar/C $l_2$gas plasma by using XPS(X-ray photoelectron spectroscopy) and QMS(Quadrupole mass spectrometry). Ion current density was measured with Ar/C $l_2$gas plasma by using single Langmuir probe. XPS results shoved that the atomic % of Cl element on the etched Pt sample increased with increasing Ar/(Ar+C $l_2$). And QMS results showed that the increase of Ar partial pressure in the plasma resulted in the improvement of C $l_2$dissociation and Cl redical formation and simultaniously the increase of ion bombardment effects.s.s.

• 대한기계학회논문집B
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• 제30권5호
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• pp.397-404
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• 2006

Effects of surface defect distribution on flame instability during flame-surface interaction are experimentally investigated. To examine chemical quenching phenomenon which is caused by radical adsorption and recombination processes on the surface, thermally grown silicon oxide plates with well-defined defect density were prepared. ion implantation technique was used to control the number of defects, i.e. oxygen vacancies. In an attempt to preferentially remove oxygen atoms from silicon dioxide surface, argon ions with low energy level from 3keV to 5keV were irradiated at the incident angle of $60^{\circ}$. Compositional and structural modification of $SiO_2$ induced by low-energy $Ar^+$ ion irradiation has been characterized by Atomic Force Microscopy (AFM) and X-ray Photoelectron Spectroscopy (XPS). It has been found that as the ion energy is increased, the number of structural defect is also increased and non-stoichiometric condition of $SiO_x({\le}2)$ is enhanced.

• 한국진공학회지
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• 제4권S2호
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• pp.1-7
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• 1995

Cu(400$\AA$)/Polyimide has been mixed with 80 keV Ar+ and N2+from 1.0X1015ions/$\textrm{cm}^2$ to 2.0X1016 ions/$\textrm{cm}^2$. The changes of chemical bond and internal properties of sample are investigated by X-ray photoelectron spectroscopy(XPS). The quantitative adhesion strength is measured by using scratch test. The optimized mixing condition is that Cu/PI is irradiated with 80 keV N2+ at a dose of 1.0X1015 ions/$\textrm{cm}^2$, because N2+ ions can product more pyridine-like moiety, amide group, and tertiary amine moiety which are known as adesion promoters than Ar+.