• Title/Summary/Keyword: X-ray 영상 센서

Search Result 56, Processing Time 0.024 seconds

Design of a DC-DC converter for intra-oral CMOS X-ray image sensors (Intra Oral CMOS X-ray Image Sensor용 DC-DC 변환기 설계)

  • Jang, Ji-Hye;Jin, Li-Yan;Heo, Subg-Kyn;Josonen, Jari Pekka;Kim, Tae-Woo;Ha, Pan-Bong;Kim, Young-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
    • /
    • v.16 no.10
    • /
    • pp.2237-2246
    • /
    • 2012
  • A bias circuit required for an oral sensor is manufactured inside the oral sensor chip to reduce its size and cost. The proposed DC-DC converter supplies the required reference and bias currents for their corresponding regulators by using IREF of the reference current generator. Their target voltages of the voltage regulators are regulated by the negative mechanism by generating their reference voltages required for their corresponding regulators. In addition, a constant current IB0/IB1 is supplied by being mirrored by a current mirror ratio and then VREF is generated. It is confirmed by measurements that the average volatge, ${\sigma}$, and $4{\sigma}$ of the designed DC-DC converter for intra oral sensors with a $0.18{\mu}m$ X-ray CMOS process are within their required ranges. And the line-pair pattern image shows a high-resolution characteristic without blurring. Also, a good oral image can be obtained.

RF magnetron sputtering 및 Evaporation으로 증착된 CdTe박막의 물성비교

  • Kim, Min-Je;Jo, Sang-Hyeon;Song, Pung-Geun
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2012.11a
    • /
    • pp.172-173
    • /
    • 2012
  • 최근 의료산업에서는 동영상 구현이 가능한 직접 방식의 X-선 검측센서에서 X-ray 흡수효율이 좋은 반도체센서와 성숙된 기술. 본 연구에서는 non-alkali 기판에 evaporation 및 RF magnetron sputtering법으로 기판온도를 증가시키며 CdTe막을 증착하였다. 또한, RF magnetron sputtering을 이용하여 상온에서 증착한 CdTe막을 진공 및 대기 중에서 후열처리한 후 미세구조 변화를 관찰하였다.

  • PDF

Development of Multi-channel Detector of X-ray Backscatter Imaging (후방산란 엑스선 영상획득을 위한 다채널 검출기 개발)

  • Lee, Jeonghee;Park, Jongwon;Choi, Yungchul;Lim, Chang Hwy;Lee, Sangheon;Park, Jaeheung
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • 2022.10a
    • /
    • pp.245-247
    • /
    • 2022
  • Backscattered x-ray imaging is a technology capable of acquiring an image inside an irradiated object by measuring X-rays scattered from an object. For image acquisition, the system must include an X-ray generator and a detection system for measuring scattered x-rays. The imaging device must acquire a real-time signal at sampling intervals for x-rays generated by passing through a high-speed rotating collimator, and for this purpose, a high-speed signal acquisition device is required. We developed a high-speed multi-channel signal acquisition device for converting and transmitting signals generated by the sensor unit composed of a large-area plastic scintillator and a photomultiplier tube. The developed detector is a system capable of acquiring signals at intervals of at least 15u seconds and converting and transmitting signals of up to 6 channels. And a system includes remote control functions such as high voltage, signal gain, and low level discrimination for individual calibration of each sensor. Currently, we are conducting an application test for image acquisition under various conditions.

  • PDF

A noble Sample-and-Hold Circuit using A Micro-Inductor To Improve The Contrast Resolution of X-ray CMOS Image Sensors (X-ray CMOS 영상 센서의 대조 해상도 향상을 위해 Micro-inductor를 적용한 새로운 Sample-and-Hold 회로)

  • Lee, Dae-Hee;Cho, Gyu-Seong;Kang, Dong-Uk;Kim, Myung-Soo;Cho, Min-Sik;Yoo, Hyun-Jun;Kim, Ye-Won
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.49 no.4
    • /
    • pp.7-14
    • /
    • 2012
  • A image quality is limited by a sample-and-hold circuit of the X-ray CMOS image sensor even though simple mos switch or bootstrapped clock circuit are used to get high quality sampled signal. Because distortion of sampled signal is produced by the charge injection from sample-and-hold circuit even using bootstrapped. This paper presents the 3D micro-inductor design methode in the CMOS process. Using this methode, it is possible to increase the ENOB (effective number of bit) through the use of micro-inductor which is calculated and designed in standard CMOS process in this paper. The ENOB is improved 0.7 bit from 17.64 bit to 18.34 bit without any circuit just by optimized inductor value resulting in verified simulation result. Because of this feature, micro-inductor methode suggested in this paper is able to adapt a mamography that is needed high resolution so that it help to decrease patients dose amount.

X-ray image system design for non-destructive inspector (비파괴 검사용 X선 영상시스템 설계)

  • Lee, Eui-Yong;Nam, Hyung-Jin;Jo, Nam-In;Sul, Yong-Tae
    • Proceedings of the KAIS Fall Conference
    • /
    • 2006.11a
    • /
    • pp.147-149
    • /
    • 2006
  • 본 연구는 산업용과 의료용에 사용되는 비파괴 검사용 X 선 영상시스템에 이용되는 X 선을 직접 감지하는 방식의 센서를 실리콘 반도체 재료를 사용하여 개발하는데 목적이 있다. 현재 사용되고 있는 비파괴 시험 용 검사 방법은 X-선을 사용하고 감지 필름 또는 고가의 감지재료를 사용하고 있으나 본 과제에서는 경제성이 있으며 기술기반이 확고한 실리콘 재료를 사용하고 디지털 촬영 방식을 도입하여 컴퓨터로 시험결과를 영상 처리한다는 장점이 있으며 영상 자료의 컴퓨터 베이스 처리와 영상 저장이 편리하게 이루어졌다.

  • PDF

RF Magnetron Sputtering 및 Evaporation을 이용하여 증착한 CdTe 박막의 물성평가

  • Kim, Min-Je;Jo, Sang-Hyeon;Song, Pung-Geun
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.08a
    • /
    • pp.345-345
    • /
    • 2012
  • 최근 의료산업에서는 고해상도 및 동영상 구현이 가능한 직접 방식의 X-선 검측센서에서 X-ray 흡수효율이 좋은 반도체 센서(CdTe, CdZnTe 등)와 성숙된 기술, 집적효율이 뛰어난 CMOS 공정을 이용한 제품을 출시하여 대면적화 및 고집적화가 가능하게 되어 응용분야가 점차 확대되고 있는 추세이다. 하지만 이 역시 고 성능의 X-선 동영상 구현을 위해서는 고 해상도 문제, 검출효율 문제, 대면적화의 어려움이 있다. 기존의 X-선 광 도전층의 증착은 증착 속도와 박막 품질에서 우수한 Evaporation 법이 사용되고 있다. 한편, 대면적에 균일한 박막형성이 가능하기 때문에 양산성에서 우월성을 가지는 sputtering법의 경우, 밀도가 높은 소결체 타겟의 제조가 힘들뿐만 아니라 증착 속도가 낮아 장시간 증착 시 낮은 소결밀도로 인한 타겟 Particle 영향으로 인해서 대 면적에 고품질의 박막을 형성하기가 어렵다. 하지만 최근 소결체 타겟 제조기술 발달과 함께, 대면적화와 장시간 증착에 대한 어려움이 해결되고 있어 sputtering 법을 이용한 고품질 박막 제조 기술의 연구가 시급한 실정이다. 본 연구에서는 $50{\times}50$ mm 크기의 non-alkali 유리기판(Corning E2000) 위에 Evaporation과 RF magnetron sputtering을 사용하여 다양한 기판온도 (RT, 100, 200, 300, $350^{\circ}C$)에서 $1{\mu}m$의 두께로 CdTe 박막을 증착하였다. RF magnetron sputtering의 경우 CdTe 단일 타겟(50:50 at%)을 사용하였으며 Base pressure는 약 $5{\times}10^{-6}$ Torr 이하까지 배기하였고, Working pressure는 약 $7.5{\times}10^{-3}$ Torr에서 증착하였다. 시편과 기판 사이의 거리는 70 mm이며 RF 파워는 150 W로 유지하였다. CdTe 박막의 미세구조는 X-ray diffraction (XRD, BRUKER GADDS) 및 Field Emission Scanning Electron Microscopy (FE-SEM, Hitachi)를 사용하여 측정하였다. 또한, 조건별 박막의 조성은 Energy Dispersive X-ray Spectroscopy (EDS, Horiba, 7395-H)을 사용하여 평가하였다. X-선 동영상 장치의 구현을 위해서는 CdTe 다결정 박막의 높은 흡수효율, 전하수집효율 및 SNR (Signal to Noise Ratio) 등의 물성이 요구된다. 이러한 물성을 나타내기 위해서는 CdTe 박막의 높은 결정성이 중요하다. Evaporation과 RF magnetron sputtering로 제작된 CdTe 박막은 공정 온도가 증가함에 따라 기판상에 도달하는 스퍼터 원자의 에너지 증가로 인해서 결정립이 성장한 것을 확인할 수 있었다. 따라서 CdTe 박막이 직접변환방식 고감도 X-ray 검출기 광도 전층 역할을 수행할 수 있을 것으로 기대된다.

  • PDF

The X-ray Detection Characteristic of vacuum evaporated CsI for Digital X-ray Image Sensor (디지털 X선 영상센서 적용을 위한 진공증착 CsI 특성평가)

  • Shin, Jung-Wook;Park, Ji-Koon;Choi, Jang-Yong;Seok, Dea-Woo;Kim, Jea-Hyung;Nam, Sang-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2003.05c
    • /
    • pp.15-18
    • /
    • 2003
  • In recent years, there has been keen interest in phosphor materials responding X-ray. Cesium iodide of the materials is a material with a high $\gamma$-ray stopping power due to its relative high density and atomic number. CsI is noted for its high resistance to thermal and mechanical shock due to the absence of a cleavage plane. To design the structure of CsI detector, we analysed the structure with SEM and XRD and measured UV meter.

  • PDF

Development of Packaging Technology for CdTe Multi-Energy X-ray Image Sensor (CdTe 멀티에너지 엑스선 영상센서 패키징 기술 개발)

  • Kwon, Youngman;Kim, Youngjo;Ryu, Cheolwoo;Son, Hyunhwa;Kim, Byoungwook;Kim, YoungJu;Choi, ByoungJung;Lee, YoungChoon
    • Journal of the Korean Society of Radiology
    • /
    • v.8 no.7
    • /
    • pp.371-376
    • /
    • 2014
  • The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at $150^{\circ}C$ and $270^{\circ}C$ respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was $2.45kgf/mm^2$ and, it is enough bonding force against threshold force, $2kgf/mm^2s$.

The Change of Collected Light According to Changing of Reflectance and Thickness of CdWO4 Scintillator for High Energy X-ray Imaging Detection (고에너지 X-선 영상검출을 위한 CdWO4 섬광체 두께와 반사체의 반사율 변화에 따른 광 수집량의 변화)

  • Lim, Chang Hwy;Park, Jong-Won;Lee, Junghee
    • Journal of the Korea Institute of Information and Communication Engineering
    • /
    • v.24 no.12
    • /
    • pp.1704-1710
    • /
    • 2020
  • The high-energy X-ray imaging detector used for container inspection uses a thick scintillator to effectively acquire X-rays. X-ray incident on the scintillator is generally up to 9MeV. Therefore, to effectively collect X-ray, it is necessary to use a thick scintillator. To collect the light generated by the reaction between X-ray and scintillator, an optical-sensor must be combined with the scintillator. In this study, a study on the design conditions of the detector using a CdWO4 and a small sensor is described. To calculate the collected light according to the change of the scintillator thickness and the reflectance of surface, MCNP6 and DETECT2000 were used. As a result of calculating, it was confirmed that when the reflectance of the surface was low, it was appropriate to select a scintillator with a thickness of 15 to 20-mm, but as the reflectance increased, it was confirmed that it was appropriate to select a CdWO4 with a thickness of 25 to 30-mm.

Evaluation of Respiration Reproducibility of Chest General X-ray Examination using Self-made Respiratory Synchronization Device (자체 제작한 호흡 동기화 장치를 통한 흉부 일반촬영 검사의 호흡 재현성 평가)

  • Kwon, Oh-Young;Lee, Chang-Hun;Yong, Keum-Ju;Jin, Seon-Hui;Jung, Da-Bin;Heo, Yeong-Cheol
    • Journal of the Korean Society of Radiology
    • /
    • v.15 no.7
    • /
    • pp.1049-1056
    • /
    • 2021
  • The purpose of this study was to develop a respiratory synchronization device for X-ray (X-RSD) to increase the reproducibility of inspiration when examining the Chest X-ray of a patient who difficulty in breathing coordination. The X-RSD was self-made using an air pressure sensor and air was injected by connecting a ventilator to the mannequin for CPR. At this time, the amount of injected air was quantified using the SkillReporting device. After placing the X-RSD on the chest of the mannequin, the amount of air was tested in 6 steps from 200 to 700 cc by 100 cc increased. For the accuracy evaluation, the sensitivity of X-RSD was measured by repeating a total of 80 measurements, and the sensitivity was 100%, and very precise results were obtained. After that, the images examined while viewing the X-RSD of the chest lateral examination and the images obtained by the blind examination were compared and evaluated. The lung volume of X-RSD was larger than that of the blind test, and the deviation was smaller. Overall, the use of X-RSD can help with chest X-ray examination of patients who have difficulty in cooperating, and it is thought that it will be possible to contribute to the reduction of exposure dose by reducing the repeat rate of general X-ray examinations.