• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2006.05a
• /
• pp.395-398
• /
• 2006

Forging is applied for many industrial fields. Also, it is applied to hose nipple. Stress and metal analysis is finding method of forging possibility and we predict this possibility by finite element forging analysis. But there are also many manufacturing procedure after forging, and metal texture is varied by additional heat treatment or coating. So this research is focused on the measuring and analysis of plastic residual stress distribution at overall manufacturing procedure. From raw material to final product we measured real residual stress at each manufacturing procedure by X ray diffract meter, and simulated another procedure except forging by nonlinear finite element analysis. Also we showed how Zn-Ni coating is more contributable to metal strength than Zn coating. By this research we make final conclusion that process analysis must be observed from raw material to final manufacturing state for robust design.

• Journal of Sensor Science and Technology
• /
• v.16 no.2
• /
• pp.159-164
• /
• 2007

Thin films of platinum were deposited on a $Al_{2}O_{3}/ONO(SiO_{2}-Si_{3}N_{4}-SiO_{2})/Si$-substrate with an 2-inch Pt(99.99 %) target at room temperature for 20, 30 and 60 min by DC magnetron sputtering, respectively X-ray diffract meter (XRD) was used to analyze the crystallanity of the thin films and field emission scanning electron microscopy (FE-SEM) was employed for the investigation on crystal growth. The densification and the grain growth of the sputtered films have a considerable effect on sputtering time and annealing temperatures. The resistance of the Pt thin films was decreased with increasing deposition time and sintering temperature. Pt micro heater thin film deposited for 60 min by DC magnetron sputtering on an $Al_{2}O_{3}$/ONO-Si substrate and annealed at $600^{\circ}C$ for 1 h in air is found to be a most suitable micro heater with a generation capacity of $350^{\circ}C$ temperature and 645 mW power at 5.0 V input voltage. Adherence of Pt thin film and $Al_{2}O_{3}$ substrate was also found excellent. This characteristic is in good agreement with the uniform densification and good crystallanity of the Pt film. Efforts are on progress to find the parameters further reduce the power consumption and the results will be presented as soon as possible.