• 한국정보통신학회논문지
• /
• 제11권9호
• /
• pp.1626-1633
• /
• 2007

본 논문에서는 공동주택 환경에서 정보통신 설비의 고도화를 위하여 사업자설비와 이용자설비가 최초 접속되는 케이블 분기점의 집중구내통신실과 구내 간선 및 건물간선이 접속되는 동장비실을 비롯 구내통신설비의 전반적인 환경에 대한 현장조사를 통하여 운영실태를 조사하였고 기술기준과 초고속 정보통신 건물인증기준을 비교하여 새로이 개선안을 제시하였다.

• 한국기계기술학회지
• /
• 제13권1호
• /
• pp.113-118
• /
• 2011

To analyze and verify the effect of replacing thermal storage heater by a cascade cycle heat pump using midnight electricity was installed and tested at a customer's house in Wonju, Korea. The electric night storage heater is consist of 30kW electric heater and 2,700 liters of thermal storage water tank to supply hot water for warming house floor. The power for electric heater was cut off and hot water was only generated by cascade cycle heat pump. Current thermal storage water tank was not eliminated and electric heater wiring was modified. Some operation logic of the heat pump was also modified for proper operation. The required capacity of the heat pump and hot water temperature for given warming condition were estimated. The estimated capacity of heat pump was about 19kW and estimated hot water temperature for proper heating was at least $75^{\circ}C$.

• 한국철도학회:학술대회논문집
• /
• 한국철도학회 2008년도 추계학술대회 논문집
• /
• pp.225-229
• /
• 2008

This paper describes a series arc detection algorithm in a low-voltage wiring system. We designed and fabricated an arc detection circuit which consists of a high-pass filter with the low cut-off frequency of 3 kHz to attenuate power frequency. The series arcing phenomena was simulated by an arc generator specified in UL1699. In the experiment, various loads such as resistive loads, resistive loads controlled by a dimmer, and vacuum cleaners were used. Whether the signal is arc or noise is discriminated by pulse counts and periodicity of the detected signal.

• 항공우주시스템공학회지
• /
• 제15권6호
• /
• pp.50-58
• /
• 2021

Byteflight is developed based on RS-485 communication (an international standard), and it can be used as a data bus during the operation of an integrated avionics system in the latest aircraft. Therefore, the integrated avionics system can perform an effective and safe flight mission only when the accurate and seamless display of flight information, communication, and accurate functions of navigation are implemented. In this study, cause analysis and failure investigation were performed on screen abnormalities and communication interruptions due to signal interference in the Byteflight data bus of the integrated avionics system during aircraft operation. To improve signal interference between avionics units, the branch point and wiring path of the Byteflight data bus were changed, and the verification result of the improved method was also described.

• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2019년도 전력전자학술대회
• /
• pp.540-542
• /
• 2019

This paper proposes an open-phase fault control system using 3-phase neutral voltage. The proposed control system is designed as a new topology which uses the potential difference between neutral point and ground of three phase. The open-phase detection system is also configured to Y-wiring of three capacitance devices of the same capacity to each line of three phase power source R-S-T. This paper also designs a mobile phone application for remote alarm of open-phase fault.

• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2018년도 추계학술대회
• /
• pp.4-6
• /
• 2018

This paper proposes an open-phase fault control system using 3-phase neutral voltage. The proposed control system is designed as a new topology which uses the potential difference between neutral point and ground(G) of three phase. And the open-phase detection system is configured to Y-wiring of three capacitance devices of the same capacity to each line of three phase power source R-S-T. This paper also designs a mobile phone application for remote alarm of open-phase fault.

• 항공우주시스템공학회지
• /
• 제15권2호
• /
• pp.45-51
• /
• 2021

In this study, we aim to eliminate the flickering phenomenon in multi-function display (MFD) units during the flight of fixed-wing aircraft. To execute flight missions effectively, the video signals transmitted to MFDs must provide information accurately and seamlessly. Therefore, a method for addressing the flickering phenomenon-including cause analysis and failure diagnosis-is adopted; specifically, a wiring configuration with a direct connection between the video signal cables and with a short cable length is adopted. The proposed method is experimentally verified using a flight test.

• 국제학술발표논문집
• /
• The 1th International Conference on Construction Engineering and Project Management
• /
• pp.1042-1047
• /
• 2005

A web-based camera (webcam) is expected to enhance construction operation monitoring. However, webcams are often installed outside a building because their mobility is limited by cable wiring, which makes it difficult to monitor construction operations inside the building. If a webcam is integrated with emerging wireless communication technologies, construction professionals may be able to monitor interior construction operations using webcams without getting network cables wired on a congested and dynamic construction job site. However, one may concern that wireless communication may not be fast enough to transport all webcam images seamlessly. This paper presents an investigation as to the observation error of webcam images when a limited amount of images are delivered.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
• /
• pp.35-40
• /
• 2000

MCM technology languished troughout most of the 1990's due to high costs resulting from low yields and issues with known god die. During the last five years of the decade new developments in chip scale packages and high density, build up multi-layer printed wiring boards created new opportunities to design and produce ultra miniaturized modules using conventional surface mount manufacturing capabilities. Focus on the miniaturization of substrate based packages such as ball grid arrays (BGAs) resulted in chip scale packages (CSPs) offering many of the benefits of flip chip along with the handling, testing, manufacturing and reliability capabilities of packaged deviced. New developments in the PWB industry sought to reduce the size, weight, thickness and cost of high density interconnect (HDI) substrates. Shrinking geometries of vias and new constructions significantly increased the interconnect density available for MCM-L applications. This paper describes the most promising CSP and HDI technologies for portable products, high performance computing and dense multi-chip modules.

• 한국정밀공학회지
• /
• 제13권11호
• /
• pp.46-56
• /
• 1996

Planarization technique is rapidly recognized as a critical step in chip fabrication due to the increase in wiring density and the trend towards a three dimensional structure. Global planarity requires the preferential removal of the projecting features. Also, the several materials i.e. Si semiconductor, oxide dielectric and sluminum interconnect on the chip, should be removed simultaneously in order to produce a planar surface. This research has investihgated the development of the chemical mechanical polishing(CMP) machine with uniform pressure and velocity mechanism, and the pad insensitive to pattern topography named hard grooved(HG) pad for global planarization. Finally, a successful result of uniformity less than 5% standard deviation in residual oxide film and planarity less than 15nm in residual step height of 4 inch device wafer, is achieved.