• Archives of Plastic Surgery
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• v.38 no.1
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• pp.96-101
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• 2011

Purpose: In treatment of facial bone fracture, occurred in children, we generally use wires, miniplate, absorbable plate or their combination. These foreign bodies can be palpable, and sometimes may cause infections, and need reoperation for removing. When bone fragments are multiple, small or thin, they are hard to handle and make accurate reduction of all fragments. In these cases, a biodegradable tissue adhesive, Histoacryl$^{(R)}$ (n-butyl-2-cyanoacrylate), can be used as fixation technique for small, multiple, and thin fracture fragments. Methods: 3 years old and 6 years old children, who has comminuted fracture on frontal sinus, we used Histoacryl$^{(R)}$ for fixation of multiple bone fragments. After approaching by coronal incision, we pulled out all bone fragments and reconstructed bone fragments by Histoacryl$^{(R)}$ and fixed those on frontal sinus by absorbable plates. Results: Photographs and 3-dimensional CT obtained preoperatively and postoperatively. And we compared them each other in terms of accuracy of reconstructed bony contour. We could reconstruct almost all bone fragments easily along 3-dimensional structure and get excellent aesthetic results. There was no complication such as infection. Conclusion: In treatment of comminuted facial bone fracture, occurred in children, Histoacryl$^{(R)}$ is an excellent method for accurate reconstruction in small and thin bone fragments which cannot be fixed by wire, miniplate or absorbable plate without complication.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.2
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• pp.137-142
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• 2015

Teleoperation of a robot arm working in hazardous environments has been studied in the field of defense and security. A master system is an essential part that plays an important role in the teleoperation. We developed a master system, which is an essential part in the teleoperation, so that it can operate the slave robot arm intuitively and has excellent mobility and portability compared to conventional master systems. The master system adopted a Stewart platform to minimize the size and weight, and the legs of the Stewart platform are composed of wires to improve the operation range of the system. The experimental validation of the developed master system is conducted with a commercial IMU, and the experimental results show that the proposed master system can perform reliable and dexterous teleoperation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.2
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• pp.81-85
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• 2017

Fiber-reinforced polymer composites, which are made by combining a continuous fiber that acts as reinforcement and a homogeneous polymeric material that acts as a host, are engineering materials with high strength and stiffness and a lightweight structure. In this study, a shape memory alloy(SMA) reinforced composite actuator is presented. This actuator is used to generate large deformations in single lightweight structures and can be used in applications requiring a high degree of adaptability to various external conditions. The proposed actuator consists of numerous individual laminas of the glass-fiber fabric that are embedded in a polymeric matrix. To characterize its deformation behavior, the composition of the actuator was changed by changing the matrix material and the number of the glass-fiber fabric layers. In addition, current of various magnitudes were applied to each actuator to study the effect of the heating of SMA wires on applying current.

• Wind and Structures
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• v.23 no.2
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• pp.109-125
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• 2016

Flow interference is investigated between two tripped cylinders of identical diameter D at stagger angle ${\alpha}=0^{\circ}{\sim}180^{\circ}$ and gap spacing ratio $P^*$ (= P/D) = 0.1 ~ 5, where ${\alpha}$ is the angle between the freestream velocity and the line connecting the cylinder centers, and P is the gap width between the cylinders. Two tripwires, each of diameter 0.1D, were attached on each cylinder at azimuthal angle ${\beta}={\pm}30^{\circ}$, respectively. Time-mean drag coefficient ($C_D$) and fluctuating drag ($C_{Df}$) and lift ($C_{Lf}$) coefficients on the two tripped cylinders were measured and compared with those on plain cylinders. We also conducted surface pressure measurements to assimilate the fluid dynamics around the cylinders. $C_D$, $C_{Df}$ and $C_{Lf}$ all for the plain cylinders are strong function of ${\alpha}$ and $P^*$ due to strong mutual interference between the cylinders, connected to six interactions (Alam and Meyer 2011), namely boundary layer and cylinder, shear-layer/wake and cylinder, shear layer and shear layer, vortex and cylinder, vortex and shear layer, and vortex and vortex interactions. $C_D$, $C_{Df}$ and $C_{Lf}$ are very large for vortex and cylinder, vortex and shear layer, and vortex and vortex interactions, i.e., the interactions where vortex is involved. On the other hand, the interference as well as the strong interactions involving vortices is suppressed for the tripped cylinders, resulting in insignificant variations in $C_D$, $C_{Df}$ and $C_{Lf}$ with ${\alpha}$ and $P^*$. In most of the (${\alpha}$, $P^*$ ) region, the suppressions in $C_D$, $C_{Df}$ and $C_{Lf}$ are about 58%, 65% and 85%, respectively, with maximum suppressions 60%, 80% and 90%.

• Journal of the Korean Arthroscopy Society
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• v.14 no.2
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• pp.128-130
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• 2010

Femoral avulsion fracture of posterior cruciate ligament (PCL) is rare, especially in adult. We experienced a case of femoral bony avulsion fracture of PCL. The patient was seventy one year old man with limitation of motion in the knee joint due to previous trauma and he was injured by fall down from 2 m height. We took CT scan and MRI study. We treated with arthroscopic repair technique using transfemoral two wire sutures. Second look arthroscopy was done for removal of the wires at postoperative one year.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.230-235
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• 2001

There are more than 15 millions cars or motors in Taiwan. According to the statistics from Environmental Protection Administration, the number of resulting scrap tires are near 110 thousand tons each year. The tire recycle programs in Taiwan were first conducted in 1989 and executed by ROC Scrap Tire Foundation. However, the current efficiency of the tire recycling industry still needs to be improved to minimize the environmental problem or fire hazards caused by scrap tires storage. Ten major tire-recycling factories are surveyed in this study. The investigations include the source of scrap tire, the shredding process, the market of products, the management of wastes disposal, and the difficulties of these sectors. As the varieties of the shredding machines of the recycle factories, there are three kinds of final products which include powder, granular, and chips. The wastes, wires and fibers, produced by the shredding process are the major problems fur all the factories. The percentage of the wire and fiber removal from rubbers still needs to be increased. The best approaches found in this study to increase the efficiency of scrap tire recycling processes are proposed which include the improvement of magnetic separation system fiber/rubber separation system and the minimization of waste disposal. A categorized standard of the processing outputs is suggested as a reference for the decision-making of the tire-recycling factories.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.6
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• pp.114-119
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• 1996

The use of holographic interference lithography and removal techniques to corrugate GaAs substrate have been studied. The periodic photoresist structure, which serves as a protective mask during etching, is holographically prepared. Subsequently periodic V-grooved pattern is formed on the GaAs substrate by conventional a H$_{2}$SO$_{4}$-H$_{2}$O$_{2}$-H$_{2}$O wet etching. The linewidth of a GaAs pattern is about 0.4$\mu$m and the depth is 0.5$\mu$m A quantum wires(QWRs) array is well formed on the V-grooved substrate by MOCVD (metalorganic chemical vapor deposition) growth of GaAs/Al$_{0.5}$Ga$_{0.5}$As (50$\AA$/300$\AA$) quantum wells. The formation of QWR array is confirmed by the temperature dependent photoluminescence (PL) measurement. The intensive PL peak with a FWHM of 6meV at 21K shows the high quality of the QWR array.

• Proceedings of the KSR Conference
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• 2000.11a
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• pp.535-542
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• 2000

Pure copper, Cu-1.1wt%Cd and ACSR(Aluminum Conductor Steel Reinforced) have been used as Catenary Materials in Electric Railway System. Since these materials may have chance to be exposed to the corrosive environments like polluted air, acid rain and sea water, it is important not only to investigate the corrosion characteristics but also to measure corrosion rates in various corrosive environments. In order to examine corrosion characteristics according to the dissolved oxygen content, pH, chloride ion concentration ion, and the addition of Cd to Cu, a series of tests such as potentiodynamic polarization. a.c impedance spectroscopy and galvanic corrosion tests were carried out in these materials. Results showed that the addition of Cd to Cu and chloride ion in the solution have an adverse effect on the resistance to corrosion. Additionally, Galvanic currents between Al and steel wires of ACSR were confirmed by using ZRA(zero resistance ammeter) method.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.51 no.3
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• pp.312-320
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• 2015

The 1/5 scale-down model of the Bycatch Reduction Device (BRD) from an Argentinean demersal trawl was tested in a circulating water channel. The BRD is designed to help small Hake (merluza, merluccius hubbsi) to escape from a trawl. It is settled in front of a trawl codend, and is equipped with selection grids that help small fish to escape from the gear and guiding panels that help fish to meet with the grids. Bars of the grids are wires covered by the PVC and other parts of the BRD are made of net. When the velocity was less than 0.65 m/sec (2.81 Kont when translated to real towing speed) which is slow speed compared with real towing speed, position between an upper guiding panel and an upper selection grid were good to help small fish to escape. When the velocity was more than 0.8 m/sec (3.41 Knot when translated to real towing speed) which is similar to and faster than real towing speed, it was considered that small fish may have difficulties in escaping because the gap was not enough between an upper guiding panel and an upper selection grid. The lower selection grid was sat on the bottom of the tank without an angle due to the weight that it carries. Improvements were proposed to position the panels and the grids better.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.