• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.59-64
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• 2018

In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.13-14
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.263-264
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.621-622
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.29-30
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• 2013

• Current Photovoltaic Research
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• v.6 no.1
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• pp.27-30
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• 2018

The dependency of the electrical characteristics of silicon solar-cells on the depth of damaged layer induced by wire-sawing process was investigated. To compare cell efficiency with residual sawing damage, silicon solar-cells were fabricated by using as-sawn wafers having different depth of saw damage without any damaged etching process. The damaged layer induced by wire-sawing process in silicon bulk intensely influenced the value of fill factor on solar cells, degrading fill factor to 57.20%. In addition, the photovoltaic characteristics of solar cells applying texturing process shows that although the initial depth of saw-damage induced by wire-sawing process was different, the value of short-circuit current, fill-factor, and power-conversion-efficiency have an almost same, showing ~17.4% of cell efficiency. It indicated that the degradation of solar-cell efficiency induced by wire-sawing process could be prevented by eliminating all damaged layer through sufficient pyramid-surface texturing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.147-148
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• 2012

• Journal of Korean Tunnelling and Underground Space Association
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• v.17 no.6
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• pp.615-621
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• 2015

In this paper diamond wire cutting method has been proposed to cut the rock in the tunnel face. Diamond wire saw method could cut the rock from tunnel face with very minor vibration and noise. In this study rock cutting process has been simulated with FEM method by using LS-DYNA explicit non-linear finite element code. Normal load act as an prime factor when cutting the rock surface. For observing the effect of normal load on bead, several experiments has been conducted by varying normal loads on the bead. From each experiment, cutting rate has been calculated to compare the cutting rate with different load conditions. By increasing the normal load on bead, cutting rate increases drastically.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.1-10
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• 2014

The efficient application of any welding process depends on the understanding of associated process parameters influence on the weld quality. The weld quality includes the weld bead dimensions, temperature distribution, metallurgical phases and the mechanical properties. A detailed review on the experimental and numerical approaches to understand the parametric influence of a single wire submerged arc welding (SAW) and multi-wire SAW processes on the final weld quality is reported in two parts. The first part deals with the experimental approaches which explain the parametric influence on the weld bead dimensions, metallurgical phases and the mechanical properties of the SAW weldment. Furthermore, the studies related to statistical modeling of the present welding process are also discussed. The second part deals with the numerical approaches which focus on the conduction based, and heat transfer and fluid flow analysis based studies in the present welding process. The present paper is the first part.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.4_2
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• pp.675-682
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• 2020

Multi-wire sawing is the prominent technology employed to cut hard material ingots into wafers. This paper aimed to research the effect of diamond toughness index on the cutting performance of electroplated diamond wire. Three different toughness index of diamond abrasives were used to manufacture electroplated diamond wires. The cutting performance of electroplated diamond wire is verified through experiments, in which sapphire ingot are cut using single wire sawing machine. A single wire saw for constant load slicing is developed for the cutting performance evaluation of electroplated diamond wire. Choosing the cutting depth, total cutting depth, cutting force and wear of electroplated diamond wires as evaluation parameters, the performance of electroplated diamond wire is evaluated. The results of this study showed that there was a significant direct relationship between the toughness index of diamond abrasives and the cutting performance. Results demonstrated that diamond abrasive with a high toughness index showed higher cutting performance. However, all diamond abrasives showed similar cutting performance under low load conditions. The results of this paper are useful for the development of cutting large diameter ingots and cutting high hardness ingots at high speed.