• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04c
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• pp.98-102
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• 2008

Methods and analysis of a simple wireless sensor concept for detecting and locating faults as well as for load monitoring are presented. The concept is based on distributed wireless sensors that are attached to the incoming and outgoing power lines of secondary substations. A sensor measures only phase current characteristics of the wire it is attached to, is not synchronized to other sensors and does not need configuration of triggering levels. The main novelty of the concept is in detecting and locating faults by combining power distribution network characteristics on system level with low power sampling methods for individual sensors. This concept enables the sensor design to be simple, energy efficient and thus applicable in new installations and for retrofit purposes in both overhead and underground electrical distribution systems.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Journal of Industrial Technology
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• v.28 no.A
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• pp.71-74
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• 2008

Belt Integrated Seat(BIS) has many advantages compared to the existing seats. Due to the development of materials and manufacturing technology, BIS, which has been used restrictely in the past, has gone through a rapid growth. As a result, its advantages have gained attention and the possibility of replacing the existing seats has grown. The need to develop BIS has risen and presently joint development with associated industries is in progress. For its first goal, the development and research of Recliner sensor has been selected. Recliner sensor is an essential part of the BIS in which the belt is incorporated onto the seat. In seat-belts, there is an inclination sensor which locks the belt according to the angle of a car. Because the inclination sensor can change frequently depending on the back of seat, a device which can enhance the inclination sensor according to the angle of the back of seat. It is the Recliner sensor that play's this role. Studies on Recliner sensor within and outside Korea has not yet made a salient progress, and due to this fact, the joint development has made a start by benchmarking other company's products. Currently, in other to set the course of the development, a research in patents and various other information is being done. In addition, for the purpose of developing a product which will be compatible with the existing products, a prototype will be made and tested before a new product makes its launching on the market.

• The Journal of Korea Robotics Society
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• v.5 no.4
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• pp.294-301
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• 2010

In order to produce a convenient robot for the aged and the lower limb disabled, it is needed for the research detecting implicit walking intention and controlling robot by a user's intention. In this study, we developed sensor module system to control the walking- assist robot using FSR sensor and tilt sensor, and analyzed the signals being acquired from two sensors. The sensor module system consisted of the assist device control unit, communication unit by wire/wireless, information collection unit, information operation unit, and information processing PC which handles integrated processing of assist device control. The FSR sensors attached user's the palm and the soles of foot are sensing force/pressure signals from these areas and are used for detecting the walking intention and states. The tilt sensor acquires roll and pitch signal from area of vertebrae lumbales and reflects the pose of the upper limb. We could recognize the more detailed user's walking intention such as 'start walking', 'start of right or left foot forward', and 'stop walking' by the combination of FSR and tilt signals can recognize.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.3-3
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• 2009

선박의 건조과정에서 필수적으로 선체 외판에는 선박의 안전과 운항 및 정비 등에 필요한 정보를 나타내기 위해 다양한 종류의 마크 및 문자가 마킹되어진다. 하지만, 단순한 도장 작업만으로는 해상과 같은 부식 환경에서 마크 및 문자가 쉽게 지워지거나 손상되기 때문에 마크 및 문자를 용접 비드(welding bead)로 표시하거나 미리 절단된 강판(steel plate)을 수동으로 용접한 뒤 도장을 함으로써 마크 및 문자의 손상을 방지하고 있다. 이러한 문자마킹작업을 하기 위해서는 작업자가 수작업으로 기준선과 마크 및 문자의 위치를 먹줄 등을 이용하여 마킹을 하고, 해당 마크 및 문자의 템플렛(template)을 이용하여 펀칭을 실시한 후 수동으로 용접을 실시한다. 하지만, 수작업을 통한 선체외판 문자마킹 작업은 작업자의 기량에 따라 품질이 상이하여 품질 저하의 원인이 된다. 또한 대조립 및 탑재 단계에서 문자 마킹 작업시 수직자세의 용접을 요구함으로써 작업자가 안전사고에 노출되어 있으며, 선박의 각 단계별 주요 공정보다 작업시간이 길어져 전체 선박 건조공정을 지연시키는 문제점 등을 야기시킬 수 있다. 이러한 문제점들을 해결하기 위해 조선업계에서는 선체 외판의 마크 및 문자를 자동으로 용접할 수 있는 장치를 개발하기 위해 노력해왔으며, 몇몇 개발 사례가 보고되고 있다. 하지만, 그 실효성 부분에서는 아직까지 해결하지 못한 문제점들로 인해 현장 적용에는 어려움을 보이고 있다. 본 연구에서는 선박외판 문자 자동용접장치의 기능성뿐만 아니라 현업 적용성을 가장 우선적으로 고려하여 문자마킹장치(Marking Robot for Shipbuilding) 개발을 진행하였다. 우선, 적절한 용접 재료를 선정하기 위해서 솔리드 와이어(Solid Wire)와 플럭스 코어드 와이어(Flux Cored Wire)에 대한 비드온 용접(Bead-On Welding)을 아래보기자세와 수직자세에 대해서 실시하여 적절한 용접 조건을 설정하였다. 본 연구에서 개발된 문자마킹 자동용접장치는 3축으로 구성되어 있으며 각 축들을 분리할 수 있도록 개발하여 이동성을 향상시켰으며, 작업면과 용접토치간의 거리를 일정하게 유지시킬 수 있도록 용접전류 센서(Welding Current Sensor)를 이용하여 토치 높이(Wire Extension)를 제어함으로써 균일한 품질의 용접비드를 얻을 수 있었다. 또한 문자마킹 자동용접장치는 본체 구동부와 제어부(Touch Screen)가 쉽게 분리되고 장착이 가능한 구조로 개발되었으며, 용접시 각 용접자세별로 용접전압, 전류 그리고 용접속도 설정이 가능하여 아래보기 자세뿐만 아니라 어떠한 자세에서도 같은 모양의 비드형상을 가지는 문자마킹용접이 가능하도록 개발하였으며, 이는 실험과 현장적용을 통해 검증하였다.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1551_1552
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• 2009

In this paper, we presented the packaging technologies of CMOS ISFET(Ion Sensitive Field Effect Transistor) pH sensor using post-CMOS process and MCP(Multi Chip Packaging). We have proposed and developed two types of packaging technology. one is one chip, which sensing layer is deposited on the gate metal of standard CMOS ISFET, the other is two chip type, which sensing layer is separated from CMOS ISFET and connected by bonding wire. These proposed packaging technologies would make it easy to fabricate CMOS ISFET pH sensor and to make variety types of pH sensor.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.2
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• pp.268-277
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• 1994

Current sensor using Hall device is an instrument of detecting a current by Hall effect. The existing current sensor is ordinarily worked by concentrating electromagnetism produced around the conducting wire turned iron core. The tiny curren, however, could not be accurately detected by the instrument owing to influence of residual magnetism exisisting in iron core, and the result of detecting is also somewhat on the large side. kAccordingly, We fabricated a new type of instrument minimizing the influence of residual magnetism existing in iron core and detected the tiny DC current accurately by taking advantage of magnetic modulation. The range of measuring DC current is 0[mA]-100[mA] and the maxiumm Linerity tolleance by the result of detecting current, can be reduced less than 3 percent.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2006.06a
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• pp.161-166
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• 2006

A new fiber orientation sensor has been developed and tested on an actual paper machine to demonstrate its capability to function as a real-time monitoring system. First, we demonstrate the ability of the sensor system to detect the change in the fiber orientation angle while the sensor head, and not the paper, was intentionally rotated from $-90^{\circ}\;to\;+70^{\circ}$ with respect to the paper-traveling direction. Next, we demonstrate that this system can successfully detect the change in the magnitude and angle of fiber orientation in running paper when the direction of material flow on the wire was changed on the paper machine. The angle and magnitude of fiber orientation were independently confirmed by SST and MOA measurements. Furthermore, we found that the system was capable of measuring the basis weight and the moisture content of running paper while detecting the angle and magnitude of fiber orientation.

• Journal of the Korea Institute of Military Science and Technology
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• v.10 no.2
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• pp.76-83
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• 2007

This report presents the test technique using optic thermal sensor for the HERO evaluation of equipment installed EED. The calibration method of EED-thermal sensor assembly is explained by relation between the current in bridge wire and voltage in thermal sensor. And the HERO test and evaluation method is indicated based on MIL-STD-464A and MIL-STD-331C. The safety and reliability levels of EED-thermal sensor assembly are evaluated when exposed in the electromagnetic environment.

• Proceedings of the IEEK Conference
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• 2002.06a
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• pp.439-442
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• 2002

We present in this Paper a microwave Power sensor fabricated by a standard CMOS process and a bulk micromachining process. The sensor consists of a CPW transmission line, a resistor as a healer, and thermocouple arrays. An input microwave heater, the resistor so that the temperature rises proportionally to the microwave power and tile thermocouple arrays convert it to an electrical signal. The sensor uses air bridged 8round of CPW realized by wire bonding to reduce tile device size and cost and to improve the thermal impedance. Al/poly-Si junctions are used for the thermocouples. Poly-Si is used for tile resister and Aluminium is for transmission line. The resistor and hot junctions of the thermocouples are placed on a low stress silicon nitride diaphragm to minimize a thermal loss. The fabricated device operates properly from 1㎼ to 100㎽\ulcorner of input power. The sensitivity was measured to be ,3.2～4.7 V/W.