• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1079-1083
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• 1998

In this study, ultrasonic power of Aluminum wire bonder, bond time and bond force are investigated and valued in order to minimize failure of bonding pad lift. We also tried to control those 3 factors properly. We got the conclusion that if we turn down the ability of ultrasonic power or bond time, we can get a pad lift from a boundary between bond pad ad wire because pad metal and wire joining is unstable, but it is best condition when it ultrasonic power is 100∼130unit, bond time is 15∼20msec and bond force is 4∼6gf.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.7
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• pp.315-318
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• 2005

The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.221-225
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• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.2
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• pp.227-233
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• 2014

This study investigates the vibration characteristics of a wire-bonding piezoelectric transducer and ultrasonic horn for high-speed and precise welding. A ring-type piezoelectric stack actuator is excited at 136 kHz to vibrate a conical-type horn and capillary system. The nodal lines and amplification ratio of the ultrasonic horn are obtained using a theoretical analysis and FEM simulation. The vibration modes and frequencies close to the driving frequency are identified to evaluate the bonding performance of the current wire-bonder system. The FEM and experimental results show that the current wire-bonder system uses the bending mode of 136 kHz as the principal motion for bonding and that the transverse vibration of the capillary causes the bonding failure. Because the major longitudinal mode exists at 119 kHz, it is recommended that the design of the current wire-bonding system be modified to use the major longitudinal mode at the excitation frequency and to minimize the transverse vibration of capillary in order to improve the bonding performance.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1646-1648
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• 1994

In the system of underground transmission line, the rate of electrical failure is very low, but, if once occuring, the failure evolves into a paralysis of the system, the time of restoration is very long, the damage from stopping of power supply is very serious, and the cost of restoration is very great. Because of these problems, you must try to protect the system and equipment from every electrical failure by contributing much carefulness to the design and operation of the underground system. This study summerizes the results of simmulation tests about the effect of installing this protection device on the insulated joint box and the terminal end box.

• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1620-1622
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• 1998

The failure occurs in the system of the underground transmission line, the time of restoration is very long, the damage from stopping power supply is very serious and the cost of restoration is very great. because of these problems, the system and equipment must be protected from every electrical failure by installing protection unit. This study is summarized and compared the effects of configuration method of cable protection device with respect to surges in EHV (Extra High Voltage) underground transmission system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• The korean journal of orthodontics
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• v.43 no.4
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• pp.186-192
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• 2013

Objective: To analyze the fatigue resistance, debonding force, and failure type of fiber-reinforced composite, polyethylene ribbon-reinforced, and braided stainless steel wire lingual retainers in vitro. Methods: Roots of human mandibular central incisors were covered with silicone, mimicking the periodontal ligament, and embedded in polymethylmethacrylate. The specimens (N = 50), with two teeth each, were randomly divided into five groups (n = 10/group) according to the retainer materials: (1) Interlig (E-glass), (2) everStick Ortho (E-glass), (3) DentaPreg Splint (S2-glass), (4) Ribbond (polyethylene), and (5) Quad Cat wire (stainless steel). After the recommended adhesive procedures, the retainers were bonded to the teeth by using flowable composite resin (Tetric Flow). The teeth were subjected to 10,00,000 cyclic loads (8 Hz, 3 - 100 N, $45^{\circ}$ angle, under $37{\pm}3^{\circ}C$ water) at their incisoproximal contact, and debonding forces were measured with a universal testing machine (1 mm/min crosshead speed). Failure sites were examined under a stereomicroscope (${\times}40$ magnification). Data were analyzed by one-way analysis of variance. Results: All the specimens survived the cyclic loading. Their mean debonding forces were not significantly different (p > 0.05). The DentaPreg Splint group (80%) showed the highest incidence of complete adhesive debonding, followed by the Interlig group (60%). The everStick Ortho group (80%) presented predominantly partial adhesive debonding. The Quad Cat wire group (50%) presented overlying composite detachment. Conclusions: Cyclic loading did not cause debonding. The retainers presented similar debonding forces but different failure types. Braided stainless steel wire retainers presented the most repairable failure type.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.1
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• pp.109-113
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• 2012

The LED failure rate greatly depends on the physical properties of packaging materials (epoxy). The glass transitions temperature (Tg) of the epoxy is one of the most important physical properties. Therefore, in the present study, various epoxies with high Tg were prepared and their failure shapes were analyzed. In addition, the failure shapes depending on the amount of epoxy and the wire bonding structure were measured. As a consequence, the lower failure rate was obtained with the smaller amount of epoxy. The safety of LED was improved with increasing the Tg of the epoxy.

• The korean journal of orthodontics
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• v.41 no.1
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• pp.51-58
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• 2011

Objective: To evaluate the shear bond strength (SBS), fracture mode, wire pull out (WPO) resistance and microleakage between low-shrinking and conventional composites used as a lingual retainer adhesive. Methods: A total of 120 human mandibular incisor teeth, extracted for periodontal reasons, were collected. Sixty of them were separated into two groups. To determine the SBS, either Transbond-LR (3M-Unitek) or Silorane (3M-Espe) was applied to the lingual surface of the teeth by packing the material into standard cylindrical plastic matrices (Ultradent) to simulate the lingual retainer bonding area. To test WPO resistance, 20 samples were prepared for each composite where the wire was embedded in the composite materialand cured. Then tensile stress was applied until failure of the composite occurred. The remaining 60 teeth were divided into two groups and multi-stranded 0.0215-inch diameter wire was bonded with the same composites. Microleakage was evaluated by the dye penetration method. Statistical analyses were performed by Wilcoxon, Pearson chi-square, and Mann-Whitney-U tests at p < 0.05 level. Results: The SBS and WPO results were not statistically significant between the two groups. Significant differences were found between the groups in terms of fracture mode (p < 0.001). Greater percentages of the fractures showed mix type failure (85%) for Silorane and adhesive (60%) for Transbond-LR. Microleakage values were lower in low-shrinking composite than the control and this difference was found to be statistically significant (p < 0.001). Conclusions: Low-shrinking composite produced sufficient SBS, WPO and microleakage values on the etched enamel surfaces, when used as a lingual retainer composite.