• 반도체디스플레이기술학회지
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• 제6권1호
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• 한국산학기술학회논문지
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• 제9권3호
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• pp.649-657
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• 2008

본 논문은 트랜지스터 다이, 칩 커패시터, 커패시터와 트랜지스터 다이를 연결하는 와이어 본딩으로 구성된 질화갈륨 고출력 트랜지스터 패키지에 있어서, 그 출력 성능의 최적화에 대하여 언급한다. 와이어 본딩 방법에 따른 출력 전력의 최적화된 결과와, 와이어 본딩과 바이어스 조건에 따른 3차 상호변호 특성 최적화 등이 기술되어 있다. 또한 본 논문에는 제한된 면적내의 고출력 트랜지스터 패키지에서 와이어 본딩으로 구현된 인덕턴스에 따라 얼마나 그 출력 성능이 민감하게 반응하는지를 시뮬레이션을 통하여 제시하고 있다.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.61-73
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.

• 한국전기전자재료학회논문지
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• 제11권12호
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• pp.1079-1083
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• 1998

In this study, ultrasonic power of Aluminum wire bonder, bond time and bond force are investigated and valued in order to minimize failure of bonding pad lift. We also tried to control those 3 factors properly. We got the conclusion that if we turn down the ability of ultrasonic power or bond time, we can get a pad lift from a boundary between bond pad ad wire because pad metal and wire joining is unstable, but it is best condition when it ultrasonic power is 100∼130unit, bond time is 15∼20msec and bond force is 4∼6gf.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.393-396
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• 2005

This paper is concerned with the drawing process of $Al-1\%Si$ bonding wire. In this study, the finite-element model established in previous work was used to analyze the effect of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the Important basic data which can be guaranteed in the fracture prevention of $Al-1\%Si$ wire by using FE-Simulation.

• 대한기계학회논문집A
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• 제38권2호
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• pp.227-233
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• 2014

본 논문은 상용화된 와이어 본딩용 초음파 혼 시스템에서 발생하는 와이어 본딩 불량의 원인을 진동해석을 통하여 파악하고자 한다. 먼저 링 형상의 압전 구동기와 초음파 혼 그리고 캐필러리 등 각 부품의 진동 특성과 136kH의 가진 주파수 근처에서 발생하는 전체 초음파 혼 시스템의 주요 진동 모드들을 유한요소해석을 이용하여 구하였다. 136kHz에서 공진되는 전체 트랜스듀서 시스템의 진동 모드가 종진동 모드가 아닌 굽힘 진동 모드임을 조화 가진 해석과 실험으로 확인하였다. 136kHz에서 발생하는 굽힘 진동 모드는 캐필러리 끝단의 움직임이 종방향 뿐만 아니라 좌우 횡방향으로도 큰 변위가 발생하기 때문에 정밀 작업 시 본딩 불량의 원인이 될 수 있다. 가진 주파수 대역 근처인 119kHz에서 발생하는 종진동 모드는 캐필러리의 횡방향 진동이 감소하기 때문에 본딩 성능의 향상을 위해서 이러한 종진동 모드를 이용하도록 설계 변경이 필요함을 제시하였다.

• 대한금속재료학회지
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• 제49권5호
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• pp.380-387
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• 2011

Wire brushing, which is a typical surface preparation method for roll bonding, has recently been highlighted as a potentially effective method for surface nanocrystallization. In the present study, the microstructure evolution and hardness of the wire-brushed surface and roll-bonded interface of a 1050 aluminum sheet were investigated. Wire brushing formed protruded layers with a nanocrystalline structure and extremely high surface hardness. After roll bonding, the protruded layers remained as hard layers at the interface. Due to their hardness and brittleness the interface hard layers, can affect the interface bonding properties and also play an important role determining the mechanical properties of multi-layered clad sheets.

• 제어로봇시스템학회논문지
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• 제21권12호
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• pp.1130-1135
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• 2015

The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.

• 대한치과교정학회지
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• 제32권2호통권91호
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• pp.143-153
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• 2002

콤포지트와 여러가닥 강선을 사용하여 제작된 접착식 보정장치는 심미적이며, 효과적인 보정장치라 할 수 있다. 이 연구는 접착식 보정장치의 전단접착강도를 측정하고, 접착식 보정장치의 제작 시 사용하는 여러가닥 강선 및 접착방법의 이상적인 조합을 제시하기 위해 디자인되었다. 교정치료를 위해 발거한 건전한 상하악 소구치 160개를 사용하여 80개의 시편을 제작하였다. 접착면적 및 강선의 길이, 콤포지트의 두께를 동일화하고, 직접접착 및 간접접착의 방법으로 여러가닥 강선을 접착하여 접착식 보정장치를 제작하였다. 만능시험기를 사용하여 각 시편에서의 전단접착강도 및 강선의 탈락시까지의 신장량을 측정하여, 다음과 같은 결론을 얻었다. 1. 6가닥, 0.0155인치의 강선에서 가장 큰 최대 접착강도를 보이고, 3가닥, 0.0195인치의 강선에서 가장 작은 최대 접착강도를 보였는데, 그 차이는 유의할 만큼 크지 않았다(p<0.05). 즉 강선의 직경 및 가닥수는 접착강도와 큰 연관성이 없다. 2. 3가닥, 0.015인치의 강선에서 가장 큰 신장량을 보여 주었고, 3가닥, 0.0195인치 강선에서 가장 작은 신장량을 보여주었다(p<0.05). 강선의 직경이 작을수록 신장량은 크게 나타났으나, 강선의 가닥수는 신장량과 큰 연관성이 없다. 3. 두 가지 접착방법의 비교에서 간접 접착술식을 사용했을 때 더 큰 접착강도 및 신장량을 보여 주었고, 통계적으로 유의한 차이를 나타냈다(p<0.05).

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.