• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2018년도 추계학술대회
• /
• pp.159-160
• /
• 2018

본 논문에서는 인덕션 쿠커의 토폴로지 중 하나인 직렬 공진 하프-브릿지 컨버터에 Wide-Bandgap 전력 반도체를 적용하여 전력 손실을 평가한다. 전력 반도체의 발전으로 Si-기반의 전력반도체를 대체할 GaN과 SiC의 Wide-Bandgap 소자들이 양산되고 있다. Wide-Bandgap 소자의 장점은 고주파수에서의 동작과 낮은 손실에 있다. 이에 인덕션 쿠커의 직렬 공진 하프-브릿지 컨버터에 Wide-Bandgap 전력반도체를 적용하여 전력 손실을 PSIM Thermal Module을 통해 평가하고 인덕션 쿠커에 적합한 소자를 선정한다.

• 세라미스트
• /
• 제22권2호
• /
• pp.146-169
• /
• 2019

To overcome the theoretical efficiency of single-junction solar cells (> 30 %), tandem solar cells (or multi-junction solar cells) is considered as a strong nominee because of their excellent light utilization. Organic-inorganic halide perovskite has been regarded as a promising candidate material for next-generation tandem solar cell due to not only their excellent optoelectronic properties but also their bandgap-tune-ability and low-temperature process-possibility. As a result, they have been adopted either as a wide-bandgap top cell combined with narrow-bandgap silicon or CuIn_xGa_(1-x)Se₂ bottom cells or for all-perovskite tandem solar cells using narrow- and wide-bandgap perovskites. To successfully transition perovskite materials from for single junction to tandem, substantial efforts need to focus on fabricating the high quality wide- and narrow-bandgap perovskite materials and semi-transparent electrode/recombination layer. In this paper, we present an overview of the current research and our outlook regarding perovskite-based tandem solar technology. Several key challenges discussed are: 1) a wide-bandgap perovskite for top-cell in multi-junction tandem solar cells; 2) a narrow-bandgap perovskite for bottom-cell in all-perovskite tandem solar cells, and 3) suitable semi-transparent conducting layer for efficient electrode or recombination layer in tandem solar cells.

• 마이크로전자및패키징학회지
• /
• 제30권1호
• /
• pp.1-16
• /
• 2023

전기차용 전력변환모듈의 성능향상 요구와 종래의 Si 전력반도체의 한계 극복을 위해 차세대 전력반도체인 wide-bandgap (WBG) 기반 전력반도체로의 전환이 가속화되고 있다. WBG 전력반도체로의 전환을 위해 전력변환모듈 패키징 소재 역시 높은 고온 내구성을 요구받고 있다. 전력변환모듈 패키징 공정 중 하나인 Ag 소결 다이접합 기술은 종래의 고온용 Pb 솔더링의 대체 기술로 주목받고 있다. 본 논문에서는 Ag 소결 다이접합 기술 관련 최신 연구동향에 대해 소개하고자 한다. 소결 다이접합 공정 조건에 따른 접합부 특성을 비교하고 Ag 소결층의 3차원 이미지 구현에 따른 다공성 Ag 소결 접합부의 물성 측정 방법론에 대해 고찰하였다. 또한 열충격 및 파워사이클 신뢰성 평가 연구동향을 분석하였다.

• Advances in nano research
• /
• 제1권3호
• /
• pp.125-131
• /
• 2013

This study is aimed to calculate the radiative lifetime of Wannier-Mott excitons in nanoclusters of a narrow-bandgap semiconductor embedded in a wide-bandgap one. The nanocluster linear dimensions are assumed to be much larger than the radius of the exciton so that the latter is not destructed by the confinement potential as it takes place in small quantum dots. The calculations were carried out for an example of InAs nanoclusters put into the GaAs matrix. It is shown that the radiative lifetime of Wannier-Mott excitons in such clusters increases with the decrease of the cluster dimensions, this tendency being more pronounced at low temperatures. So, the creation of excitons in nanoclusters of a narrow-bandgap material embedded in a wide-bandgap one can be used to significantly prolong their radiative lifetime in comparison with that of excitons in a bulk semiconductor.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
• /
• pp.1447-1450
• /
• 2007

The electrical properties of organic lightemitting devices (OLEDs) with wide-bandgap impurity-doped emitting layers (EML) were investigated. While the luminous efficiency of OLEDs with a NPB or a DPVBi-doped $Alq_3$ EML did not vary significantly with the current density, that of the OLEDs with a BCP-doped $Alq_3$ EML changed dramatically.

• 한국전자파학회:학술대회논문집
• /
• 한국전자파학회 2001년도 종합학술발표회 논문집 Vol.11 No.1
• /
• pp.91-95
• /
• 2001

This paper presents that photonic bandgap structures suppressing the propagation of surface waves can improve the performance of the patch antennas on thick high dielectric constant substrate. The forbidden propagation of surface wave due to the photonic bandgap enhances the radiation efficiency and reduce the back radiation drastically with maintaining the small size and wide bandwidth of the antennas.

• 전기의세계
• /
• 제65권2호
• /
• pp.15-26
• /
• 2016

• 전기학회논문지
• /
• 제65권1호
• /
• pp.88-96
• /
• 2016

In this paper, the GaN FET based phase-shift full-bridge dc-dc converter design is implemented. Switch characteristics of GaN FET were analyzed in detail by comparing state-of-the-art Si MOSFET. Owing to the low conduction resistance and parasitic capacitance, it is expected to GaN FET based power conversion system has improved performance. However, GaN FET is vulnerable to electric interference due to the relatively low threshold voltage and fast switching transient. Therefore, it is necessary to consider PCB layout to design GaN FET based power system because PCB layout is the main reason of stray inductance. To reduce the electric noise, gate voltage of GaN FET is analyzed according to operation mode of phase-shift full-bridge dc-dc converter. Two 600W phase-shifted full-bridge dc-dc converter are designed based on the result to evaluate effects of stray inductance.

• 전자통신동향분석
• /
• 제33권6호
• /
• pp.12-23
• /
• 2018

In this paper, we review the technical trends of diamond and gallium oxide ($Ga_2O_3$) semiconductor technologies among ultra-wide bandgap semiconductor technologies for harsh environments. Diamond exhibits some of the most extreme physical properties such as a wide bandgap, high breakdown field, high electron mobility, and high thermal conductivity, yet its practical use in harsh environments has been limited owing to its scarcity, expense, and small-sized substrate. In addition, the difficulty of n-type doping through ion implantation into diamond is an obstacle to the normally-off operation of transistors. $Ga_2O_3$ also has material properties such as a wide bandgap, high breakdown field, and high working temperature superior to that of silicon, gallium arsenide, gallium nitride, silicon carbide, and so on. In addition, $Ga_2O_3$ bulk crystal growth has developed dramatically. Although the bulk growth is still relatively immature, a 2-inch substrate can already be purchased, whereas 4- and 6-inch substrates are currently under development. Owing to the rapid development of $Ga_2O_3$ bulk and epitaxy growth, device results have quickly followed. We look briefly into diamond and $Ga_2O_3$ semiconductor devices and epitaxy results that can be applied to harsh environments.

• 한국정보통신학회논문지
• /
• 제11권8호
• /
• pp.1544-1551
• /
• 2007

본 논문에서는 넓은 동작전압 범위와 저소비 전력 그리고 개선된 파워-업 특성을 가지는 캐스코드 전류 거울형 CMOS 밴드갭 기준전압 발생기의 스타트-업 회로를 제안하였다. 새롭게 제안된 스타트-업 회로는 기존의 스타트-업 회로에 비해 안정적인 파워-업 특성을 가지며 공급전압(VDDA)이 높아지더라도 밴드갭 기준전압 발생기 회로의 동작에 영향을 미치지 않는 것을 모의실험을 통하여 확인하였고 $0.18{\mu}m$ tripple-well CMOS 공정을 이용하여 테스트 칩을 제작하고 측정하였다. 측정 된 기준전압 Vref는 평균값이 738mV이고 $3{\sigma}$는 29.88mV이다.