• Title/Summary/Keyword: Whitely

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Effect of Some Bases Individually and Their Synergists with Dimethoate and Dichlorvos (DDVP) on the Mulberry Whitefly, Aleuroclava sp. Singh

  • Bandyopadhyay, U.K.;Santhakumar, M.V.;Das, K.K.;Chakraborty, N.;Saratchandra, B.
    • International Journal of Industrial Entomology and Biomaterials
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    • v.3 no.1
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    • pp.51-56
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    • 2001
  • Field experiments were conducted to find out the effec- tive control measures with some bases alone and in combination with Dichlorvos and Dimethoate for the whitefly Aleuroclava sp. Singh in the mulberry garden. Four common bases marketed in India Soda, Sunlight, Nirma and Surf at 1% concentration and their synergists with 0.02% Dichlorvos and 0.03% Dimethoate applied to mulberry plants reduced the whitefly by 46-95% (adults) 50-90% (nymphs) upto 15 days of application. Amongst the bases 1% Soda is more effective but, the mixing of 0.02% Dichlorvos with 1% Surf found more effective than 0.02% Dichlorvos With 1% Soda solution. As Surf and Dichlorvos mixture is costly for the control of whitely, Soda was found better (in combination with Dichlorvos) as it is cheaper and easily available to the farmers.

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Studies on the Isolation and Characterization of Bacteriophage of Bacillus subilis var, S16 (Bacillus subtilis var, 816 Bacteriophage의 분리와 일반적 성질에 관한 연구)

  • 이주식
    • Korean Journal of Microbiology
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    • v.16 no.2
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    • pp.71-78
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    • 1978
  • Bacillus subtilis var. 816 was used for manufacturing fermented soybean which in turn is used as flavoring agent. Fermentation of soyebean or flat wheat was occasionally failed. It was elucidated that failure was due to the presence of bacteriophage. According to Hemphill and Whitely (1975), this bacteriphage might be belonged to the viulent phage group I as it is similar to SP82G, ${\phi}25$. In fact, the phenomena of the increase of moisture, disappenarance of mucin and existence of undersirable bacteria was attributed to the contamination of the above phage during the course of fermentation of soybean or flat wheat. Particularly disapparance of mucin was sufficiently correlated by the replication of the bacteriophage. The above phage can grow in the range of $30^{\circ}C\;to\;70^{\circ}C$. The optimum temperature was $40^{\circ}C{\sim}50^{\circ}C$. The optimum pH range was between pH 7.4 and pH 8.0. It is noticeable that staphylococci was replicating simultaneously with the phage. The head of 816 phage is hexagonal with a diameter of $10{\times}165{\sim}10{\times}240\;nm$. The end of the tail is enlaged. It has a size of 25 nm and this end areas are spreaded widely as fingers.

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Mechanism of Crack Formation in Pulse Nd:YAG Laser Spot Welding of Al Alloys (Al합금 펄스 Nd:YAG 레이저 점 용접부의 균열 발생기구)

  • 하용수;조창현;강정윤;김종도;박화순
    • Journal of Welding and Joining
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    • v.18 no.2
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    • pp.86-94
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    • 2000
  • This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7N01 spot-welded by pulse Nd : YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed : center line crack({TEX}$C_{C}${/TEX}), diagonal crack({TEX}$C_{D}${/TEX}), and U shape crack({TEX}$C_{U}${/TEX}). Also, HAZ crack({TEX}$C_{H}${/TEX}) was observed in the HAZ region, furthermore, mixing crack({TEX}$C_{M}${/TEX}) consisting of diagonal crack and HAZ crack was observed. White film was formed at th hot crack region in the fractured surface after it was immersed to 10% NaOH water. In the case of A5083 alloy, white films in {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack region were composed of low melting phases, {TEX}$Fe_{2}SiAl_{8}${/TEX} and eutectic phases, $Mg_2$Al$_3$ and $Mg_2$Si. Such films observed $CuAl_2$, {TEX}$Mg_{32}(Al,Zn)_{3}${/TEX}, MgZn$_2$, $Al_2$CuMg and $Mg_2$Si were observed in the whitely etched films near {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Sim in the case of A7N01 alloy, respectively. The {TEX}$C_{C}${/TEX} and {TEX}$C_{D}${/TEX} cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of {TEX}$C_{M}${/TEX} crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The {TEX}$C_{U}${/TEX} crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification.

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Mechanism of Crack Formation in Pulse Nd YAG Laser Spot Welding of Al Alloys (Al합금 펄스 Nd:YAG 레이저 점 용접부의 균열 발생기구)

  • Ha, Yong Su;Jo, Chang Hyeon;Gang, Jeong Yun;Kim, Jong Do;Park, Hwa Sun
    • Journal of Welding and Joining
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    • v.18 no.2
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    • pp.213-213
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    • 2000
  • This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7NO1 spot-welded by pulse Nd: YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed: center line crack($C_{C}$), diagonal crack($C_{D}$), and U shape crack($C_{U}$). Also, HAZ crack($C_{H}$), was observed in the HAZ region, furthermore, mixing crack($C_{M}$), consisting of diagonal crack and HAZ crack was observed.White film was formed at the hot crack region in the fractured surface after it was immersed to 10%NaOH water. In the case of A5083 alloy, white films in C crack and $C_D crack region were composed of low melting phases, Fe₂Si$Al_8$ and eutectic phases, Mg₂Al₃ and Mg₂Si. Such films observed near HAZ crack were also consist of eutectic Mg₂Al₃. In the case of A7N01 alloy, eutectic phases of CuAl₂, $Mg_{32}$ (Al,Zn) ₃, MgZn₂, Al₂CuMg and Mg₂Si were observed in the whitely etched films near $C_{C}$ crack and $C_{D}$ crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Si in the case of A7N01 aooly, respectively.The $C_{D}$ and $C_{C}$ cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of $C_{M}$ crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The $C_{U}$ crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification. (Received October 7, 1999)