• Journal of Welding and Joining
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• 제16권6호
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• pp.77-85
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• 1998

Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

• Journal of Welding and Joining
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• 제18권6호
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• 한국표면공학회지
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• 제35권2호
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• pp.129-137
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• 2002

The purpose of solderability assessment is to predict the effectiveness of soldering process. It is important for companies pursuing zero defects manufacturing because poor solderability is the major cause of two third of soldering failures. The most versatile solderability method is wetting balance method. However, there exist so many indices for wettability in the wetting balance test e.g. time to reach 2/3 values of maximum wetting force, tine to reach zero wetting force, maximum withdrawal force. In this study, three solderability assessment methods, which were the maximum withdrawal force, the wetting balance and the dynamic contact angle (DCA), were evaluated by comparing each other. The wetting balance technique measures the solderability by recording the forces exerted from the specimen after being dipped into the molten solder. Then the force at equilibrium state can be used to calculate a contact angle, which is known as static contact angles. The DCA measures contact angles occurred during advancing and withdrawing of the specimen and the contact angles are known as dynamic contact angles. The maximum withdrawal force uses the maximum force during withdrawal movement and then a contact angle can be calculated. In this study, the maximum withdrawal force method was found to be an objective index for measuring the solderability and the experiment results indicated good agreement between the maximum withdrawal force and the wetting balance method.

• 한국가시화정보학회지
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• 제10권2호
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• pp.39-40
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• 2012

• 마이크로전자및패키징학회지
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• 제7권2호
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• pp.55-62
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• 2000

Si-wafer에 단면 코팅된 UBM(Under Bump Metallurgy)의 젖음성을 Sn-Pb 솔더에서 평가하기 위하여 wetting balance 법을 사용하였다. 단면 코팅된 UBM의 젖음곡선은 양면 코팅된 시편의 젖음 곡선과 비교할 때, 젖음곡선의 모양이 비슷하고 젖음곡선을 특징짓는 변수들의 온도에 대한 변화경향이 일치하였다. 단면 코팅된 금속층의 젖음성을 젖음곡선으로부터 정의한 새로운 젖음 지수 $F_{min}$, $F_{s}t_{s}$로 평가할 수 있었다. Au/Cu/Cr UBM은 젖음시간의 측면에서 Au/Ni/Ti UBM보다 젖음성이 우수하였다 Si-wafer에 단면 코팅된 UBM과 Sn-Pb 솔더의 접촉각을 $F_{s}$와 기울어짐각을 측정하고 메니스커스의 정적상태에서 힘의 평형으로부터 유도된 식을 이용하여 계산할 수 있었다.

• 한국섬유공학회:학술대회논문집
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• 한국섬유공학회 1997년도 추계총회 및 학술발표회 논문집
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• pp.344-348
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• 1997

• 한국분무공학회지
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• 제17권1호
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• pp.14-19
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• 2012

The present study conducts experimental investigation on spreading and deposition characteristics of a $4.3{\mu}l$ de-ionized (DI) water droplet impacting upon aluminum (Al 6061) flat and textured surfaces. The micro-textured surface consisted the micro-hole arrays (hole diameter: $125{\mu}m$, hole depth: $125{\mu}m$) fabricated by the conventional micro-computer numerical control (${\mu}$-CNC) milling machine process. We examined the surface effect of texture area fraction ${\varphi}_s$ ranging from 0 to 0.57 and impact velocity of droplet ranging from 0.40 m/s to 1.45 m/s on spreading and deposition characteristics from captured images. We used a high-speed camera to capture sequential images for investigate spreading characteristics and the image sensor to capture image of final equilibrium deposition droplet for analyze spreading diameter and contact angle. We found that the deposition droplet on textured surfaces have different wetting states. When the impact velocity is low, the non-wetting state partially exists, whereas over 0.64 m/s of impact velocity, totally wetting state is more prominent due to the increase kinetic energy of impinging droplet.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.425-426
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• 2010

• Geomechanics and Engineering
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• 제28권2호
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• pp.107-116
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• 2022

The steady state of unsaturated soil takes a long time to achieve. The soil seepage behaviours and hydraulic properties depend highly on the wetting/drying rate. It is observed that the soil-water characteristic curve (SWCC) is dependent on the wetting/drying rate, which is known as the dynamic effect. The dynamic effect apparently influences the scanning curves and will substantially affect the seepage behavior. However, the previous models commonly ignore the dynamic effect and cannot quantitatively describe the hysteresis scanning loops under dynamic conditions. In this study, a dynamic hysteresis model for SWCC is proposed considering the dynamic change of contact angle and the moving of the contact line. The drying contact angle under dynamic condition is smaller than that under static condition, while the wetting contact angle under dynamic condition is larger than that under static condition. The dynamic contact angle is expressed as a function of the saturation rate according to the Laplace equation. The model is given by a differential equation, in which the slope of the scanning curve is related to the slope of the boundary curve by means of contact angle. Empirical models can simulate the boundary curves. Given the two boundary curves, the scanning curve can be well predicted. In this model, only two parameters are introduced to describe the dynamic effect. They can be easily obtained from the experiment, which facilitates the calibration of the model. The proposed model is verified by the experimental data recorded in the literature and is proved to be more convenient and effective.