• Journal of Mechanical Science and Technology
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• 제20권11호
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• pp.1942-1949
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• 2006

Typically, condensate forms as droplets on the fin surfaces and may bridge the space between the fin surfaces. This is due to the dry characteristics inherent to the fin surface. The droplets increase the air-side pressure drop. In the case of high air velocities, these droplets may be blown off the fins and entrained in the air stream. To minimize the formation of condensate droplet, the wet ability of the fins must be improved. The carry-over velocity is affected by fin surface characteristics. To avoid carry-over in the air conditioner having the highest air velocity of 1.5 m/sec, the dynamic contact angle (DCA) should be at least lowly under $60^{\circ}$.

• Korean Journal of Materials Research
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• 제23권6호
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• pp.322-328
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• 2013

The relationship the between electrical properties and surface roughness (Ra) of a wet-etched silicon wafer were studied. Ra was measured by an alpha-step process and atomic force microscopy (AFM) while varying the measuring range $10{\times}10$, $40{\times}40$, and $1000{\times}1000{\mu}m$. The resistivity was measured by assessing the surface resistance using a four-point probe method. The relationship between the resistivity and Ra was explained in terms of the surface roughness. The minimum error value between the experimental and theoretical resistivities was 4.23% when the Ra was in a range of $10{\times}10{\mu}m$ according to AFM measurement. The maximum error value was 14.09% when the Ra was in a range of $40{\times}40{\mu}m$ according to AFM measurement. Thus, the resistivity could be estimated when the Ra was in a narrow range.

• Korean Journal of Materials Research
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• 제23권6호
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• pp.316-321
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• 2013

The electrical properties and surface morphology changes of a silicon wafer as a function of the HF concentration as the wafer is etched were studied. The HF concentrations were 28, 30, 32, 34, and 36 wt%. The surface morphology changes of the silicon wafer were measured by an SEM ($80^{\circ}$ tilted at ${\times}200$) and the resistivity was measured by assessing the surface resistance using a four-point probe method. The etching rate increased as the HF concentration increased. The maximum etching rate 27.31 ${\mu}m/min$ was achieved at an HF concentration of 36 wt%. A concave wave formed on the wafer after the wet etching process. The size of the wave was largest and the resistivity reached 7.54 $ohm{\cdot}cm$ at an 30 wt% of HF concentration. At an HF concentration of 30 wt%, therefore, a silicon wafer should have good joining strength with a metal backing as well as good electrical properties.

• Korean Journal of Materials Research
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• 제16권1호
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• pp.63-67
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• 2006

The characteristics of the wet-etching of ZnO thin films were investigated using hydrochloric and phosphoric acid solutions as etchants. The etch rate of ZnO films, using highly diluted hydrochloric acid solutions at a concentration of 0.25% in deionized water, was determined to be about 120 nm/min, and linearly increased with increasing the acid concentration, resulting in $1.17{\mu}m/min$ when a 2% HCl solution was used. The surface of ZnO etched by an HCl solution, observed by scanning electron microscopy, showed a rough morphology with a high density of hexagonal pyramids or cones with sidewall angles of about ${\sim}45^{\circ}C$. Moreover, the sidewall angles of the masked area were similar to those of the pyramids on the surface. In comparison, the surface of ZnO etched by a phosphoric acid had a smooth surface morphology. The origin of this difference is from the very initial stage of etching, indicating that the etch-mechanism is different for each solution. Furthermore, when $H_3PO_4$ was added to the HCl aqueous solution, the morphology of the etched surface was greatly enhanced and the sidewall angle was also increased to about $65^{\circ}C$.

• Proceedings of the KIEE Conference
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1590-1592
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• 2000

The time to tracking breakdown of treated filled specimen is longer than untreated filled specimen. And, after the RWDT, the surface of specimen by adding untreated filler appeared heavy erosion. It was found that the addition to surface treated filler. the better tracking resistance. In the RWDT, the breakdown specimen is not affected by the dry flashover voltage. despite the fact that the surface degradation of tracking test has different state on each specimen. This suggests that wet flashover voltage play an important role in evaluating of tracking and erosion on the surface degradation in tracking test. And, the flashover voltage of specimen under wet conditions are greatly affected by the salt concentration and degree of degradation by the RWDT. Because of hydrophobicity and degree of degradation by the RWDT, the flashover voltage of treated filled specimen is higher than that of untreated filled specimen. Different types of specimen may have different hydrophobicity and their surface state under contaminated conditions may not be the same. It is assumed that this phenomenon is related to the decrease in hydrophobicity of the surface of the materials.

• Elastomers and Composites
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• 제55권1호
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• pp.26-39
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• 2020

The physical properties of silica-filled SBR compounds (WSBR) prepared using silica-SBR wet masterbatches (WMB) were systematically investigated to understand the effect of the surface treatment of silica on the reinforcement performance of SBR. Treatment of silica with bis(triethoxysilylpropyl)tetrasulfide (TESPT) in the liquid phase, followed by mixing with an SBR solution and recovery by water stripping, easily produced silica-SBR WMB. However, insufficient surface treatment in terms of the amount and stability of the incorporated TESPT led to considerable silica loss and inevitable TESPT elution. Pretreatment of silica in the gas phase with TESPT and another organic material that enabled the formation of organic networks among the silica particles on the surface provided hydrophobated silica, which could be used to produce silica-SBR WMB, in high yields of above 99%. The amount and type of organic material incorporated into silica greatly influenced the cure characteristics, processability, and tensile and dynamic properties of the WSBR compounds. The TESPT and organic material stably incorporated into silica increased their viscosity, while the organic networks dispersed on the silica surface were highly beneficial for reducing their rolling resistance. Excessive dosing of TESTP induced low viscosity and a high modulus. The presence of connection bonds formed by the reaction of glycidyloxy groups with amine groups on the silica surface resulted in physical entanglement of the rubber chains with the bonds in the WSBR compounds, leading to low rolling resistance without sacrificing the mechanical properties. Mixing of the hydrophobated silica with a rubber solution in the liquid phase improved the silica dispersion of WSBR compounds, as confirmed by their low Payne effect, and preservation of the low modulus enhanced the degree of entanglement.

• Restorative Dentistry and Endodontics
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• 제37권4호
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• pp.249-250
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• 2012

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• 제28권7호
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• pp.283-287
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• 2016

One of the most important factors for determining the thermal performance of an evaporative cooling system is the wettability of the evaporative heat exchanger surface. Evaporation of a widely spread water film on the heat exchanger surface promotes heat transfer between the "dry" air and "wet" air passages. Hydrophilic coating is generally applied on the heat exchanger surfaces to increase the wettability of the heat exchanger surface and the COP of the evaporative cooling system. In this paper, a simple lamellar patterned structure is suggested to maximize the spreading of a water film on the vertically oriented walls. The capillary height of the lamellar structured grooves is analyzed through a theoretical model, and the results are compared with the numerical analysis through a finite element analysis tool, SE-FIT. A good agreement between the theoretical model and the numerical analysis can be observed as long as the channel depth is comparable to or larger than the channel width of the lamellar structure.

• Journal of the Korean Society of Safety
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• 제5권1호
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• pp.31-39
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• 1990

In this paper, the influence of the table speed, metal removal rate and grinding fluid on long wheel workpiece contact zone at high effect grinding was investigated by theoretical analyses and measuring the temperature, and discussed by the temperature distribution in grinding surface layer. Main results obtained are as follows, 1) Rega.dless of the table speed, the temperature gap of the workpiece(heat influx) is about 6-8 times as high in dry condition as in wet condition. 2) Good grinding condition can be obtained owing to the effect of grinding fluid without any burning defect under the condition of the metal removal rate(1.0mm$^3$/mm.s) in case of wet grinding. 3) When the depth from the surface layer is about 1.25-1.5mm under the condition of the slow table speed, surface temperature goes up higher as the table speed slows down, because long contact time is laked at the surface layer. 4) In case of the same metal removal rate, the lower the table speed becomes, the higher the surface temperature is, because grinding depth has a far more influence on wheel workpiece contact zone than the table speed.

• Current Photovoltaic Research
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• 제6권3호
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• pp.86-90
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• 2018

To generate more current in crystalline silicon solar cells, surface texturing is adopted by reducing the surface reflection. Conventionally, random pyramid texturing by the wet chemical process is used for surface texturing in crystalline silicon solar cell. To achieve higher efficiency of solar cells, well ordered inverted pyramid texturing was introduced. Although its complicated process, superior properties such as lower reflectance and recombination velocity can be achieved by optimizing the process. In this study, we investigated optical and passivation properties of inverted pyramid texture. Lifetime, implied-Voc and reflectance were measured with different width and size of the texture. Also, effects of chemical rounding at the valley of the pyramid were observed.