• Journal of Welding and Joining
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• 제34권3호
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• pp.12-16
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• 2016

Friction stir welding(FSW) was studied using commercial tool, FLOW-3D. The purpose of this study is to suggest a method to apply frictional heat in Computational fluid dynamics(CFD) analysis. Cylindrical tool shape was used, and the interface cells between tool surface and workpiece were tracked by its geometrical relations in order to consider the frictional heat in FSW. After tracking the interface cells, average area concept was used to calculate the frictional heat, which is related to interface area. Also three-dimensional heat source and visco-plastic flow were modeled. The frictional heat generation rate calculated numerically from the suggested algorithm was validated with the analytical solution. The numerical solution was well matched with the analytical solution, and the maximum percentage of error was around 3%.

• 대한인간공학회지
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• 제18권3호
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• pp.55-72
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• 1999

Evaluation of user interfaces has to be performed in an intuitive and subjective manner by experts especially when the problem comes to the complexity and consistency of sophisticated interface procedures. The manual analysis and evaluation of logical interfaces also tends to be slow and laborious. To make the evaluation more formal and objective, the criteria and the procedure with which the evaluation can proceed must be explicitly prescribed. Furthermore, to make the formal procedure as practical as subjective expert evaluation, the criteria must reflect the user knowledge of the target tasks since the task knowledge plays the role of a basis for users to understand the interface organizations and procedures. This paper describes ESTIM, a support system for task-based evaluation of user interface, that includes the interface evaluation criteria and implies an evaluation procedure. The support system can be used either in an interactive manner by the analyst during the evaluation or in an automatic evaluation mode. It was verified that the result of automatic evaluation by ESTIM matched the results of expert evaluation fairly well.

• Journal of Industrial and Engineering Chemistry
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• 제68권
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• pp.14-23
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• 2018

$TiO_2-coated$ cubic ${\alpha}-Fe_2O_3$ with mostly exposed (012) and (101) facets (${\alpha}-Fe_2O_3@TiO_2$) was fabricated using a hydrothermal route for the photo-Fenton degradation of tetracycline under visible light irradiation. $TiO_2$ coating could greatly affect the photocatalytic activity of ${\alpha}-Fe_2O_3@TiO_2$. Compared with cubic ${\alpha}-Fe_2O_3$ alone for photodegradation of tetracycline, ${\alpha}-Fe_2O_3@TiO_2$ with $TiO_2$ shell of around 15 nm exhibited higher removal efficiency of tetracycline in photo-Fenton system, and its durability was slightly affected after five cycle times under same conditions. It is ascribed to the well-matched interface between cubic ${\alpha}-Fe_2O_3$ core and $TiO_2$ shell, leading to the broadened light-absorption and the efficient separation of photo-generated electon-hole pairs. The $^{\bullet}OH$ radicals were main responsible for the advanced photocatalytic performance of ${\alpha}-Fe_2O_3@TiO_2$ in visible-light driven degradation of tetracycline.

• JSTS:Journal of Semiconductor Technology and Science
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• 제10권3호
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• pp.203-212
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• 2010

In this paper, we present an analytical model for the first eigen energy level ($E_0$) of the carriers in the inversion layer in present generation MOSFETs, having ultrathin gate oxides and high substrate doping concentrations. Commonly used approaches to evaluate $E_0$ make either or both of the following two assumptions: one is that the barrier height at the oxide-semiconductor interface is infinite (with the consequence that the wave function at this interface is forced to zero), while the other is the triangular potential well approximation within the semiconductor (resulting in a constant electric field throughout the semiconductor, equal to the surface electric field). Obviously, both these assumptions are wrong, however, in order to correctly account for these two effects, one needs to solve Schrodinger and Poisson equations simultaneously, with the approach turning numerical and computationally intensive. In this work, we have derived a closed-form analytical expression for $E_0$, with due considerations for both the assumptions mentioned above. In order to account for the finite barrier height at the oxide-semiconductor interface, we have used the asymptotic approximations of the Airy function integrals to find the wave functions at the oxide and the semiconductor. Then, by applying the boundary condition at the oxide-semiconductor interface, we developed the model for $E_0$. With regard to the second assumption, we proposed the inclusion of a fitting parameter in the wellknown effective electric field model. The results matched very well with those obtained from Li's model. Another unique contribution of this work is to explicitly account for the finite oxide-semiconductor barrier height, which none of the reported works considered.

• Journal of Welding and Joining
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• 제16권4호
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• 대한조선학회논문집
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• 제41권1호
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• pp.47-54
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• 2004

The friction drag reduction of a ship is of prime importance for the design and production of high-valued/high-tech ship. Thus, this study carried out the development of reliable numerical tools to identify the friction drag reduction mechanism for turbulent boundary layer on the ship surface and to deduce the optimum reduction technique by numerical experiment. The developed LES and DNS numerical tools were applied to simulate the turbulent channel flow These results were very well matched with previous results not only qualitatively but also quantitatively. The parallelization using MPI (Message Passing Interface) technique implemented in the developed code to speed up the simulation and to obtain the accurate results from the fine grid system was testified its computational efficiency.

• The Korean Journal of Ceramics
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• 제3권1호
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• pp.13-17
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• 1997

It is identified that the diamond films grown o bias-treated (100) silicon showed different surface morphologies and film textures according to the initial applied dc bias voltage at the same growth condition. The highly oriented diamond film (HODF) was successfully grown on -200 V bias-treated silicon substrate in which the heteroepitaxial relation of $(100)_{dimond}//(100)_{si}\; and\; [110]_{diamond}//[110]_{si}$ was identified. On the contrary, the heteroepitaxial relation was considerably disturbed in the samples bias-voltage was a key factor in growing the highly oriented diamond film on (100) silicon substrate. Considering the experimental results, we proposed a new model about heteroepitaxial diamond growth on silicon, in which 9 diamond unit cell are matched with 4 silicon cells and the bond covalency of both atoms is satisfied via the intermediate layer at the interface as well.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.162-162
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• 2010

InSb has received great attentions as a promising candidate for the active layer of infrared photodetectors due to the well matched band gap for the detection of $3{\sim}5\;{\mu}m$ infrared (IR) wavelength and high electron mobility (106 cm2/Vs at 77 K). In the fabrication of InSb photodetectors, passivation step to suppress dark currents is the key process and intensive studies were conducted to deposit the high quality passivation layers on InSb. Silicon dioxide (SiO2), silicon nitride (Si3N4) and anodic oxide have been investigated as passivation layers and SiO2 is generally used in recent InSb detector fabrication technology due to its better interface properties than other candidates. However, even in SiO2, indium oxide and antimony oxide formation at SiO2/InSb interface has been a critical problem and these oxides prevent the further improvement of interface properties. Also, the mechanisms for the formation of interface phases are still not fully understood. In this study, we report the quantitative analysis of indium and antimony oxide formation at SiO2/InSb interface during plasma enhanced chemical vapor deposition at various growth temperatures and subsequent heat treatments. 30 nm-thick SiO2 layers were deposited on InSb at 120, 160, 200, 240 and $300^{\circ}C$, and analyzed by X-ray photoelectron spectroscopy (XPS). With increasing deposition temperature, contents of indium and antimony oxides were also increased due to the enhanced diffusion. In addition, the sample deposited at $120^{\circ}C$ was annealed at $300^{\circ}C$ for 10 and 30 min and the contents of interfacial oxides were analyzed. Compared to as-grown samples, annealed sample showed lower contents of antimony oxide. This result implies that reduction process of antimony oxide to elemental antimony occurred at the interface more actively than as-grown samples.

• Structural Engineering and Mechanics
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• 제53권6호
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• pp.1183-1200
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• 2015

Reinforcement corrosion can cause serious safety deterioration to aging concrete structures exposed in aggressive environments. This paper presents an approach for reliability analyses of deteriorating reinforced concrete structures affected by reinforcement corrosion on the basis of the representative symptoms identified during the deterioration process. The concrete cracking growth and rebar bond strength evolution due to reinforcement corrosion are chosen as key symptoms for the performance deterioration of concrete structures. The crack width at concrete cover surface largely depends on the corrosion penetration of rebar due to the expansive rust layer at the bond interface generated by reinforcement corrosion. The bond strength of rebar in the concrete correlates well with concrete crack width and decays steadily with crack width growth. The estimates of cracking development and bond strength deterioration are examined by experimental data available from various sources, and then matched with symptom-based lifetime Weibull model. The symptom reliability and remaining useful life are predicted from the predictive lifetime Weibull model for deteriorating concrete structures. Finally, a numerical example is provided to demonstrate the applicability of the proposed approach for forecasting the performance of concrete structures subject to reinforcement corrosion. The results show that the corrosion rate has significant impact on the reliability associated with serviceability and load bearing capacity of reinforced concrete structures during their service life.

• Corrosion Science and Technology
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• 제5권1호
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• pp.27-32
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• 2006

One of the critical issues in the coating specification is the allowable limit of surface contaminant(s) - such as soluble salt(s), grit dust, and rust - after grit blasting. Yet, there is no universally accepted data supporting the relationship between the long-term coating performance and the amount of various surface contaminants allowed after grit blasting. In this study, it was attempted to prepare epoxy coatings applied on grit-blasted steel substrate dosed with controlled amount of surface contaminants - such as soluble salt(s), grit dust, and rust. Then, coating samples were subjected to 4,200 hours of cyclic test(NORSOK M-501), which were then evaluated in terms of resistance to rust creepage, blistering, chalking, rusting, cracking and adhesion strength. Additional investigations on the possible damage at the paint/steel interface were carried out using an Electrochemical Impedance Spectroscopy(EIS) and observations of under-film-corrosion. Test results suggested that the current industrial specifications were well matched with the allowable degree of rust, whereas the allowable amount of soluble salt and grit dust after grit blasting showed a certain deviation from the specifications currently employed for fabrication of marine vessels and offshore facilities.