Adhesion reliability of flexible copper clad laminate under constant temperature and humidity condition by thickness of Ni/Cr seed layer (항온항습 조건하에서 Ni/Cr 층의 두께에 따른 FCCL의 접합 신뢰성 평가)
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- Proceedings of the KWS Conference
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- 2009.11a
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- pp.75-75
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- 2009