• Title/Summary/Keyword: Wearable Computer Cell Phone

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A Study on Interaction Service of Wearable Computer and Cell Phone (웨어러블 컴퓨터와 휴대폰의 상호작용에 대한 연구)

  • Chae, Byung-Chang;Choi, Dong-Min;Jung, Il-Yong
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2008.05a
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    • pp.861-864
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    • 2008
  • In ubiquitous computing environments that can be connected to the networks any time any where, wearable computer should be able to offer a variety service. The necessity of a variety service using wearable computer becomes more important. In this paper, we can not only provide services over interaction of wearable computer devices, but also propose the method of the better service over interaction of the cell phone.

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Technology of Flexible Semiconductor/Memory Device (유연 반도체/메모리 소자 기술)

  • Ahn, Jong-Hyun;Lee, Hyouk;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.2
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    • pp.1-9
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    • 2013
  • Recently flexible electronic devices have attracted a great deal of attention because of new application possibilities including flexible display, flexible memory, flexible solar cell and flexible sensor. In particular, development of flexible memory is essential to complete the flexible integrated systems such as flexible smart phone and wearable computer. Research of flexible memory has primarily focused on organic-based materials. However, organic flexible memory has still several disadvantages, including lower electrical performance and long-term reliability. Therefore, emerging research in flexible electronics seeks to develop flexible and stretchable technologies that offer the high performance of conventional wafer-based devices as well as superior flexibility. Development of flexible memory with inorganic silicon materials is based on the design principle that any material, in sufficiently thin form, is flexible and bendable since the bending strain is directly proportional to thickness. This article reviews progress in recent technologies for flexible memory and flexible electronics with inorganic silicon materials, including transfer printing technology, wavy or serpentine interconnection structure for reducing strain, and wafer thinning technology.