• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.577-578
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• 2006

In this paper, the rubber behavior was calculated for obtaining the optimal process condition which is for producing a transformer with a given performance. This study was carried out using the computer simulation of injection mold filling and packing simulations. In order to remove the crack of product, proper locations of the runner and cooling system configurations could be determined. Based on these results, the transformer is developed by injection molding and guidelines of part design, mold design and processing conditions are established. Finally, the cast savings, cycle time reduce and improvement of productivity will be obtained.

• Journal of Welding and Joining
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• v.15 no.6
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• pp.105-115
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• 1997

A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.427-431
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• 2005

In this study, 6' GaAs wafer bonding system is designed and optimized to bond 6 inches device wafer and material wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Vacuum module and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analysis, et al of the core modules review the designed mechanisms are very effective in performance improvement. As a result, high productivity (tack time cut-down) and stabilized process can be obtained by reducing breakage failure of wafer.

• Design & Manufacturing
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• v.12 no.3
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• pp.13-18
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• 2018

Flexible display tends to grow every year, It tends to be larger, slimmer, and higher in image quality. Therefore, accuracy is required in the manufacturing process of each part. In the curved monitor, the bottom chassis has a structure to which other parts can be attached. The accuracy of the curvature which the bottom chassis of the curve monitor monitors has is important. If the curvature error is large, serious defects such as cracks, warpage, twisting and the like occur. Curvature was analyzed using 3D scanner. In the Forming process and Restriking process steps, spring go occurred, and spring back occurred in the Notching process and Bending process steps. Even in the same process, it was confirmed that the curvature value varied depending on the formed shape.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.177-182
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• 2009

A work of thin-walled outsell injection molding technology for a plastic part of moldframe applicable in a display product was performed in the present study. The thin-walled plastic part is one of the core parts in the display product, which supports and protects a light guide plate and back light unit from external environmental conditions. It globally has the shape of rectangular and surrounds the light guide plate and back light unit for each class of inch, however, the cross section of the part is not clear to define the thickness. This causes the difficult problem of injection molding itself for the part. Moreover, a metal outsell part makes a difficult problem in injection molding over it. Because the mold temperature control of the parts are not uniform in thickness direction due to the metal part. A careful injection melding analysis and injection mold design from the analysis results have to be proceeded to obtain a production of precision moldframe. Therefore, optimization for injection molding process and analysis of warpage characteristics were studied. Consequently, it was possible from the presented virtual manufacturing process that the manufacturing of precision thin-walled outsell moldframe.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.160-165
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• 2009

A Study on Effects of the Runner and the Gate of double shot injection molded Parts using CAE Double shot injection molding can inject two different materials or two different colors in the same mold in a injection molding process. Double shot injection molded parts can be characterized that the base part maintains strength and specified part can inject soft-material. It can reduce the production cost by single automatic operations. In this paper, we designed double shot injection mold for automobile emote control To inject secondary part, this part is used as an insert after external appearance of product is injected. CAE analysis was progressed gate location and runner size as variables. The analysis result is reflected in mold design process. As a result, it could solve problems which are generated in the conventional mold. Additionally, cost can be downed by reducing runner weight. As well as it could omit painting process because the surface of finished product is improved through new mold.

• Design & Manufacturing
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• v.6 no.1
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• pp.84-89
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• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.340-348
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• 2002

Deformation analysis of injection molded articles whose geometry is considered as the assembly of thin flat plates has been conducted. For the in-mold analysis, thermo-viscoelastic stress calculation of thermo-rheologically simple amorphous polymer and in-mold deformation calculation considering the in-plane mold constraint have been done. Free volume theory has been used to represent the non-equilibrium density state during the fast cooling. At ejection, instantaneous deformation takes place due to the redistribution of in-mold residual stress. During out-of-mold cooling after ejection, thermoelastic model based on the effective temperature has been adopted for the calculation of out-of-mold deformation. In this study, emphasis is also made on the treatment with regard to lateral constraint types during molding process. Two typical mold geometries are used to test the numerical simulation modeling developed in this study.

• Design & Manufacturing
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• v.10 no.2
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• pp.50-54
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• 2016

In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.217-220
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• 2003

Due to the lighter weight and the higher freedom of design than metals plastics have been spot lighted in a wide number of applications. In the making plastic parts injection-molding process is one of the most general methods. During the injection molding process, filling-packing-cooling process, plastics have exposed to several external stresses and then plastic parts injected have molding effects which are known as anisotropic properties, orientation, and residual stress. Those molding effects are often shown as unexpected phenomena which are warpage, strength decrease, stiffness reduction, etc. In case of glass fiber filed plastics these effects are more significant than the ufilled ones. Therefore the molding effects have to be considered in the parts design using glass fiber reinforced plastics. We have developed the interface program in order to consider the molding effects in structural analyses of plastic parts using Heirarchical structural searching and layer handling in direction of thickness algorithm. The advantages of this program are the freedom of FE mesh between molding and structural analysis, the variable layer to the thickness direction of parts and the conveniences of data transferring and checking