• 대한기계학회논문집B
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• 제30권4호
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• pp.306-313
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• 2006

Automated material handling system is being used as a method to reduce manufacturing cost in the semiconductor and flat panel displays (FPDs) manufacturing process. Those are considering switch-over from the traditional cassette system to single-substrate transfer system to reduce raw materials of stocks in the processing line. In the present study, the wafer transportation speed has been evaluated by numerical and experimental method for three propulsion nozzle array (face, front, rear) in an air levitation system. Test facility for 300 mm wafer was equipped with two control tracks and a transfer track of 1,500mm length. The diameter of propulsion nozzle is 0.8mm and air velocity of wafer propulsion is $50\sim150m/s$. We found that the experimental results of the wafer transportation speed were well agreed with the numerical ones. Namely, the predicted values of the maximum wafer transportation speed are higher than those values of experimental data by 16% and the numerical result of the mean wafer transportation speed is higher than the experimental result within 20%.

• 한국세라믹학회지
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• 제46권1호
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• pp.30-34
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• 2009

A Sand blasting technology has been used to address via and trench processing of glass wafer of optic semiconductor packaging. Manufactured sand blast that is controlled by blast nozzle and servomotor so that 8" wafer processing may be available. 10mm sq test device manufactured by Dry Film Resist (DFR) pattern process on 8" glass wafer of $500{\mu}m's$ thickness. Based on particle pressure and the wafer transfer speed, etch rate, mask erosion, and vertical trench slope have been analyzed. Perfect 500 um tooling has been performed at 0.3 MPa pressure and 100 rpm wafer speed. It is particle pressure that influence in processing depth and the transfer speed did not influence.

• 한국정밀공학회지
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• 제21권3호
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• pp.66-73
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• 2004

This paper presents wafer motion modeling of transfer unit in clean tube system, which was developed as a means for transferring the air-floated wafers inside the closed tube filled with the super clean airs. When the wafer is transferred in x direction with an initial velocity the motion along x direction can be modeled as a simple decaying motion due to viscous friction of the fluid. But, the motion in y direction is modeled as a mass-spring-damper system where the recovering force by air jets issued from the perforated is modeled as a linear spring. Experiments with a clean tube system built fur 12 wafer show the validity of the presented force and motion models.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.79-80
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• 2013

• 대한기계학회논문집A
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• 제29권1호
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• pp.96-106
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• 2005

An integrated single-wafer processing tool, composed of multiple single wafer processing modules, transfer robots, and load locks, has complex routing sequences, and often has critical post-processing residency constraints. Scheduling of these tools is an intricate problem, and testing schedulers with actual tools requires too much time and cost. The Single Wafer Processor (SWP) simulator presented in this paper is to validate an on-line scheduler, and evaluate performance of integrated single-wafer processing tools before the scheduler is actually deployed into real systems. The data transfer between the scheduler and the simulator is carried out with TCP/IP communication using messages and files. The developed simulator consists of six modules, i.e., GUI (Graphic User Interface), emulators, execution system, module managers, analyzer, and 3D animator. The overall framework is built using Microsoft Visual C++, and the animator is embodied using OpenGL API (Application Programming Interface).

• 한국정밀공학회지
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• 제31권8호
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• pp.697-703
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• 2014

This paper is study of solving vibration problem occurred in moving hand of wafer transfer robot in semiconductor manufacturing line. Long settling time for decreasing vibration makes low production rate, and moreover the excessive vibration of hand sometimes breaks the wafer in a cassette. The ways of reducing the moving speed and changing the type of motion profile did not help for lessening vibration. Therefore, we analyzed the mechanical property of the hand such as natural frequency, and frequency component of the motion profile currently used in the manufacturing line. In several conditions of motion profile, we found the best condition of which the frequency component in near of natural frequency of the hand is minimal and this induced small vibration in moving hand. The results were verified theoretically and experimentally using frequency analysis.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.860-864
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• 2003

Recently. use of compound semiconductor is widely increasing in the area of LED and RF device. In this study, wafer bonding module is designed and optimized to bond 6 inches device wafer and carrier wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Load spreader and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analyses show the designed mechanisms are very effective in performance improvement.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 춘계학술대회 발표 논문집
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• pp.80-87
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• 2003

On this study, an End-Effector for the 300mm wafer transfer robot System is newly suggested. It is a mechanical type with $180^{\circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor. It is controlled by microchip for the DC motor control. To design, relationships on the gripping force and the wafer deformation is analyzed by FEM analysis. Criterion on gripping force of a suggested End-Effector is confirmed as $255 ~ 274g_f$ from experimental results. From experimented results on repeatable position accuracy, gripping force and gripping cycle times in a wafer cleaning system, we confirmed that the suggested End-Effector is well satisfied on the required performance for 300mm wafer transfer robot system.

• 센서학회지
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• 제15권5호
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• pp.341-346
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• 2006

We have fabricated SOI CMOS active pixel image sensor with the pinned photodiode on handle wafer in order to reduce dark currents and improve spectral response. The structure of the active pixel image sensor is 4 transistors APS which consists of a reset and source follower transistor on seed wafer, and is comprised of the photodiode, transfer gate, and floating diffusion on handle wafer. The source of dark current caused by the interface traps located on the surface of a photodiode is able to be eliminated, as we apply the pinned photodiode. The source of dark currents between shallow trench isolation and the depletion region of a photodiode can be also eliminated by the planner process of the hybrid bulk/SOI structure. The photodiode could be optimized for better spectral response because the process of a photodiode on handle wafer is independent of that of transistors on seed wafer. The dark current was about 6 pA at 3.3 V of floating diffusion voltage in the case of transfer gate TX = 0 V and TX=3.3 V, respectively. The spectral response of the pinned photodiode was observed flat in the wavelength range from green to red.

• 한국가시화정보학회지
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• 제20권3호
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• pp.58-66
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• 2022

The high heat emitted from the process module and heat jacket may cause errors in semiconductor process equipment. Barriers were designed to reduce the temperature of surface on transfer module. A designed barrier was compared and analyzed by numerical analysis using ANSYS Fluent. The average temperature of barrier and effect of radiation heat transfer were also compared through absorbed radiative heat flux of the barrier. The adoption of the barrier had an effect on the radiative heat transfer reduction of the transfer module rod. The effect of the angles of barrier from 50° to 90° on the heat transfer was investigated using the absorbed radiative heat flux with the average temperature. The angle of barrier of 50° reduced the temperature up to 9.6 %.