• Journal of Intelligence and Information Systems
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• v.15 no.4
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• pp.1-22
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• 2009

The World Wide Web is transitioning from being a mere collection of documents that contain useful information toward providing a collection of services that perform useful tasks. The emerging Web service technology has been envisioned as the next technological wave and is expected to play an important role in this recent transformation of the Web. By providing interoperable interface standards for application-to-application communication, Web services can be combined with component based software development to promote application interaction and integration both within and across enterprises. To make Web services for service-oriented computing operational, it is important that Web service repositories not only be well-structured but also provide efficient tools for developers to find reusable Web service components that meet their needs. As the potential of Web services for service-oriented computing is being widely recognized, the demand for effective Web service discovery mechanisms is concomitantly growing. A number of techniques for Web service discovery have been proposed, but the discovery challenge has not been satisfactorily addressed. Unfortunately, most existing solutions are either too rudimentary to be useful or too domain dependent to be generalizable. In this paper, we propose a Web service organizing framework that combines clustering techniques with string matching and leverages the semantics of the XML-based service specification in WSDL documents. We believe that this is one of the first attempts at applying data mining techniques in the Web service discovery domain. Our proposed approach has several appealing features : (1) It minimizes the requirement of prior knowledge from both service consumers and publishers; (2) It avoids exploiting domain dependent ontologies; and (3) It is able to visualize the semantic relationships among Web services. We have developed a prototype system based on the proposed framework using an unsupervised artificial neural network and empirically evaluated the proposed approach and tool using real Web service descriptions drawn from operational Web service registries. We report on some preliminary results demonstrating the efficacy of the proposed approach.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.1-7
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• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.