• Journal of Powder Materials
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• v.11 no.1
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• pp.43-49
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• 2004

The electrical and thermal conductivity of W-Cu composites were investigated as a function of the W-particle size and W-W contiguity. Powder mixtures were prepared by ball milling or mechanical alloying process, and then sintered at various temperatures. The electrical conductivity of sintered composite was increased with decreasing W grain size. Dependence of electrical conductivity on the W grain size was explained by the W-W contiguity concept. The thermal conductivity was increased with increasing the temperature up to $600^{\circ}C$ but decreased at the temperature above $600^{\circ}C$ Also, thermal conductivity value was influenced by the W particle size. Change of thermal conductivity in W-Cu composites was discussed based on the observed microstructural characteristics and theoretical considerations.

• Korean Journal of Materials Research
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• v.15 no.2
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• pp.85-88
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• 2005

[ $W-15wt.\%$ ] Cu nanocomposite powders are fabricated by ball-milling and subsequent hydrogen-reduction. The compacted parts of $W-15wt.\%Cu$ nanocomposite powders were sintered at $1200^{\circ}C$ for 1 h with various heating rates of 5 and $20^{\circ}C/min$. The homogeneity of the sintered microstructures was evaluated through homogeneity index by the standard deviation of Victor's hardness test. The W-W contiguities were calculated by using Voronoi diagrams. The sintered microstructure with the heating rate of $20^{\circ}C/min$ was more homogeneous and had lower W-W contiguity than that of $5^{\circ}C/min$. The microstructural homogeneity was directly related to the W-W contiguity. Thermal conductivity of the sintered parts with the heating rate of $20^{\circ}C/min$ was higher than that with heating rate of $5^{\circ}C/min$. This phenomenon indicates that the thermal conductivity is affected by the W-W contiguity resulting from the homogeneity of the sintered microstructure.

• Journal of Powder Materials
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• v.20 no.2
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• pp.138-141
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• 2013

The microstructure evolution during sintering of the W-5 wt.%Cu nanocomposite powders was investigated for the purpose of developing a high density W-Cu alloy. The W-5 wt.%Cu nanopowder compact, fully-densified during sintering at 1623 K, revealed a homogeneous microstructure that consists of high contiguity structures of W-W grains and an interconnected Cu phase located along the edges of the W grains. The Vickers hardness of the sintered W-5 wt.%Cu specimen was $427{\pm}22$ Hv much higher than that ($276{\pm}19$ Hv) of the conventional heavy alloy. This result is mostly due to the higher contiguity microstructure of the W grains compared to the conventional W heavy alloy.

• Journal of Powder Materials
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• v.5 no.1
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• pp.35-41
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• 1998

The effect of Mn on the densification and the microstructural change in W heavy alley was investigated with adopting the improved Mn-adding method. In order to avoid the pore formation problems associated with Mn powder mixing to the other constituent powders, Mn was added afterwards to the sintered heavy alloy; Mn powder was spread homogeneously on the surface of the sintered heavy alloy compact, and this Mn powder contained specimen was resintered at the same sintering temperature. As expected, the resintered specimen showed the pore free microstructure because Mn was reduced separately from the other constituent elements. It was also founded that W grains grew rapidly at the initial stage of resintering treatment due to the activated reprecipitation of the excess W atoms substituted by Mn atoms, but the growth rate of W grains was slowly lowered with the prolonged sintering time, especially, compared to the Mn free heavy alloy. Such a retardation of grain growth should be attributed to the decreased W solubility in the Mn contented matrix phase. Furthermore, Mn addition resulted in the decrease of contiguity by improving the wetting between matrix phase and W grain.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.3
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• pp.465-471
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• 2007

The one step type pole and two step type pole are used in KEPCO's distribution system. The neutral current increases in three-phase four-wire distribution system due to unbalanced load. Usually, power line and communication line are installed at contiguity by effect of topography in Korea. To this end, the damages such as electrostatic induction, electromagnetic induction and harmonic induction generated by induced voltage and current are occured in power line and communication line. This paper calculates the neutral current in KEPCO's distribution system using EMTP by composing various simulated conditions. Also, these results are verified by vector analysis.

• International Journal of Precision Engineering and Manufacturing
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• v.5 no.1
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• pp.19-26
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• 2004

The growth of solid particles in TiC-XC-2vo1.% and TiC-XC-30vo1.% Ni alloys, (where X=Zr, W or Mo) was fitted to the equation of the form $d^3$-${do}^3$=Kt during the liquid phase sintering at 1,673K. Also, the grain growth behavior decreased markedly with the addition of ${MO}_2$C or WC and increased with the addition of zrC. The contiguity was greater in the alloys with a smaller growth rate constant and especially, decreased by increasing the Ni content in the TiC-${MO}_2$C-Ni alloy. In addition, the effect of the addition of carbide on the grain growth of 2 vo1.% Ni alloys was found to be similar to that of 30vo1.% Ni alloys. Consequently, the grain growth mechanism cannot be explained by the usual solution / reprecipitation process, but can be explained in terms of a new growth velocity equation, which includes the effects of contiguous carbide grain boundaries in restricting the overall grain growth, as well as the area of the solid / liquid interface in the alloy.

• Korean Journal of Materials Research
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• v.12 no.10
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• pp.825-830
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• 2002

The growth rate of solid grains in TiC-XC-2vol% and TiC-XC-30vo1% Ni cermets, where X=Zr, W or Mo, was fitted to an equation of the form $d^3$-$do^3$=Kt. The grain growth behavior during liquid phase sintering at 1673K decreased markedly with addition of $Mo_2$C or WC and increased with addition of ZrC. The contiguity ratio was greater in the alloys with smaller growth rate constant and decreased with increasing Ni content in the $TiC-Mo_2$C-Ni cermet. The grain growth mechanism could be explained by the effect of contiguous grain boundaries in restricting the overall grain growth.