• Title/Summary/Keyword: Void growth

검색결과 119건 처리시간 0.028초

W 및 Ti 박막 위에서 나노결정질 다이아몬드의 성장 거동 (Growth of Nanocrystalline Diamond on W and Ti Films)

  • 박동배;명재우;나봉권;강찬형
    • 한국표면공학회지
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    • 제46권4호
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    • pp.145-152
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    • 2013
  • The growth behavior of nanocrystalline diamond (NCD) film has been studied for three different substrates, i.e. bare Si wafer, 1 ${\mu}m$ thick W and Ti films deposited on Si wafer by DC sputter. The surface roughness values of the substrates measured by AFM were Si < W < Ti. After ultrasonic seeding treatment using nanometer sized diamond powder, surface roughness remained as Si < W < Ti. The contact angles of the substrates were Si ($56^{\circ}$) > W ($31^{\circ}$) > Ti ($0^{\circ}$). During deposition in the microwave plasma CVD system, NCD particles were formed and evolved to film. For the first 0.5h, the values of NCD particle density were measured as Si < W < Ti. Since the energy barrier for heterogeneous nucleation is proportional to the contact angle of the substrate, the initial nucleus or particle densities are believed to be Si < W < Ti. Meanwhile, the NCD growth rate up to 2 h was W > Si > Ti. In the case of W substrate, NCD particles were coalesced and evolved to the film in the short time of 0.5 h, which could be attributed to the fact that the diffusion of carbon species on W substrate was fast. The slower diffusion of carbon on Si substrate is believed to be the reason for slower film growth than on W substrate. The surface of Ti substrate was observed as a vertically aligned needle shape. The NCD particle formed on the top of a Ti needle should be coalesced with the particle on the nearby needle by carbon diffusion. In this case, the diffusion length is longer than that of Si or W substrate which shows a relatively flat surface. This results in a slow growth rate of NCD on Ti substrate. As deposition time is prolonged, NCD particles grow with carbon species attached from the plasma and coalesce with nearby particles, leaving many voids in NCD/Ti interface. The low adhesion of NCD films on Ti substrate is related to the void structure of NCD/Ti interface.

화강암질풍화토(花崗岩質風化土)의 역학적(力學的) 성질(性質)에 관(關)한 연구(硏究) -전단강도(剪斷强度)의 영향요소(影響要素)와 견밀도(堅密度)에 대(對)하여- (Studies on the Mechanical Properties of Weathered Granitic Soil -On the Elements of Shear Strength and Hardness-)

  • 조희두
    • 한국산림과학회지
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    • 제66권1호
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    • pp.16-36
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    • 1984
  • 화강암질풍화토(花崗岩質風化土)의 미교란(未攪亂) 시료(試料)를 사용하여 일면(一面) 직접(直接) 전단시험(剪斷試驗)으로 측정(測定)한 전단강도(剪斷强度)와 함수비(含水比), 간극비(間隙比), 건조밀도(乾燥密度), 비중(比重)과의 관계(關係)를 통계(統計) 분석(分析)하였고, 화강암질풍화토(花崗岩質風化土)의 사방시공지(砂防施工地)에 식재(植栽)된 리기다소나무림(林)과 리기테-다소나무림(林)에서 토양단면(土壤斷面)을 만들어 산중식토양경도계(山中式土壤硬度計)로 토양(土壤)의 견밀도(堅密度)를 측정(測定)하고 수근분포(樹根分布)를 조사(調査)하여 통계(統計) 분석(分析)한 결과(結果) 다음과 같다. 1) 함수비(含水比), 간극비(間隙比)와 전단강도(剪斷强度) 간(間)에는 유의적(有意的)인 부(負)의 상관(相關)이며 직접적(直接的)인 관계(關係)에 있었다. 2) 건조밀도(乾燥密度)와 전단강도(剪斷强度) 사이에는 정(正)의 상관(相關)이며 직접적(直接的)인 관계(關係)에 있었다. 3) 비중(比重)과 전단강도(剪斷强度) 간(間)에는 유의적(有意的)인 상관관계(相關關係)를 인정(認定)할 수 없었다. 4) 전단강도(剪斷强度)에 영향(影響)을 미치는 영향요소(影響要素)의 직접효과(直接效果)의 크기는 함수비(含水比)>간극비(間隙比)>건조밀도(乾燥密度)의 순위(順位)이다. 5) 다중선형(多重線型) 회귀방정식(回歸方程式)의 분산분석결과(分散分析結果) 함수비(含水比)만이 회귀성(回歸性)이 인정(認定)되므로 함수비(含水比)를 독립변수(獨立變數)로 하여 전단강도(剪斷强度)를 추정(推定)하기 위한 회귀방정식(回歸方程式)은 제한(制限)된 건조밀도(乾燥密度)의 범위내(範圍內)에서 적합도(適合度)가 매우 높게 평가(評價)되었다. 6) 토양(土壤)의 견밀도(堅密度)는 토심(土深)이 깊어짐에 따라 높아진다. 7) 토양(土壤)의 지표경도(指標硬度)와 수근수(樹根數) 간(間)에는 유의적(有意的)인 부(負)의 상관(相關)이며 직접적(直接的)인 관계(關係)에 있었다. 8) 리기다소나무와 리기테-다소나무의 수근(樹根)은 토심(土深) 20cm까지에 대부분 분포(分布)하고 있었다. 9) 리기다소나무림(林)과 리기테-다소나무림(林)에서 측정(測定)한 토양(土壤)의 지표경도(指標硬度)를 독립변수(獨立變數)로한 회귀방정식(回歸方程式)으로 수근수(樹根數)를 추정(推定)할 수 있었으나 낮은 적합도(適合度)를 나타내었다.

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Electromigration and Thermomigration in Flip-Chip Joints in a High Wiring Density Semiconductor Package

  • Yamanaka, Kimihiro
    • 마이크로전자및패키징학회지
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    • 제18권3호
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    • pp.67-74
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    • 2011
  • Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

현대 건축에서 라움플란(Raumplan)과 플랑리브르(Plan Libre) 개념의 변용에 관한 연구 (A Study on the Application of the Raumplan and Plan Libre concepts in the Contemporary Architecture)

  • 박몽섭;조극래
    • 한국실내디자인학회논문집
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    • 제13권2호
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    • pp.29-37
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    • 2004
  • This study analyze the architectural space in the aspect of the 'Raumplan' and 'Plan Libre'. These concepts based on the 'Raumplan versus Plan Libre' exhibition in Delft University, Netherlands. It is generally agreed that the concept of 'Plan Libre' in connection with Le Corbusie architecture and 'Raumplan' related to Adolf Loos's works. that exhibition contents was focused an extent of modem architecture. But, These concepts continually influence contemporary architecture and offer diverse vision in architecture. Therefore, this study focused on the analysis that look for common element in the space through the case study and space element connection in change of the values, technical growth. This Paper reveals that Adolf Loos's Raumplan is similar to Louis I. Kahn's 'Room' concept and Ando Tadao's centrifugal space composition method In the dwelling architecture. And the concept 'Plan Libre': non-definitive formal system and the elements : column, free form screening wall is revived as formal application of 3 dimension composition in architecture. and transfer lots, void, and linear space in Rem Koolhaas's urban design projects. These aspects is so called topology. This topological concept is an attempt in view of the space connection state rather than formative viewpoint.

횡방향 하중을 받는 금속모재 복합재료의 파손구조 (Failure Mechanism of Metal Matrix Composites Subject to Transverse Loading)

  • 함종호;이형일;조종두
    • 대한기계학회논문집A
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    • 제24권6호
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    • pp.1456-1469
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    • 2000
  • Mechanical behaviors of uniaxially fiber-reinforced metal matrix composites under transverse loading conditions were studied at room and elevated temperatures. A mono-filament composite was selecte d as a representative analysis model with perfectly bonded fiber/matrix interface assumption. The elastic-plastic and visco-plastic models were investigated by both theoretical and numerical methods. The product of triaxiality factor and effective strain as well as stress components and strain energy was obtained as a function of location to estimate the failure sites in fiber-reinforced metal matrix composite. Results showed that fiber/ matrix interfacial debond plays a key role for local failure at the room temperature, while void creation and growth in addition to the interfacial debond are major concerns at the elevated temperature. It was also shown that there would be an optimal diameter of fiber for the strong fiber-reinforced metal matrix composite.

R.F Magnetron Sputtering법으로 제조한 TiO2 박막의 특성 (Characteristics of TiO2 Thin Films Fabricated by R.E, Magnetron Sputtering)

  • 추용호;최대규
    • 한국재료학회지
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    • 제14권11호
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    • pp.821-827
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    • 2004
  • Titanium oxide thin films were prepared on Si(100) substrates by R.F. magnetron reactive sputtering at $30\sim200watt$ R.F power range, and annealed at $600^{\circ}C\sim800^{\circ}C$ for 1 hour. The properties of $TiO_2$ thin films were analyzed using x-ray, ${\alpha}-step$, ellipsometer, scanning electron microscopy, and FT-IR spectrometer. Upon in-situ depositions, the initial phase of $TiO_2$ thin film showed non-crystalline phase at R.F. power $30\sim100$ watt. The crosssection of $TiO_2$ thin films were sbserved to be the columnar structure. With the increasing R.F power and annealing temperature, the grain size, crystallinity, refractive index, and void size of titanium oxides showed a tended to increase. The FT-IR transmittance spectra of titanium oxide thin films have the obsorption band of Ti-O bond, Si-O bond, Si-O-Ti bond and O-H bond. With the increase of R.F. power and annealing temperature, these films have the stronger bond structures. It is considered that such a phenomena is due to phase transition and good crystallinity

찰진흙개간지의 암반비수에 관한 연구(I) (Studies on Heavy Clay Soil of Tile Drainage)

  • 김시원
    • 한국농공학회지
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    • 제9권2호
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    • pp.1296-1300
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    • 1967
  • This study was made through the utilization of heavy soil taken from the experimental plot of heavy soil in Konkuk University, Changan-dong, Sungdong-ku, Seoul. The soil used in the experiment has the following physical characteristics: 1. The soil is very compact, impervious, and unfit for any plant growth, 2. For improvement of the soil, tile drainage practice has been employed, 3. According to the general theory of tile drainage, it is unnatural that the effect of drainage is actually observed in such a soil. The followings are the results of the experiment: 1. Water moved to crosswise when the plotted soil profile was not broke. In this case the upper sloped part was dry while the bottom part was moistned. The upper part of the tile was also moistned. 2. The crosswise movement of water was not observed in the artificially broken plot of subsoil. However, the water flow from the tile was observed for long period as a result of the increase of soil void, seepage, aeration, and water holding capacity. However, the water flow from the tile in the plot of unbroken subsoil was observed only in short period and soon the flow was stopped. 3. the distance between the tile laid in the heavy soil should not exceed 10m for the efficient drainage. 4. When the pF is 2.5 in the subsoil the moisture content was between 23.97% and 28.20%. However, when the water saturated in the subsoil the moisture content was between 34.30% and 22.10%. Accordingly without the higher pF than 2.5 the water can not be absorbed and therefore the drainage can not be occured.

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비소성 무기결합재를 사용한 무시멘트 다공성 식생콘크리트의 물리·역학적 특성 및 동결융해저항성 평가 (Physical, Mechanical Properties and Freezing and Thawing Resistance of Non-Cement Porous Vegetation Concrete Using Non-Sintering Inorganic Binder)

  • 김황희;김춘수;전지홍;박찬기
    • 한국농공학회논문집
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    • 제56권5호
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    • pp.37-44
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    • 2014
  • The physical, mechanical and freezing and thawing properties of non cement porous vegetation concrete using non-sintering inorganic binder have been evaluated in this study. Four types of porous vegetation concrete according to the binder type is evaluated. The pH value, void ratio, compressive strength, repeated freezing and thawing properties were tested. The test results indicate that the physical, mechanical and repeated freezing and thawing properties of porous vegetation concrete using the non-sintering inorganic binder is increased or equivalent compared to the porous vegetation concrete using the blast furnace slag + cement and hwang-toh + cement binders. Also, Vegetation monitoring test results indicate the porous vegetation concrete using the non-sintering inorganic binder have increasing effects of vegetation growth.

Efficiency Estimation of Toxicity Free Eire Resistance Cable

  • Yoon, Hun-Ju;Hon, Jin-Woong
    • Transactions on Electrical and Electronic Materials
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    • 제3권3호
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    • pp.34-38
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    • 2002
  • In this paper, efficiency estimation of toxicity fee fire resistance cable experiments was measured smoke density of toxicity free fire resistance polyolefin insulation material and electric field dependence of tree shape in low density polyethylene (LDPE). One of the most serious causes of failure in high-voltage cables, can be an electrical discharge across an internal gab or void in the insulating material. Treeing due to partial discharge is one of the main causes of breakdown in the insulating materials and reduction of the insulation life. Therefore the necessity for establishing a method to diagnose the aging of insulation materials and to predict the breakdown of insulation and research of the fire resistance character has become important. First, we have studied on electric field dependence of tree shape in LDPE about treeing phenomena occurring on the high electrical field. Second, the measurement method is the attenuation quantity of irradiation by smoke accumulating with in a closed chamber due to non-flaming heat decomposition and flaming combustion. A main cause of fire-growth and generating toxic gas when, it bums, should be dealt with great care in life. safety design. The fire gases were occurred carbon monoxide and decomposition than in polyolefin due to incomplete combustion of PVC, which has high content of carbon in chemical compound.

보강재를 첨가한 YBCO 초전도체의 기계적강도 변화 (Mechanical Properties of YBCO Superconductors with Impregnation Materials)

  • 이남일;장건익;이상헌;김찬중
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.247-248
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    • 2006
  • Bulk YBCO 초전도체는 top-seeded melt-growth 방법으로 제조되었다. YBCO bulk는 Epoxy resin과 $AgNO_3$를 보강해 초전도체의 기계적 강도를 향상하고자 하였다. Epoxy resin은 보강 재료인 STYCAST 2850-FT와 경화제인 CATALYST 24LV 를 100:5 비율로 혼합하여 제조한 후 mould에 넣고 $66^{\circ}C$에서 2시간 열처리 하였다 (rotary pump로 진공 분위기 조성). $AgNO_3$$350^{\circ}C$에서 2시간, $450^{\circ}C$에서 1시간 열처리 하여 Ag와 $NO_3$의 분리 후 YBCO bulk에 Ag가 보강되도록 하였다. Epoxy resin 과 분리된 Ag는 YBCO bluk의 crack과 void에 침투되는 것을 SEM과 광학현미경을 통해 관찰할 수 있었다. Three point bending test를 이용하여 보강 전후의 YBCO bulk의 기계적 강도를 측정하였다. 보강 후의 YBCO bluk의 기계적 강도는 보강 전에 비해 향상된 결과를 확인할 수 있었고, Epoxy resin과 $AgNO_3$를 보강한 YBCO는 기계적 강도 향상에 높은 신뢰성을 보이고 있다.

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