• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of Mechanical Science and Technology
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• v.20 no.2
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• pp.197-204
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• 2006

The purpose of this study is to evaluate the AE characteristics for the basemetal, PWHT (post-weld heat treatment) and weldment specimens of SA-516 steel during fracture testing. Four-point bending and AE tests were conducted simultaneously. AE signals were emitted in the process of plastic deformation. AE signal strength and amplitude of the weldment was the strongest, followed by PWHT specimen and basemetal. More AE signals were emitted from the weldment samples because of the oxides, and discontinuous mechanical properties. AE signal strength and amplitude for the basemetal or PWHT specimen decreased remarkably compared to the weldment because of lower strength. Pre-cracked specimens emitted even lower event counts than the corresponding blunt notched specimens. Dimple fracture from void coalescence mechanism is associated with low-level AE signal strength for the basemetal or PWHT. Tearing mode and dimple formation were shown on the fracture surfaces of the weldment, but only a small fraction produced detectable AE.

• Nuclear Engineering and Technology
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• v.34 no.4
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• pp.286-300
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• 2002

An algorithm for the sodium boiling model has been developed for calculation of the void reactivity feedback as well as the fuel and cladding temperatures in the KALIMER core after onset of sodium boiling. Modeling of sodium boiling in liquid metal reactors using sodium as a coolant is necessary because of phenomenon difference comparing with that observed generally in light water reactor systems. The applied model to the algorithm is the multiple-bubble slug ejection model. It allows a finite number of bubbles in a channel at any time. Voiding is assumed to result from formation of bubbies that (ill the whole cross section of the coolant channel except for the liquid film left on the cladding surface. The vapor pressure, currently, is assumed to be uniform within a bubble The present study is focused on not only demonstration of the vapor bubble behavior predicted by the developed model, but also confirmation of a qualitative acceptance for the model. As a result, the model can represent important phenomena in the sodium boiling, but it is found that further effort is also needed for its completition.

• Korean Journal of Materials Research
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• v.32 no.4
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• pp.223-229
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• 2022

A porous photocatalyst concrete filter was successfully produced to remove NOx, by mixing TiO₂ photocatalyst with lightweight aerated concrete. Ultra Fine Bubbles were used to form continuous pores inside the porous photocatalytic concrete filter, which was mixed via a bubble generation experiment. The optimal mixing condition was determined to be with 4 % of the bubble generation agent B. NO removal specimens were prepared for various photocatalytic loading conditions, and the specimen containing 3 % P-25 removed NO at a concentration of 1.03 µmol in 1 h. The NO removal rate of the porous photocatalytic concrete filter prepared in this study was 10.99 %. This photocatalytic filter performance was more than 9 times the amount of NO removed by a general photocatalytic filter. The porous photocatalyst concrete filter for removing NOx developed in this study can be applied to various construction sites and the air quality can be solved by reducing NOx contributing to the formation of fine particles.

• The Bulletin of The Korean Astronomical Society
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• v.44 no.2
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• pp.40.1-40.1
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• 2019

We report progress on identifying cosmic voids using cluster halos as the antipode. According to the standard scenario of structure formation, clusters are expected to form at peaks of the initial density field, whereas cosmic voids form at troughs. Then, a cluster would be a void if the sign of the initial density fluctuation of the universe were inverted. To study the relevance of anti-structures of clusters to cosmic voids, we use a pair of simulations whose initial density fields are sign inverted versions to each other. By examining the spatial distribution and environment of the particles in inverted simulation, which are the member particles of clusters in the other simulation, we discuss the characteristics of the antipode structures of clusters including their size, density, internal structure, and redshift evolution as well.

• Journal of the Korean Society of Propulsion Engineers
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• v.16 no.5
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• pp.47-57
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• 2012

A modified ignition and growth(I&G) model which is necessary to simulate the combustion phenomena of energetic materials and an analytical model determining the unknown parameters of the reaction rate equation are proposed. The modified I&G model sustains important physical implications with overcoming some problems of previous rate equations. This rate model consists of ignition term which represents the formation of the hotspot due to void collapse and growth term which means the shock to detonation transition phenomena. Also, the theoretical model is used to investigate the combustion characteristics of certain energetic materials before running Hydrocode by pre-determination of unknown parameter, $b,\;G,\;x,\;I$. The analytical model provides efficient and highly accurate results rather than previous method which simulated the unconfined-rate-stick via the numerical means.

• Journal of Korean Society of Water and Wastewater
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• v.10 no.1
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• pp.112-120
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• 1996

In this study, the porous glass media was utilized as biomass carrier, and the optimum characteristics of this new media in fixed bed biofilm process were investigated. The characteristics of media considered here are a void volume fraction, a specific surface area, and surface characteristics of media. The effect of surface roughness and material could be clearly demonstrated by the fact that the porous glass media showed a good potential for biofilm development. This might results from the fact that biofilm is initially formed in the surface cavities of the media is protect from the shear effect. Therefore, the microcolonies are not readily detached by the fluid shear. In the steady state, biofilm formation along the packing bed depth was different from media to media. The specific area was also an important factor for the attachment of microorganism on the media surface. The specific area was also an important factor for the attachment of microorganism on the media surface. In the case of porous glass media, about $100m^2/m^3$ was enough to obtain a good organic removal efficiency The organic removal efficiency could be improved by increasing the void volume fraction in the reactor, at least 80% was required to obtain a high removal efficiency and prevent clogging. From the analysis of kinetics study, the yield coefficient, Y, was 0.42 mgMLSS/mgSBOD, endogenous respiration coefficient, ke, was $0.12day^{-1}$ and substrate removel coefficient of Mckinney. km, was $16.8hr^{-1}$ for the porous glass media G-2

• Environmental Engineering Research
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• v.13 no.1
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• pp.19-27
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• 2008

Simultaneous removal of ternary gases of $NH_3$, $H_2S$ and toluene in a contaminated air stream was investigated over 180 days in a biofilter. A commercially available inorganic/polymeric composite chip with a large void volume (bed porosity > 0.80) was used as a microbial support. Multiple microorganisms including Nitrosomonas and Nitrobactor for nitrogen removal, Thiobacillus thioparus (ATCC 23645) for $H_2S$ removal and Pseudomonas aeruginosa (ATCC 15692), Pseudomonas putida (ATCC 17484) and Pseudomonas putida (ATCC 23973) for toluene removal were used simultaneously. The empty bed residence time (EBRT) ranged from 60 - 120 seconds and the inlet feed concentration was $0.0325\;g/m^3-0.0651\;g/m^3$ for $NH_3$, $0.0636\;g/m^3-0.141\;g/m^3$ for $H_2S$, and $0.0918\;g/m^3-0.383\;g/m^3$ for toluene, respectively. The observed removal efficiency was 2% - 98% for $NH_3$, 2% - 100% for $H^2S$, and 2% - 80% for toluene, respectively. Maximum elimination capacity was about $2.7\;g/m^3$/hr for $NH_3$, > $6.4\;g/m^3$/hr for $H_2S$ and $4.0\;g/m^3$/hr for toluene, respectively. The inorganic/polymeric composite carrier required 40 - 80 days of wetting time for biofilm formation due to the hydrophobic nature of the carrier. Once the surface of the carrier was completely wetted, the microbial activity became stable. During the long-term operation, pressure drop was negligible because the void volume of the carrier was two times higher than the conventional packing materials.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.281-287
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• 2005

in-situ electromigration test was carried out for edge drift lines of eutectic SnPb solder using Scanning Electron Microscopy (SEM). The electromigration test for the eutectic SnPb solder sample was conducted at temperature of $90^{\circ}C$ and the current density of $6{\times}10^4A/cm^2$. Edge drift at cathode and hillock growth at anode were observed in-situ in a SEM chamber during electromigration test. It was clearly revealed that eutectic SnPb solder lines has an incubation stage before void formation during electromigration test, which seemed to be related to the void nucleation stage of flip chip solder electromigration behaviors.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.43-48
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• 2004

Electromigration of Sn-3.5Ag-0.5Cu solder bumps was investigated with current densities of $3{\~}4{\times}10^4 A/cm^2$ at temperatures of $130{\~}160^{\circ}C$ using flip chip specimens which consisted of upper Si chip and lower Si substrate. Electromigration failure of the Sn-3.5Ag-0.5Cu solder bump occurred with complete consumption of Cu UBM and void formation at cathode side of the solder bump. The activation energies for electromigration of the Sn-3.5Ag-0.5Cu solder bump were measured as 0.61 eV at current density of $3{\times}10^4 A/cm^2$, 0.63 eV at $3.5{\times}10^4 A/cm^2$, and 0.77 eV at $4{\times}10^4 A/cm^2$, respectively.