• Transactions on Electrical and Electronic Materials
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• v.11 no.1
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• pp.42-47
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• 2010

Polymer insulating materials such as cross linked polyethylene (XLPE) are employed in electric cables used for extra high voltage. These materials can degrade due to chemical, mechanical and electric stress, possibly caused by voids, the presence of extrinsic materials and protrusions. Therefore, this study measured discharge patterns, discharge phase angle, quantity and occurrence frequency as well as changes in XLPE under different temperatures and applied voltages. To quantitatively analyze the irregular partial discharge patterns measured, the discharge patterns were examined using a statistical program. A three layer sample was fabricated, wherein the upper and lower layers were composed of non-void XLPE, while the middle layer was composed of an air void and copper particles. After heating to room temperature and $50^{\circ}C$ and $80^{\circ}C$ in silicone oil, partial discharge characteristics were studied by increasing the voltage from the inception voltage to the breakdown voltage. Partial discharge statistical analysis showed that when the K-means clustering was carried out at 9 kV to determine the void discharge characteristics, the amount discharged at low temperatures was small but when the temperature was increased to $80^{\circ}C$, the discharge amount increased to be 5.7 times more than that at room temperature because electric charge injection became easier. An analysis of the kurtosis and the skewness confirmed that positive and negative polarity had counterclockwise and clockwise clustering distribution, respectively. When 5 kV was applied to copper particles, the K-means was conducted as the temperature changed from $50^{\circ}C$ to $80^{\circ}C$. The amount of charge at a positive polarity increased 20.3% and the amount of charge at a negative polarity increased 54.9%. The clustering distribution of a positive polarity and negative polarity showed a straight line in the kurtosis and skewness analyses.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1673-1675
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• 2001

In this paper, Partial Discharge(PD) patterns are compared by means of Low Frequency PD(LFPD, based on the IEC 270) and recently proposed High Frequency PD(HFPD). For this purpose, three different types of artificial defects are provided such as corona in air, void in epoxy insulator and needle defect in XLPE cable insulation. PD were generated from each defect and then detected respectively by two different methods such as LFPD and HFPD. As a result, remarkable resemblance in PD pattern for differ detecting method have been observed from each defect. Accordingly, it could be deduced that the pattern recognition by LFPD could be regarded as the reference for the investigations by HFPD.

• Proceedings of the Korea Concrete Institute Conference
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• 1996.04a
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• pp.398-401
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• 1996

It is the aim of this study to introduce the application method for the new estimation system of deterioration caused performance decrement of exterior wall by infrared theromography. With this help of this trial test, the defect such as void and honeycomb of esveria wall can be shown easily. Espicially by selecting the weathering condition, it becomes easier to identify defect than with original image. It was confirmed that this trial monitoring system is very useful to identify the defect of exterior wall.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Journal of information and communication convergence engineering
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• v.22 no.3
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• pp.231-236
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• 2024

This paper presents a method used to identify partial discharge defects in cast-resin power transformers using a back-propagation algorithm. The Rogowski-type partial discharge (PD) sensor was designed with a planar and thin structure based on a printed circuit board to detect PD signals. PD electrode systems, such as metal protrusions, particle-on-insulators, delamination, and void defects, were fabricated to simulate the PD defects that occur in service. PD characteristics, such as rising time, falling time, pulse width, skewness, and kurtosis without phase-resolved partial discharge patterns, were extracted to intuitively analyze each PD pulse according to the type of PD defect. A backpropagation algorithm was designed to identify PD defects using a virtual instrument (VI) based on the LabVIEW program. The results show that the accuracy rate of back-propagation (BP) algorithm reaches over 92.75% in identifying four types of PD defects.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.160-164
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• 2007

In the steel industry, there is a need to produce large forged parts for the automobile industries, the flight and shipping industries ad military industries. In the steel-industry application, a cogging technique for cast ingots is required, because the major parts are needed as one large body in order to obtain higher quality. Therefore, cogging process is the primary step in manufacturing of practically large open-die forging. In the cogging process, internal voids have to be eliminated as defects, The present work is concerned with the elimination of the internal voids in large ingots so as obtain sound products. In this study, hot compression tests were carried out to obtain the flow stress of cast microstructure at different temperature and strain rates. The FEM analysis are performed to investigate the overlap defect of cast ingots during cogging stage. The measure flow stress data were used to simulate the cogging process of cast ingot using the practical material properties. Also the analysis of void closure are performed by using the $DEFORM^{TM}$-3D. The calculated results of void closure behavior are compared with the measured results before and after cogging, which are scanned by the X-ray scanner. From this result, the criteria for deformation amounts effect on the void closure can be investigated by the comparison of practical experiment and numerical analysis.

• Journal of the Korea Concrete Institute
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• v.18 no.1 s.91
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• pp.65-71
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• 2006

Concrete has a void, which exists as one of defect in concrete. If the porosity of concrete increases, durability of concrete decreases. In this paper, to improve surface void of concrete, surface penetration sealers are applied to specimen. And, it were investigated that the resistances of chloride penetration and freezing and thawing for concrete with surface penetration sealer of two types. According to the results, surface penetration sealer has not show a harmful influence on strength and resistance of freezing and thawing. Surface penetration sealers were effective in the resistance of chloride penetration.

• Journal of Korea Foundry Society
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• v.29 no.4
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• pp.176-180
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• 2009

Effect of matrix microstructure on creep behaviors of squeeze cast magnesium matrix composites was investigated. Aluminum borate whisker was used as reinforcement and AZ31, AS52 and Sr added AS52 Mg alloys were used for matrix alloys. The reinforcement was distributed homogeneously and defect-free composite was manufactured. Creep tests were carried out at the temperature of $150^{\circ}C$ under the applied stress of 50 and 100 MPa for Mg alloys and Mg MMCs, respectively. The creep resistance of Mg MMCs was in this order: AS52-Sr > AS52 AZ31 MMCs. Void initiation during creep mainly occurred at $Mg/Mg_{17}Al_{12}$ interface and propagation went along grain boundaries. On the other hand, $Mg_2Si$ phase was not attributed to the creep void initiation.

• Composites Research
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• v.32 no.6
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• pp.395-402
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• 2019

The RFI process is an OoA process that fiber mats and resin films are laminated and cured in a vacuum bag. In case that resin film is insufficient to fill empty space in fibers, it makes void defect in composites and this void decrease mechanical properties of the composites. For this reason, non-destructive testing is usually used to evaluate void of manufactured composites. So, in this study, a manufacturing method of standard void specimens, which are able to be used as references in non-destructive testing, was proposed by controlling resin film thickness in the RFI process. Also, a fiber compaction test was proposed as a method to set the resin film thicknesses depending on target voids of manufacturing panels. The target void panels of 0%, 2%, and 4% were made by the proposed methods, and signal attenuation depending on void was measured by non-destructive testing and image analysis. In addition, voids of specimens for tensile, in-plane, short beam and compressive tests were estimated by signal attenuation, and mechanical properties were evaluated depending on the voids.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.11
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• pp.890-894
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• 2011

In this thesis, the silicone filler with a sample size of 0~75 phr and void size of 2~4.5 mm is prepared in order to diagnose the defect of void which exists in widely used insulation material, silicone rubber. In this silicone rubber sample, electrodes are connected and whilst the voltage changes, applied voltage 7 kV~9 kV is increased constantly over time and discharge quantity, discharge frequency and applied voltage (T-QNV) were measured. The discharge quantity of the applied voltage (VQ) is measured to estimate inception voltage and extinction voltage. In addition, under the condition of maintaining constant applied voltage, discharge quantity and discharge frequency (QN) are measured, and its characteristics are analyzed.