• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.310-313
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• 2002

Structures obtained with a direct boning of two FZ silicon wafers joined in such a way that a smooth surface of one wafer was attached to the grooved surface of the other were studied. A square net of grooves was made with a conventional photo lithography process. After high temperature annealing the appearance of voids and the rearrangement of structural defects were observed with X-ray diffraction topography techniques. It was shown that the formation of void free grooved boundaries was feasible. In the cases when particulate contamination was prevented, the voids appeared in the grooved structures could be eliminated with annealing. Since it was found that the flattening was accompanied with plastic deformation, this deformation was suggested to be intensively involved in the process of void removal. A model was proposed explaining the interaction between the structural defects resulted in "a dissolution" of cavities. The described processes may occur in grooved as well as in smooth structures, but there are the former that allow to manage air traps and undesirable excess of dislocation density. Grooves can be paths for air leave. According to the established mechanisms, if not outdone, the dislocations form local defect arrangements at the grooves permitting the substantial reduction in defect density over the remainder of the interfacial area.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.2
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• pp.171-176
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• 2013

X-ray cross-sectional image-based inspection technique is one of the most useful methods to inspect the brazing joints of heat exchanger. Through X-ray cross-sectional image acquisition, image processing, and defect inspection, the defects of brazing joints can be detected. This paper presents a method to judge the type of detected defects automatically, and to display them three-dimensionally. The defect type is classified as unconnected defect, void, and so on, based on location, size, and shape information of defect. Three-dimensional display which is realized using OpenGL (Open Graphics Library) will be helpful to understand the overall situation including location, size, shape of the defects in a test object.

• Korean Journal of Materials Research
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• v.12 no.11
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• pp.883-888
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• 2002

We investigated the void formation in composite-titanium silicide($TiSi_2$) process. We varied the process conditions of polycrystalline/amorphous silicon substrate, composite $TiSi_2$ deposition temperature, and silicidation annealing temperature. We report that the main reason for void formation is the mass transport flux discrepancy of amorphous silicon substrate and titanium in composite layer. Sheet resistance in composite $TiSi_2$ without patterns is mainly affected by silicidation rapid thermal annealing (RTA) temperature. In addition, sheet resistance does not depend on the void defect density. Sheet resistance with sub-0.5 $\mu\textrm{m}$ patterns increase abnormally above $850^{\circ}C$ due to agglomeration. Our results imply that $sub-750^{\circ}C$ annealing is appropriate for sub 0.5 $\mu\textrm{m}$ composite X$sub-750_2$ process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.334-335
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• 2006

Solid insulation exposed to voltage is degraded by electrical tree process. And the degradation of the insulation is accelerated by voltage application. For this experimental, specimen of electrical tree model is made by XLPE (cross-linked polyethylene). And the size of the specimen is 7*5*7 $mm^3$. Distance of needle and plane is 2 mm. Voltages applied for acceleration test are 12 kV to 15 kV. And distribution characteristic of degraded stage is studied too. As a PD detecting and data process, discharge data acquire from PD detecting system (Biddle instrument). The system presents statistical distribution as phase resolved. Moreover the processing time of electrical tree is recorded to know the speed of degradation according to voltage.

• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1725-1727
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• 1998

In this paper the patterns of partial discharges(PD) occurred from some defects at the interface of cable joints as the function of the phase of the applied voltage were investigated in order to discern the kind of a defect. The results obtained in this study show that it is possible to distinguish the PD patterns between the void discharges and the treeing or tracking discharges which were occured at the cable joint interface. While the state of defect transfers from a void discharge into a tree or tracking discharge with a aging time, the skewness for both half of the applied voltage cycle is observed to go to the negative value.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.55-57
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• 2005

In this study, modeling of the CD stud welding system was conducted considering mechanical and electrical components. The electrical components such as arc resistance, cable resistance, capacitance, internal resistance and cable inductance were found to affect the output waveform significantly. The calculated results showed food agreements with the experiment results within 20% error. The main defect of CD stud welding with 1010 steel stud and SS400 steel plate was the void trapped between stud and base metal. The effect of the spring force and stud tip size on void formation was investigated.

• Korean Journal of Crystallography
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• v.14 no.2
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• pp.84-92
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• 2003

The fast pulling is easy to modify the distribution of grown-in defects toward fine size, which can be readily removed by additional treatment. In this experiment, The fast pulled crystals with high pulling late over 1.0 mm/min were grown and their grown-in defect distributions were investigated. In our recent developments in the growth of Cz-Si, it could be found that the cooling rate in a specific temperature range and the uniformity of temperature gradient at solid/liquid interface are more important for the formation of grown-in defect than the pulling rate itself. We analyzed these cooling rates and temperature gradients for the various fast pulled crystals and compared them to the observed formation behavior of the grown-in defects. The effective factor (Ω) for the void defect formation was introduced and it could explain the radial distribution of void defects in the fast-pulled crystals effectively.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.197-198
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• 2008

The forging process produces complicated and designed components in a die at high productivity for mass production and minimizes the machining amount for favorable material utilization; the forging products used at highly stressed sections are well accepted at a wide range of industry such as automobile, aerospace, electric appliance and et cetera. Accordingly, recent R&D activities have been emphasized on improvement of forging die-life and near net shaping technology for cost effectiveness and better performance. Usually closing and consolidation of internal void defects in a ingot is a vital matter when utilized as large forged products. It is important to develop cogging process for improvement of internal soundness without a void defect and cost reduction by solid forging alone with limited press capacity. For experiments of cogging process, hydraulic press with a capacity of 800 ton was used together with a small manipulator which was made for rotation and overlapping of a billet. Size of a void was categorized into two types; ${\phi}$ 6.0 mm and ${\phi}$ 9.0 mm to investigate the change of closing and consolidation of void defects existed in the large ingot during the cogging process. In addition for forming experiment of piston grown air drop hammer with a capacity of 16 ton was used. The experiment with piston crown was carried out to show the formability and void closing status. In this paper systematic configuration for closing process of void defects were expressed based on this experiment results in the cogging process. Also forging defects through forming process for piston crown was improved using the experiment results and FE analysis. Consequently this paper deals with the effect of radial parameters in cogging process on a void closure far large forged products and formability of piston crown.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.9
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• pp.969-975
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• 2009

In this paper, bonded wafer analysis system is proposed using laser beam transmission; while the transmission model is derived by simulation. Since the failure of bonded wafer stems in void existence, transmittance deviations caused by the thickness of the void are analyzed and variations of the intensity through the void or defect easily have been recognized then the testing power has been increased. In addition, large screen display on laser study has been done which resulted in acquiring a feasible technique for analysis of the whole bonding surface. In this regard, three approaches are demonstrated in which Halogen lamp, IR lamp and laser have been tested and subsequently by results comparison the optimized technique using laser has been derived.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.601-604
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• 2001

The insulation materials of cables used for underground power transmission requires a higher insulating capability. and the most popular method to examine the cable is partial discharge test due to applying variation voltage. In the thesis. air void. silicone oil. of which may possibly exist real cables. are simulated by Electra 2D program. Also the relations between calculated field strength and the void defect type in the cable joint materails. In the modeling. electic field inner to the cable joint material composed by XLPE and EPDM is modeling simulated. We obtained the electric field distribution in void due to two conditions.