• 한국결정성장학회지
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• 제14권2호
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• pp.58-62
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• 2004

The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

• 한국정밀공학회지
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• 제18권12호
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• pp.159-166
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• 2001

Recently, high story apartments are common to solve a housing problem especially in major cities. Apartments are considered as clean, sanitary and convenient to live. However, There are some problems because residents share walls, floors and ceilings with other people. Thus, the residents are often disturbed by neighbours since sound travels the building elements. Especially, impact noise through the floors causes the many complains. And so, it has been drawn attention to isolate by the impact sound. The purpose of this study is to analyze the characteristics of vibration response of 12-type void slabs in the improved void slab by impedance method, and is to find the best improveds void slab on the 12-type void slabs.

• 한국컴퓨터정보학회논문지
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• 제14권4호
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• pp.59-67
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• 2009

무선 센서 네트워크에서 위치 기반 그리디 포워딩 기법(Geographic greedy forwarding) 은 한 홉 내의 주위 노드들의 위치 정보만 가지고 데이터 전송 경로를 설정하기 때문에 자신보다 목적지에 더 가까운 노드가 존재하지 않는 경우 데이터를 전달할 수 없는 경우가 발생한다. 본 논문에서는 이러한 보이드 문제가 발생한 환경에서 데이터를 효과적으로 전송하기 위해 향상된 위치 기반 라우팅 알고리즘(CGR: Cost based Geographic Routing)을 제안한다. 제안하는 CGR 알고리즘은 그림자 경계 영역을 설정하고 설정된 영역에 존재하는 노드들끼리 비용 함수 연산 알고리즘을 통하여 효과적인 그리디 포워딩이 수행되도록 한다. 시뮬레이션 결과, 제안한 알고리즘이 기존의 알고리즘보다 평균 전체 라우팅 경로길이가 줄어들 뿐만 아니라, 데이터 전달성공 비율이 높고 에너지 절감 효과가 뛰어남을 확인하였다.

• 반도체디스플레이기술학회지
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• 제20권2호
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• Composites Research
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• 제34권2호
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• pp.88-95
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• 2021

VARTM(Vacuum-assisted resin transfer molding) 공정은 OoA(Out of Autoclave)에 속하는 저가형 공정기술로 다양한 분야에 널리 사용되어 왔다. 그러나 오토클레이브 공정보다 품질이 낮아 고신뢰성이 요구되는 항공산업에는 적용하기 어려웠다. VARTM 공정의 주요 문제는 오토클레이브 대비 낮은 섬유부피분율과 높은 Void 함량에 의한 기계적 물성의 손실이었다. 따라서 많은 연구자들이 Void를 줄이고 섬유부피분율을 높일 수 있는 연구를 수행해 왔다. 이러한 연구의 흐름에 따라 본 연구에서는 수지 주입 과정 중 대기압을 제어하는 방법이 섬유부피분율을 높이고 Void를 감소시킬 수 있는지 검토하였다. 신뢰성 평가는 Void와 연관성이 있는 압축강도시험, 섬유부피분율 분석, 광학현미경 촬영을 통해 확인하였다. 결과적으로 VARTM 공정에서 수지 주입과정 중 대기압을 단계별로 높이는 방법이 섬유부피분율 증가와 Void 감소에 직접적인 효과가 있음을 확인하였다.

• Geomechanics and Engineering
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• 제22권2호
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• pp.165-171
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• 2020

Laboratory determination of strength and deformation behavior of clean sands and gravels has always been challenging due to the difficulty in obtaining their undisturbed samples. An alternative solution to this problem is to develop correlations between mechanical properties of cohesionless soils and their gradation characteristics. This study presents database of 3 natural sands with 11 varying particle size gradation curves to allow investigating relationships between mean particle size, maximum and minimum void ratio, relative density and shear strength of the test soils. Direct shear tests were performed at relative densities of 50, 75 and 95% to explore the effects of gradation and density on the angle of internal friction of the modeled sand samples. It is found that the mean grain size D₅₀ bears good correlations with void ratio range (e_max - e_min) and peak angle of internal friction 𝜙'_peak. The generated regression models are in good agreement with published literature and can be considered as reliable for natural sands in Pakistan. These empirical correlations can save considerable time and efforts involved in laboratory and field testing.

• Advances in aircraft and spacecraft science
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• 제6권4호
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• pp.273-282
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• 2019

This article is concerned with the investigation of geometrically non-linear vibration response of refined thick porous nanobeams. To this end, non-local theory of elasticity has been adopted to provide the nanobeam formulation. Voids or pores can affect the material characteristics of the nanobeam. So, their effects have been considered in this research and also there are various void distributions. The closed form solution of the non-linear problem has been used that is adopted from previous articles. Then, it is focused on the impacts of non-local field, void distribution, void amount and geometrical properties on non-linear vibrational characteristic of a nano-size beam.

• Nuclear Engineering and Technology
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• 제16권3호
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• pp.125-130
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• 1984

매우 작은 규모 LOCA 분석에 RETRAN코드 적용에 있어서 중요 문제점의 하나는 upper plenum에 Bubble rise model의 사용에 있다. 왜냐하면, Bubble rise model은 수리적 발산을 야기할지 모르며, 그 모텔에 사용되는 계수는 큰 규모 냉각재 상실 사고의 실험적 결과에 바탕을 두기 때문이다. 여기서, Bubble rise model을 사용하지 않고 upper plenum의 mixture level을 예측하게 해주는 방법이 제시되었다. 이 방법을 위해 노심과 upper plenum내의 지역 void 분포가 간단한 slip 모델을 이용 괘 유도되었다. 유도된 식으로부터의 결과는 실험 데이타와 매우 잘 일치한다는 것이 발견되었다. 또한, Upper Plenum에 있어서 지역 void는 대규모 LOCA에 있어서 선형 분포와는 달리 균일한 분포를 하고 있다는 것이 발견되었다. upper plenum과 upper head사이의 냉각재 교환이 연구되었다. Taylor instability 개념 도입에 의해 그들 사이에 counter-current flow가 가능하다는 것이 증명되었다.

• Journal of Welding and Joining
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• 제18권2호
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.