• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.2
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• pp.58-62
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• 2004

The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.12
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• pp.159-166
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• 2001

Recently, high story apartments are common to solve a housing problem especially in major cities. Apartments are considered as clean, sanitary and convenient to live. However, There are some problems because residents share walls, floors and ceilings with other people. Thus, the residents are often disturbed by neighbours since sound travels the building elements. Especially, impact noise through the floors causes the many complains. And so, it has been drawn attention to isolate by the impact sound. The purpose of this study is to analyze the characteristics of vibration response of 12-type void slabs in the improved void slab by impedance method, and is to find the best improveds void slab on the 12-type void slabs.

• Journal of the Korea Society of Computer and Information
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• v.14 no.4
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• pp.59-67
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• 2009

In wireless sensor networks (WSNs), geographic greedy forwarding fails to move a packet further towards its destination if the sender does not have any closer node to the destination in its one hop transmission region. In this paper, we propose a enhanced geographic routing, called CGR(Cost based Geographic Routing) for efficient data delivery against void problem environment. CGR first establishes Shadow Bound Region and then accomplishes Renewing Cost Function Algorithm for effective greedy forwarding data delivery. Our simulation results show significant improvements compared with existing schemes in terms of routing path length, success delivery ratio and energy efficiency.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• Composites Research
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• v.34 no.2
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• pp.88-95
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• 2021

VARTM (Vacuum-assisted resin transfer molding) process is a low-cost process technology and affiliated with OoA (Out of Autoclave). Besides, it has been widely used in various fields. However, because of its lower quality than the autoclave process, it isn't easy to apply the VARTM process to the aerospace industry, which requires high reliability. The main problem of the VARTM process is the loss of mechanical properties due to the low fiber volume fraction and high void content in comparison to the autoclave. Therefore, many researchers have studied to reduce void and increase fiber volume fraction. This study examines whether the method of controlling atmospheric pressure could increase the fiber volume fraction and reduce void during the resin impregnation process. Reliability evaluation was confirmed by compressive strength test, fiber volume fraction analysis, and optical microscopy. As a result, it was confirmed that increasing the atmospheric pressure step by step in the VARTM process of impregnating the preform with resin effectively increases the fiber volume fraction and reduces void.

• Geomechanics and Engineering
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• v.22 no.2
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• pp.165-171
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• 2020

Laboratory determination of strength and deformation behavior of clean sands and gravels has always been challenging due to the difficulty in obtaining their undisturbed samples. An alternative solution to this problem is to develop correlations between mechanical properties of cohesionless soils and their gradation characteristics. This study presents database of 3 natural sands with 11 varying particle size gradation curves to allow investigating relationships between mean particle size, maximum and minimum void ratio, relative density and shear strength of the test soils. Direct shear tests were performed at relative densities of 50, 75 and 95% to explore the effects of gradation and density on the angle of internal friction of the modeled sand samples. It is found that the mean grain size D₅₀ bears good correlations with void ratio range (e_max - e_min) and peak angle of internal friction 𝜙'_peak. The generated regression models are in good agreement with published literature and can be considered as reliable for natural sands in Pakistan. These empirical correlations can save considerable time and efforts involved in laboratory and field testing.

• Advances in aircraft and spacecraft science
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• v.6 no.4
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• pp.273-282
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• 2019

This article is concerned with the investigation of geometrically non-linear vibration response of refined thick porous nanobeams. To this end, non-local theory of elasticity has been adopted to provide the nanobeam formulation. Voids or pores can affect the material characteristics of the nanobeam. So, their effects have been considered in this research and also there are various void distributions. The closed form solution of the non-linear problem has been used that is adopted from previous articles. Then, it is focused on the impacts of non-local field, void distribution, void amount and geometrical properties on non-linear vibrational characteristic of a nano-size beam.

• Nuclear Engineering and Technology
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• v.16 no.3
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• pp.125-130
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• 1984

In the application of the RETRAN code to the analysis of very small LOCA one of main concerns is placed on use of the bubble rise model in the upper plenum, because the bubble rise model nay cause a numerical divergence problem and coefficients used to describe it are based on experimental results of large LOCA. In order to solve this problem, a method, which enables us to predict the mixture level in the upper plenum without use of the bubble rise model, was proposed. For this method the local void distribution in the core and upper plenum was derived by using a simplified slip model. It was shown that results predicted from the derived equation are in excellent agreement with experimental data. Additionally it was found that local void in the upper plenum has a uniform distribution unlike a linear distribution in large LOCA. Communication between the upper plenum and upper head was investigated. By introducing the concept of Taylor instability, it was proved that counter-current Hon between them is possible.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.