• Structural Engineering and Mechanics
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• 제30권2호
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• pp.177-190
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• 2008

Material failure behavior is generally dependent on loading rate. Especially in brittle and quasi-brittle materials, rate dependent material behavior can be significant. Empirical formulations are often used to predict the rate dependency, but such methods depend on extensive experimental works and are limited by practical constraints of physical testing. Numerical simulation can be an effective means for extracting knowledge about rate dependent behavior and for complementing the results obtained by testing. In this paper, the failure behavior of a brittle material under different loading rates is simulated by molecular dynamics analysis. A notched specimen is modeled by sub-million particles with a normalization scheme. Lennard-Jones potential is used to describe the interparticle force. Numerical simulations are performed with six different loading rates in a direct tensile test, where the loading velocity is normalized to the ratio of the pseudo-sonic speed. As a consequence, dynamic features are achieved from the numerical experiments. Remarkable failure characteristics, such as crack surface interaction/crack arrest, branching, and void nucleation, vary in case of the six loading cases. These characteristics are interpreted by the energy concept approach. This study provides insight into the change in dynamic failure mechanism under different loading rates.

• Geomechanics and Engineering
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• 제20권2호
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• pp.165-174
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• 2020

The enzyme-induced carbonate precipitation (EICP) method has been investigated to improve the hydro-mechanical properties of natural soil deposits. This study was conducted to explore the stiffness evolution during various stress scenarios. First, the optimal concentration of urea, CaCl₂, and urease for the maximum efficiency of calcite precipitation was identified. The results show that the optimal recipe is 0.5 g/L and 0.9 g/L of urease for 0.5 M CaCl₂ and 1 M CaCl₂ solutions with a urea-CaCl₂ molar ratio of 1.5. The shear stiffness of EICP-treated sands remains constant up to debonding stresses, and further loading induces the reduction of S-wave velocity. It was also found that the debonding stress at which stiffness loss occurs depends on the void ratio, not on cementation solution. Repeated loading-unloading deteriorates the bonding quality, thereby reducing the debonding stress. Scanning electron microscopy and X-ray images reveal that higher concentrations of CaCl₂ solution facilitate heterogeneous nucleation to form larger CaCO₃ nodules and 11-12 % of CaCO₃ forms at the interparticle contact as the main contributor to the evolution of shear stiffness.

• 한국표면공학회지
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• 제46권4호
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• pp.145-152
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• 2013

The growth behavior of nanocrystalline diamond (NCD) film has been studied for three different substrates, i.e. bare Si wafer, 1 ${\mu}m$ thick W and Ti films deposited on Si wafer by DC sputter. The surface roughness values of the substrates measured by AFM were Si < W < Ti. After ultrasonic seeding treatment using nanometer sized diamond powder, surface roughness remained as Si < W < Ti. The contact angles of the substrates were Si ($56^{\circ}$) > W ($31^{\circ}$) > Ti ($0^{\circ}$). During deposition in the microwave plasma CVD system, NCD particles were formed and evolved to film. For the first 0.5h, the values of NCD particle density were measured as Si < W < Ti. Since the energy barrier for heterogeneous nucleation is proportional to the contact angle of the substrate, the initial nucleus or particle densities are believed to be Si < W < Ti. Meanwhile, the NCD growth rate up to 2 h was W > Si > Ti. In the case of W substrate, NCD particles were coalesced and evolved to the film in the short time of 0.5 h, which could be attributed to the fact that the diffusion of carbon species on W substrate was fast. The slower diffusion of carbon on Si substrate is believed to be the reason for slower film growth than on W substrate. The surface of Ti substrate was observed as a vertically aligned needle shape. The NCD particle formed on the top of a Ti needle should be coalesced with the particle on the nearby needle by carbon diffusion. In this case, the diffusion length is longer than that of Si or W substrate which shows a relatively flat surface. This results in a slow growth rate of NCD on Ti substrate. As deposition time is prolonged, NCD particles grow with carbon species attached from the plasma and coalesce with nearby particles, leaving many voids in NCD/Ti interface. The low adhesion of NCD films on Ti substrate is related to the void structure of NCD/Ti interface.

• Transactions on Electrical and Electronic Materials
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• 제12권5호
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• pp.193-196
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• 2011

Lead zirconate titanate (PZT)/ bismuth ferrite (BFO) multilayer thin films have been fabricated by the spin-coating method on Pt(200 nm)/Ti(10 nm)/$SiO_2$(100 nm)/p-Si(100) substrates using $BiFeO_3$ and $Pb(Zr_{0.52}Ti_{0.48})O_3$ metal alkoxide solutions. The PZT/BFO multilayer thin films show a uniform and void-free grain structure, and the grain size is smaller than that of PZT single films. The reason for this is assumed to be that the lower BFO layers play an important role as a nucleation site or seed layer for the formation of homogeneous and uniform upper PZT layers. The dielectric constant and dielectric losses decreased with increasing number of coatings, and the six-layer PZT/BFO thin film has good properties of 162 (dielectric constant) and 0.017 (dielectric losses) at 1 kHz. The remnant polarization and coercive field of three-layer PZT/BFO thin films were 13.86 ${\mu}C/cm^2$ and 37 kV/cm respectively.

• 열처리공학회지
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• 제8권4호
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• pp.302-317
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• 1995

After initial structure of AISI 9260 steel is changed into pearlite and martensite, one is isothermally annealed at $700^{\circ}C$ below of $A_1$ transformation point and the other is isothermally annealed at the same condition after 3 cycles of heating and cooling between $680^{\circ}C$ and $780^{\circ}C$ of $A_1$ transformation point. Analyzing the changes of microstructure, mechanical properties and fractography of tension test, we obtained result as follows. The fastest spheroidization rate by changes of initial structure and heat treatment cycles is appeared at the heat treatment cycle which is isothermally annealed after 3 cycles of heating and cooling at below and above $A_1$ transformation point for martensite. At the above condition, the perfect spheroidization structure is appeared after 60hrs and after then, globular carbide is being coarsened. The mean diameter of globular carbide is $2.4{\times}10^{-3}mm$ after 90hrs. The changes of tension strength during spheroidization heat treatment follows Orwan function, ${\sigma}_o={\sigma}_i+Gb/l$, where l is interspacing of carbide particles and at the above condition, ${\sigma}_o=70.48+2.5{\times}10^{-3}/l(kg/mm^2)$. Fractography of fracture of spheroidization structure in tension test is appeared as dimple which is ductile rupture type by nucleation and growth of void, size of dimple is larger and deeper with increasing of heat treatment time.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.132-132
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• 2000

Cu는 Al에 비하여 낮은 저항(1.8 $\mu$$\Omega$-cm)과 높은 EM 저항성을 가지고 있어 미래의 고속 ULSI 배선물질로 그 중요성이 더욱 증가되고 있으며, 현재까지 많은 연구가 진행되고 있다. 따라서, 본 논문에서는 이러한 방법들을 고려하여 CVD Cu의 문제점인 낮은 성장률의 개선과 Cu 박막의 특성을 향상하고자 수소 플라즈마 공정을 이용하여 plasma 전처리가 초기 Cu 핵생성에 미치는 영향에 대하여 연구하였다. 본 실험에 사용된 장비는 Cu RPCVD/MOCVD이다. 초기 Cu 핵의 생성에 있어서의 수소 플라즈마의 효과를 조사하기 위하여 다음과 같은 3가지의 방법으로 행하였다. 첫 번째는 Cu 박막 형성에서 플라즈마를 사용하지 않은 방법, 두 번째는 플라즈마 전처리공정을 행한 뒤, Cu 박막 증착시 플라즈마는 사용하지 않은 방법, 세 번재는 플라즈마 전처리공저을 행한 뒤 Cu 증착시에도 플라즈마를 사용한 방법이다. 이 세가지 방법의 핵생성 차이를 분석하기 위해서 각각 10초, 20초, 40초 증착시킨 후 grain의 크기와 개수를 비교하였다. 또한 플라즈마의 power에 따른 Cu 핵생성율도 조사하였다. 수소 전처리동안 working pressure는 10분 동안 1 torr로 유지되었으며 substrate의 온도는 20$0^{\circ}C$, r.f.power는 100watt로 설정하였다. Cu RPCVD의 증착조건은 r.f.power는 10watt, substrate의 온도는 20$0^{\circ}C$, gas pressure는 1 torr, Ar carrier gas는 50sccm, hydrogen processing gas는 100sccm, bubbler 온도는 4$0^{\circ}C$, gas line의 온돈느 6$0^{\circ}C$, shower head의 온도는 $65^{\circ}C$로 설정하였다. 증착된 Cu 박막은 SEM, XRD, AFM를 통해 제작된 박막의 특성을 비교.분석하였다. 초기 plasma 처리를 한 경우에는 그림 1에서와 같이 현저히 증가한 초기 구리 입자들이 관측되었으며, 이는 도상 표면에 활성화된 catalytic site의 증가에 기인한다고 보여진다. 이러한 특성은 Cu films의 성장률을 향상시키고, 또한 voids를 줄여 전기적 성질 및 surface morphology를 향상시키는 것으로 나타났다.

• 마이크로전자및패키징학회지
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• 제13권1호통권38호
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• pp.7-15
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• 2006

63Sn-37Pb 솔더의 실시간 electromigration 거동 관찰을 박막형 edge 이동 선형시편과 주사전자현미경을 이용하여 실시하였다. 공정조성 63Sn-37Pb 솔더의 electromigration에 의한 edge 이동 잠복기는 $90{\sim}110^{\circ}C$에서 뚜렷하게 존재하였다. 온도에 따른 electromigration 우선확산원소는 실험온도 $90{\sim}110^{\circ}C$에서 Pb, $25{\sim}50^{\circ}C$에서는 Sn으로 나타났고, $70^{\circ]C$에서는 Sn과 Pb가 거의 동시에 이동하여 우선확산 원소가 관찰되지 않았다. $90{\sim}110^{\circ}C$에서 관찰된 SnPb의 electromigration에 의한 edge 이동 잠복기는 Pb 우선이동에 의해 발생되었다. 이러한 edge 이동 잠복기의 존재는 플립칩 (flip chip) 솔더범프의 수명과 밀접한 관계를 가지는 것으로 보인다. Electromigration에 의해 발생되는 SnPb 솔더의 우선확산원소의 온도 의존성은 Pb와 Sn의 확산계수와 함께 $Z^*$ (전기장내의 유효전하 수)도 크게 영향을 미치는 것으로 생각된다.

• 대한토목학회논문집
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• 제36권6호
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• pp.979-990
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• 2016

본 연구는 변형률 기반 설계를 위해 개발된 X80 라인파이프의 인장 변형성능을 검증하기 위해 금속의 비선형 거동을 해석할 수 있는 대표적 경험적인 모델인 GTN (Gurson-Tvergaard-Needleman) 모델을 이용한 비선형 유한요소 해석기법을 제시한다. GTN 모델은 재하과정중 금속 내부에서 발생하는 공극의 생성, 성장, 합체에 대한 모델링을 통해 재료의 손상거동을 묘사하는데, 본 연구에서는 GTN 모델에 대한 사용자 정의 재료모델을 작성하고 상용 유한요소해석 프로그램인 ABAQUS에 연동시켜 강재의 비선형 손상거동을 해석하였다. 비선형 손상해석을 위한 모재와 용접용 재료의 재료상수는 원형봉과 전두께 시편에 대한 인장시험 결과를 수치모사하여 결정하였으며, 결정된 재료상수를 이용하여 SENT (Single Edge Notch Tension) 시험과 CWPT (Curved Wide Plate Test)를 수치모사하였다. 수치해석 결과로부터 인장 변형성능을 산정하고 이를 시험결과 및 기존의 경험공식과 비교한 결과 본 연구에서 개발한 수치기법이 X80 라인파이프 부재의 인장 변형성능을 신뢰도 높게 평가하는 것을 확인하였으며, 결과적으로 변형률 기반 설계에 효과적으로 활용될 수 있을 것으로 기대된다.