• Journal of Korean Neurosurgical Society
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• v.47 no.6
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• pp.433-436
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• 2010

Objective : Arachnoid cysts (ACs) can be cured by making the definite and wide communication between the cyst and arachnoid space using endoscopy, but often it is impossible only through the usual working-channel (intra-channel) procedures. We discuss and propose a more valuable endoscopic technique with the presentation of our series of cases. Methods : We treated 9 patients with cortical AC in various locations with extra-channel endoscopic techniques. The patients ranged in age from 3 years to 60 years (mean age, 37.2 yrs). The follow-up period ranged from 12 to 26 months (mean follow-up duration, 17.2 months). All patients had large AC compressing the adjacent brain with clinical symptoms or signs. The authors performed extensive fenestration via single burr hole with the aid of endoscope. Being bypassed the rigid endoscope, through the space between the shaft of endoscope and guiding cannula (extra-channel method), fenestration procedures were done in the dry fields. Results : Eight (88.9%) patients had been treated successfully with endoscope. One patient required shunt procedure. Among the eight patients who were treated with endoscopic procedure, 6 patients (66.7%) showed cyst reduction, and two (22.2%) showed disappearance of cyst. Conclusion : We suggest that extra-channel method will be simple and easy to perform using more valuable instruments with wider working area, and may promise better results compared to the conventional intra-channel endoscopic procedures.

• The Journal of Korean Physical Therapy
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• v.21 no.4
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• pp.97-102
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• 2009

Purpose: The purpose of this study was to investigate the effects of low intensity pulsed ultrasound on TGF-$\beta$1 expression and healing of rat femur penetrating fractures. Methods: Rats were anesthetized with ketamine and xylazine. Using aseptic technique, we exposed the lateral right femoral diaphysis with removal of the periosteum. We made one hole along its long axis with an electrically-driven 1.8 mm diameter drill bit. Postoperatively, rats were divided into two groups (a control group, n=15; an experimental group, n=15). The experimental group was treated with low intensity pulsed ultrasound (pulse rate: 1:4, 0.5 W/$cm^2$, 10 minutes, 1 time per day) for 3 weeks. The control group was treated with sham ultrasound (with the US unit turned off). Results: The experimental group achieved more callus formation and TGF-$\beta$1 expression than the control group at the $7^{th}$, $14^{th}$ and $21^{st}$ days after low intensity pulsed ultrasound treatment. Conclusion: This study suggests that low intensity pulsed ultrasound facilitates bone fracture repair, possibly via increased TGF-$\beta$1 expression.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.4
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• Proceedings of the Korean Geotechical Society Conference
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• 2009.03a
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• pp.571-578
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• 2009

Recently, micropiling techniques are increasingly applied in foundation rehabilitation/underpinning and seismic retrofitting projects where working space provides the limited access for conventional piling methods. Micropiling techniques provide environmental-friendly methods for minimizing disturbance to adjacent structures, ground, and the environment. Its installation is possible in restrictive area and general ground conditions. The cardinal features that the installation procedures cause minimal vibration and noise and require very low ceiling height make the micropiling methods to be commonly used for underpin existing structures. In the design point of view, the current practice obligates the bearing capacity of micropile to be obtained from skin friction of only rock-socketing area, in which it implies the frictional resistance of upper soil layer is ignored in the design process. In this paper, a new micropiling method and its verification studies via field installation are presented. The new method provides a specific way to grout bore-hole to increase frictional resistance between surrounding soil and pile-structure and it allows to consider the skin friction of micropiles for upper soil layer during design process.

• Journal of the Optical Society of Korea
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• v.18 no.5
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• pp.531-537
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• 2014

Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1276-1277
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• 2006

The ever increasing requirements on today's compacts with regard to their geometry and precision call for flexible high-precision and most capable production systems. DORST Technologies has coped with these requirements by developing the new HP series for pressing forces between 1600 kN and 16000 kN and the new HS series for pressing forces between 150 kN and 1200 kN. These fully hydraulic presses featuring upper ram, lower ram, core rod, filler, up to 4 lower tool levels and up to 4 upper tool levels with closed-loop controlled movements. Thanks to latest servo technology and an electronic bus system it is possible to have all movements closed-loop controlled in the desired relation to each other. Thus, today's hydraulic presses provide high stroke rates, low energy consumption and a user-friendly interface. The input of data is carried out via clearly arranged screen masks on a touch-screen. The innovative DORST $IPG^{(R)}$ (Intelligent Program Generator) has been designed to support the set-up staff in preparing and optimizing the toolprogram. The combination of the machine type with the hydraulic unit determines the productivity in consideration of the specific application and the part to be pressed. Thanks to the closed-loop control circuits, DORST hydraulic automatic presses of the latest generation ensure unmatched precision and repeatability - and consequently process reliability - often without necessitating subsequent machining steps.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.5
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• pp.31-37
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• 2020

In this paper, we propose a novel sub-wavelength unit cell metamaterial absorber using multi-layer structure. The proposed absorber consists of 4 layers, and each layer has a spiral resonator connected by a via hole. This structure increases inductance of the unit cell, and therefore the resonant frequency can shift to lower frequency. We optimized the proposed absorber, and the electrical size of the unit cell is dramatically reduced to 0.013 times of the wavelength. The performance of the proposed absorber is demonstrated with full-wave simulation and measurement results. An absorption rate exceeding 97% is achieved at 1.74GHz. In addition, the proposed absorber attains a high absorption rate of 90% for different polarization and incident angles.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.37 no.5
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• pp.10-16
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• 2000

This paper presents new double-sided 3-dB branch-line coupler using CPW-to-Microstrip via-hole transitions for the multi-layer applications. The characteristic impedance is obtained using the even-odd mode method, and the circuit performance Is accurately estimated by the Finite Difference Time Domain(FDTD) method. The fabricated double-sided 3-dB branch-line coupler has less than 0.3 dB power dividing imbalance and 1。 phase imbalance, greater than 30 dB isolation, and 25 dB return loss over a 20% bandwidth centered at 2 GHz. Calculated and fabricated results show that this coupler provides better performance as compared to the conventional microstrip branch-line couplers.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.3019-3025
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• 2008

An experimental study was performed to assess the effect of diesel and JP-8 aviation fuel on the spray characteristics, performance and emissions in a single cylinder optical diesel engine. Both fuels were injected via an 8-hole solenoid-driven injector in a common-rail injection system. For better understanding of spray development, the macroscopic images were captured with high speed camera, offered evidences for the results of performance and emissions. From macroscopic spray images, the spray tip penetration of JP-8 shorter than that of diesel while spray angle of JP-8 was wider than that of diesel. It indicates that the vaporization of JP-8 is superior to that of diesel. The lower cetane number of JP-8 resulted in increased portion of premixed combustion. The IMEP with JP-8 is lower than that of diesel-fueled engine. Especially, using JP-8 has a potential for reducing soot.

• Transactions on Electrical and Electronic Materials
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• v.2 no.4
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• pp.15-18
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• 2001

A new small scaling Lateral Trench Insulated Gate Bipolar Transistor (SSLTIGBT) was proposed to improve the characteristics of the device. The entire electrode of the LTIGBT was replaced with a trench-type electrode. The LTIGBT was designed so that the width of device was no more than 10 ${\mu}{\textrm}{m}$. The latch-up current densities were improved by 4.5 and 7.6 times, respectively, compared to those of the same sized conventional LTIGBT arid the conventional LTIGBT which has the width of 17 ${\mu}{\textrm}{m}$. The enhanced latch-up capability of the SSLTIGBT was obtained due to the fact that the hole current in the device reaches the cathode via the p+ cathode layer underneath the n+ cathode layer, directly. The forward blocking voltage of the SSLTIGBT was 125 V. At the same size, those of the conventional LTIGBT and the conventional LTIGBT with the width of 17 ${\mu}{\textrm}{m}$ were 65 V and 105 V, respectively. Because the proposed device was constructed of trench-type electrodes, the electric field In the device were crowded to trench oxide. Thus, the punch through breakdown of LTEIGBT occurred late.