• 한국입자에어로졸학회지
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• 제18권4호
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• pp.129-136
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• 2022

The line width of circuits in semiconductor devices continues to decrease down to a few nanometers. Since nanoparticles attached to the patterned wafer surface may cause malfunction of the devices, it is crucial to remove the contaminant nanoparticles. Physical cleaning that utilizes momentum of liquid for detaching solid nanoparticles has recently been tested in place of the conventional chemical method. Dropwise impaction has been employed to increase the removal efficiency with expectation of more efficient momentum exchange. To date, most of relevant studies have been focused on drop spreading behavior on a horizontal surface in terms of maximum spreading diameters and average spreading velocity of drop. More important is the local liquid velocity at the position of nanoparticle, very near the surface, rather than the vertical average value. In addition, there are very scarce existing studies dealing with microdroplet impaction that may be desirable for minimizing pattern demage of the wafer. In this study, we investigated the local velocity distribution in spreading liquid film under various impaction conditions through the CFD simulation. Combining the numerical results with the particle removal model, we estimated an effective cleaning diameter (ECD), which is a measure of the particle removal capacity of a single drop, and presented the predicted ECD data as a function of droplet's velocity and diameter particularly when the droplets are microns in diameter.

• 한국광학회지
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• 제15권1호
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• pp.12-16
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• 2004

편광에 관계없이 매우 짧은 결합 길이를 가지는 Double-Sided Deep-Ridge (DSDR) 도파관 구조를 가지는 수직 방향성 결합기의 두 코어 굴절율에 약간의 비대칭성을 줌으로써 편광에 관계없이 소멸비가 크게 향상됨을 보였다. 내부 클래딩의 두께와 두 코어의 두께가 감소할수록 두 코어는 강하게 결합되기 때문에 최대 소멸비를 보이는 두 코어 사이의 굴절율의 비대칭값과 30 ㏈ 이상의 소멸비를 보이는 코어 굴절율의 공차는 증가한다. 또한 내부 클래딩의 두께와 두 코어의 두께가 감소할수록 두 코어사이의 결합이 강하게 되어 결합기 길이와 30 ㏈ 이상의 소멸비를 가지는 결합길이의 공차는 감소한다. 편광에 관계없이 100 $\mu\textrm{m}$ 이하의 매우 짧은 소자길이를 가지며 30 ㏈ 이상의 매우 높은 소멸비를 가지는 DSDR수직 방향성 결합기를 구현할 수 있음을 보였다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.1547-1552
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• 2003

In this paper, we present a planar single-crystalline silicon x-axis micro-gyroscope fabricated with a perfectly aligned vertical actuation combs on one silicon wafer, using the extended SBM technology. The fabricated x-axis micro-gyroscope has the resolution of 0.1 deg/sec, the bandwidth of 100 Hz. These research results allow integrating 6 axes inertial measurement (3 accelerations and 3 angular rates) on the same silicon substrate using the same process for the first time.

• 한국광학회지
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• 제7권3호
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• pp.266-271
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• 1996

본 연구에서는 수직형 LPE방법으로 제작된 InGaAsP/ImP RWG(Ridge Waveguide) MQW(Mutiple Quantum Well)-LD(Laser diode)의 광학적 특성을 조사하여 제작된 LD의 특성과 설계결과를 비교 분석하였다. 광학적 특성 분석결과 제작된 LD가 설계된 데로 측방향 단일모드로 동작하였으며 내부양자효율은 77%, 내부손실은 18$cm^{-1}$ /, 발진파장의 온도특성은 5.5.angs./C.deg.로 나타났다. 이러한 결과들로부터 수직형 LPE방법으로 성장된 에피층의 특성과 MQW의 계면특성이 아주 양호하다는 것을 알 수 있었으며 제작된 RWG MQW-LD의 특성도 양호함을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.481-484
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• 1999

The undoped-InSe and Sn-doped InSe single crystals were grown by vertical Bridgman method and their properties were invesigated. These crystals were obtained by lowering the quartz ampoule for growth in the furnace and growth rate at optimum condition is 0.4mm/hr. The orientations and the crystallinites of these crystals were identified by X-ray diffraction(XRD), double crystal rocking curve(DCRC) and etch-pit density(EPD) measurements. From the Raman spectrum at room temperature, TO, LO modes together with their overtones and combinations were observed. Optical properties were investigated by photoluminescence at 12K and direct band gap of these crystals obtained from optical absorption spectrum. Compared with undoped-lnSe, electrical properties of Sn-doped InSe were increased and the electrical conductivity type were n-type. But electrical properties along growth direction of crystals and radial direction of wafer showed nearly uniform distribution.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.367-372
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• 2002

The vertically well-aligned carbon nanotubes(CNTs) were successfully grown on Ni coated silicon wafer substrate by DC bias-assisted PECVD(Plasma Enhanced Chemical Vapor Deposition). As a catalyst, Ni thin film of thickness ranging from 15~30nm was prepared by electron beam evaporator method. In order to find the optimum growth condition, the type of gas mixture such as $C_2H_2-NH_3$ was systematically investigated by adjusting the gas mixing ratio at $570^{\circ}C$ under 0.4Torr. The diameter of the grown CNTs was 40~200nm and the diameter of the CNTs increased with increasing the Ni particles size. TEM images clearly showed carbon nanotubes to be multiwalled. The measured turn-on field was $3.9V/\mu\textrm{m}$ and an emission current of $1.4{\times}10^4A/\textrm{cm}^2$ was $7V/\mu\textrm{m}$. The CNTs grown by bias-assisted PECVD was able to demonstrate high quality in terms of vertical alignment, crystallization of graphite and the processing technique at low temperature of $570^{\circ}C$ and this can be applied for the emitter tip of FEDs.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.756-759
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• 2004

We present a piezoelectric actuator using stiffness control and stroke amplification mechanism in order to make large lateral displacement. In this work, we suggest stiffness control approach that generates lateral displacement by increasing the vertical stiffness and reducing the lateral stiffness using additional structure. In addition, an additional structure of a serpentine spring amplifies the lateral displacement like leverage structure. The suggested lateral PZT actuator (bellows actuator) consists of serpentine spring and PZT/electrode layer which is located at the edge of the serpentine spring. The edge of the serpentine spring prevents the vertical motion of PZT layer, while the other edge of the serpentine spring makes stroke amplification like leverage structure. We have determined dimensions of the bellows actuator using ANSYS simulation. Length, width and thickness of PZT layer are 135$\mu$m, 20$\mu$m and 0.4$\mu$m, respectively. Dimensions of the silicon serpentine spring are thickness of 25$\mu$m, length of 300$\mu$m, and width of 5$\mu$m. The bellows actuator has been fabricated by SOI wafer with 25$\mu$m-top silicon and 1$\mu$m-buried oxide layer. The bellows actuator shows the maximum 3.93$\pm$0.2$\mu$m lateral displacement at 16V with 1Hz sinusoidal voltage input. In the frequency response test, the fabricated bellows actuator showed consistent displacement from 1Hz to 1kHz at 10V. From experimental study, we found the bellows actuator using thin film PZT and silicon serpentine spring generated mainly laterally displacement not vertical displacement at 16V, and serpentine spring played role of stroke amplification.

• 대한전자공학회논문지SD
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• 제45권2호
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• pp.112-117
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• 2008

3D MEMS 소자 또는 적층형 패키지에 응용하기 위해서 실리콘 관통 비아를 이용한 새로운 수직 접속 방법을 제안하고 그 실효성을 증명하기 위해 제작하였다. 제안된 실리콘 관통 비아는 기존의 관통 비아에서 도전 물질로 사용되던 구리대신 실리콘을 적용하였다. 그 결과 열팽창 계수 차이에 의한 열응력 줄일 수 있어 높은 온도에서 이루어지는 MEMS 공정과 병행 가능하게 되었다. $30{\mu}m$ 두께의 실리콘 기판 2층이 적층되었으며 $40{\mu}m$와 $50{\mu}m$의 간격을 가지는 관통 비아 배열을 제작하였다. 관통 비아의 전기적 특성을 측정하고 분석하였다. 측정된 저항 값은 $169.9\Omega$이었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2512-2517
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• 2007

Effect of natural convention for hot plate surface temperature uniformity was studied by experiments that were adjusted height of chamber and temperature difference. The hot plate chamber is composed of the hot plate and the upper heater and adiabatic vertical wall. The hot plate diameter is 220mm and maintains temperature at $150^{\circ}C$. Flow pattern compares with surface temperature and confirms that natural convection affects on temperature uniformity of hot plate surface. In case, temperature non-uniformity of hot plate surface is due to heater pattern, lots of weak and small flow cells more improve temperature uniformity than stronger flow cells or non-developing flow cell. Improve temperature uniformity $1.2^{\circ}C$ when developing weak and small flow cells.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1428-1430
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• 1995

In this study we fabricate Knife type Si-tip array using (110) Si wafer. We can fabricate vertical structure by anisotropic etching using EPW and observe it by SEM. After the step, we perform isotropic etching and oxidation sharpening of the structure and also observe it by SEM, respectively. The purpose of isotropic etching is to reduce the oxidation time. We attain a optimal tip whose radius is about $100{\AA}$ after anisotropic etching 2.25 min.+isotropic etching 5 min.+oxidation 1 hour and 23 min.