• 제목/요약/키워드: Varying Thickness

검색결과 757건 처리시간 0.027초

Effect of tube area on the behavior of concrete filled tubular columns

  • Gupta, P.K.;Verma, V.K.;Khaudhair, Ziyad A.;Singh, Heaven
    • Computers and Concrete
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    • 제15권2호
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    • pp.141-166
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    • 2015
  • In the present study, a Finite Element Model has been developed and used to study the effect of diameter to wall thickness ratio (D/t) of steel tube filled with concrete under axial loading on its behavior and load carrying capacity. The model is verified by comparing its findings with available experimental results. Influence of thickness and area of steel tube on strength, ductility, confinement and failure mode shapes has been studied. Strength enhancement factors, load factor, confinement contribution, percentage of steel and ductility index are defined and introduced for the assessment. A parametric study by varying length and thickness of tube has been carried out. Diameter of tube kept constant and equals to 140 mm while thickness has been varied between 1 mm and 6 mm. Equations were developed to find out the ultimate load and confined concrete strength of concrete. Variation of lateral confining pressure along the length of concrete cylinder was obtained and found that it varies along the length. The increase in length of tubes has a minimal effect on strength of tube but it affects the failure mode shapes. The findings indicate that optimum use of materials can be achieved by deciding the thickness of steel tube. A better ductility index can be obtained with the use of higher thickness of tube.

Effect of Different Aging Times on Sn-Ag-Cu Solder Alloy

  • Ervina Efzan, M.N.;Siti Norfarhani, I.
    • Transactions on Electrical and Electronic Materials
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    • 제16권3호
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    • pp.112-116
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    • 2015
  • This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu6Sn5, Cu3Sn, Ni3Sn and Ni3Sn2 IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

MPTMS Treated Au/PDMS Membrane for Flexible and Stretchable Strain Sensors

  • Yang, Seongjin;Lim, Hyun Jee;Jeon, Hyungkook;Hong, Seong Kyung;Shin, Jung Hwal
    • 센서학회지
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    • 제25권4호
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    • pp.247-251
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    • 2016
  • Au/PDMS membranes are widely used to fabricate strain sensors which can detect input signals. An interfacial adhesion between metal films and polydimethylsiloxane (PDMS) substrates is one of the important factors determining the performance of strain sensors, in terms of robustness, reliability, and sensitivity. Here, we fabricate Au/PDMS membranes with (3-mercaptopropyl) trimethoxysilane (MPTMS) treatment. PDMS membranes were fabricated by spin-coating and the thickness was controlled by varying the spin rates. Au electrodes were deposited on the PDMS membrane by metal sputtering and the thickness was controlled by varying sputtering time. Owing to the MPTMS treatment, the interfacial adhesion between the Au electrode and the PDMS membrane was strengthened and the membrane was highly transparent. The Au electrode, fabricated with a sputtering time of 50 s, had the highest gauge factor at a maximum strain of ~0.7%, and the Au electrode fabricated with a sputtering time of 60 s had the maximum strain range among sputtering times of 50, 60, and 120 s. Our technique of using Au/PDMS with MPTMS treatment could be applied to the fabrication of strain sensors.

투과곡선을 이용한 La 농도에 따른 PLT 박막의 광학적 특성에 관한 연구 (A study on the optical properties of PLT thin films with varying the La concentration by using the transmission spectrum)

  • 강성준;윤석민;윤영섭
    • 전자공학회논문지D
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    • 제34D권5호
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    • pp.22-31
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    • 1997
  • We have measured the optical properties, thickness, and energy band gap of the P $b_{1-x}$/100/L $a_{x}$100/ $Ti_{1-}$0.25x/100/ $O_{3}$ (PLT(x)) thin film prepared by the sol-gel method with varying the La concentration, x, fyom 15 nto 33 mol%. We have obtained the values from the tranmission spectrum and employed the envelope method in anayzing the spectrum. We have also performed the simulation of the transmission spectrum on the PC (personal computer) to verify the accuracy of the values 15 to 33mol%, the refractive index (at .lambda.=632.8nm) increases from 2.39 to 2.44. The extinction coefficient does not depend on the la concentration but mainly on te wavelength, and has the values between 0.2 and 0.5 at the wavelength shorter than 330nm and between 0.001 and 0.008 at the wavelength longer than 700nm. The energy band gap of the PLT (x) thin film has been obtained on the assumption of the direct band-to-band transition. It decreases from 3.28 to 3.17eV as the La concentration increases from 15 to 33 mol%. The thickness of the PLT(x) thin film has been also obtained in high accuracy by the envelope method..

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Assessment of dynamic crushing and energy absorption characteristics of thin-walled cylinders due to axial and oblique impact load

  • Baaskaran, N.;Ponappa, K.;Shankar, S.
    • Steel and Composite Structures
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    • 제28권2호
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    • pp.179-194
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    • 2018
  • Reliable and accurate method of computationally aided design processes of advanced thin walled structures in automotive industries are much essential for the efficient usage of smart materials, that possess higher energy absorption in dynamic compression loading. In this paper, most versatile components i.e., thin walled crash tubes with different geometrical profiles are introduced in view of mitigating the impact of varying cross section in crash behavior and energy absorption characteristics. Apart from the geometrical parameters such as length, diameter and thickness, the non-dimensionalized parameters of average forces which control the plastic bending moment for varying thickness has explored in view of quantifying its impact on the crashworthiness of the structure. The explicit finite element code ABAQUS is utilized to conduct the numerical studies to examine the effect of parametric modifications in crash behavior and energy absorption. Also the simulation results are experimentally validated. It is evident that the circular cross-sectional tubes are preferable as high collision impact shock absorbers due to their ability in withstanding axial and oblique impact loads effectively. Furthermore, the specific energy absorption (SEA), crash force efficiency (CFE), plastic bending moment, peak force responses and its impact for optimally tailoring a design to cater the crashworthiness requirements are investigated. The primary outcome of the study is to provide sufficient information on circular tubes for the use of energy absorbers where impact oblique loading is expected.

정공 주입층 CuPc 두께 변화에 따른 유기 발광 소자의 발광 특성 (Electroluminescent Properties of Organic Light-emitting Diodes Depending on the Thickness of CuPc Hole-injection Layer)

  • 이정복;김경환;김태완;이원재
    • 한국전기전자재료학회논문지
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    • 제26권12호
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    • pp.899-903
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    • 2013
  • We investigated the luminescence properties of $Alq_3$ in the device structure of ITO/CuPc/TPD/$Alq_3$/Al. The CuPc as a hole-injection material and TPD as hole-transport material. Emission properties were measured by varying a layer thickness of CuPc (0 nm to 50 nm), which is the hole-injection layer. As a result, it was found that the hole injection occurs smoothly when the layer thickness was 20 nm among the thicknesses from 0 nm to 50 nm.

Numerical Analysis of Through Transmission Pulsed Eddy Current Testing and Effects of Pulse Width Variation

  • Shin, Young-Kil;Choi, Dong-Myung
    • 비파괴검사학회지
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    • 제27권3호
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    • pp.255-261
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    • 2007
  • By using numerical analysis methods, through transmission type pulsed eddy current (PEC) testing is modeled and PEC signal responses due to varying material conductivity, permeability, thickness, lift-off and pulse width are investigated. Results show that the peak amplitude of PEC signal gets reduced and the time to reach the peak amplitude is increased as the material conductivity, permeability, and specimen thickness increase. Also, they indicate that the pulse width needs to be shorter when evaluating the material conductivity and the plate thickness using the peak amplitude, and when the pulse width is long, the peak time is found to be more useful. Other results related to lift-off variation are reported as well.

스퍼터로 성장된 알루미늄 박막의 공정 변수와 박막 두께에 따른 물성 (Film Properties of Al Thin Films Depending on Process Parameters and Film Thickness Grown by Sputter)

  • 오일권;윤창모;장진욱;김형준
    • 한국재료학회지
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    • 제26권8호
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    • pp.438-443
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    • 2016
  • We developed an Al sputtering process by varying the plasma power, process temperature, and film thickness. We observed an increase of hillock distribution and average diameter with increasing plasma power, process temperature, and film thickness. Since the roughness of a film increases with the increase of the distribution and average size of hillocks, the control of hillock formation is a key factor in the reduction of Al corrosion. We observed the lowest hillock formation at 30 W and $100^{\circ}C$. This growth characteristic of sputtered Al thin films will be useful for the reduction of Al corrosion in the future of the electronic packaging field.

A Numerical Analysis of the Thickness-Induced Effect on the Aerodynamic Characteristics of Wings Moving Near Ground

  • Han, Cheolheui;Cho, Jinsoo
    • International Journal of Aeronautical and Space Sciences
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    • 제1권1호
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    • pp.29-35
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    • 2000
  • A numerical method to simulate Wing-In-Ground(WIG) effects for the wings moving near ground is developed. The aerodynamic analysis scheme for the wings is based on a compressible non-planar lifting surface panel method and the WIG effect is included by images. The thickness-induced effect is implemented into the lifting surface panel method by using the teardrop theory. The numerical simulation is done for the rectangular wings by varying the ground proximity. The present method is validated by comparing the calculated aerodynamic coefficients with other numerical results and measured data, showing good agreements.

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