• Journal of the Institute of Electronics Engineers of Korea TC
• /
• v.46 no.2
• /
• pp.114-125
• /
• 2009

Effect of a finite square substrate plane on the radiation characteristics of a microstrip patch antenna is investigated. Effect of a finite square substrate plane on the resonance frequency and bandwidth is very small, while that on the radiation pattern is very large. The gain of front radiation and the direction of the maximum gain vary almost periodically with the length of a square substrate plane. The length of a square substrate plane for the maximum gam and the minimum gain of front radiation decrease as the electrical thickness of a substrate increases. The variation of the gain of front radiation with the length of a square substrate plane increases as the electrical thickness of a substrate increases. The variation of the radiation pattern with the length of a square substrate plane is almost determined by the electrical thickness of a substrate.

• Journal of the Korean Solar Energy Society
• /
• v.22 no.3
• /
• pp.39-46
• /
• 2002

The results of experiment on the performance of natural ventilation by insulation thickness and height system of solar chimney are described. The 3-inside wall was made of concrete and 1-wall was made of glass. The two kinds of model experiment were performed. One was the varition of the 60cm, 90cm and 120cm of solar chimney, the other was the variation of the insulation thickness 10mm and 50mm and without insulation of outside wall of solar cimney. As the temperature difference between bottom and top expressed $1.7\sim2.9^{\circ}C$, air velocity measured $0.5\sim0.8m/s$ and ventilation rate was $194.4m^3/h$ in the case of the 120cm height of solar chimney, the respect of natural ventilation performance was superior to others cases in the first model experiment. Though the case of 120cm height of solar chimney was attached 50mm insulation the ventilation rate was not so much as the case of solar chimney was attached 10mm insulation. the temperature difference between bottom and top was the largest in the other cases. From this research, the natural ventilation performance of solar chimney was affected by not only height and insulation thickness of solar chimney but also wind velocity and directon.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.3
• /
• pp.88-93
• /
• 2023

As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 ㎛.

• Journal of Korean Academy of Oral and Maxillofacial Radiology
• /
• v.29 no.1
• /
• pp.33-42
• /
• 1999

Geometrically standardized dental radiographs were taken. We prepared Digital Cu-Equivalent Image Analyzing System for quantitative assessment of mandible bone. Images of radiographs were digitized by means of Quick scanner and personal Mcquintosh computer. NIH image as software was used for analyzing images. A stepwedge composed of 10 steps of 0.1mm copper foil in thickness was used for reference material. This study evaluated the effects of step numbers of copper wedge adopted for calculating equation. kVp and exposure time on the coefficient of determination(r²)of the equation for conversion to Cu-equivalent image and the coefficient of variation and Cu-Eq value(mm) measured at each copper step and alveolar bone of the mandible. The results were as follows: 1. The coefficients of determination(r²) of 10 conversion equations ranged from 0.9996 to 0.9973(mean=0.9988) under 70kVp and 0.16 sec. exposure. The equation showed the highest r was Y=4.75614612-0.06300524x +0.00032367x² -0.00000060x³. 2. The value of r² became lower when the equation was calculated from the copper stepwedge including 1.0mm step. In case of including 0mm step for calculation. the value of r showed variability. 3. The coefficient of variation showed 0.11, 0.20 respectively at each copper step of 0.2, 0.1mm in thickness. Those of the other steps to 0.9 mm ranged from 0.06 to 0.09 in mean value. 4. The mean Cu-Eq value of alveolar bone was 0.14±0.02mm under optimal exposure. The values were lower than the mean under the exposures over 0.20sec. in 60kVp and over 0.16sec. in 70kVp. 5. Under the exposure condition of 60kVp 0.16sec.. the coefficient of variation showed 0.03. 0.05 respectively at each copper-step of 0.3, 0.2mm in thickness. The value of r² showed over 0.9991 from both 9 and 10 steps of copper. The Cu-Eq value and the coefficient of variation was 0.14±0.01mm and 0.07 at alveolar bone respectively. In summary. A clinical application of this system seemed to be useful for assessment of quantitative assessment of alveolar provided high coefficient of determination is obtained by the modified adoption of copper step numbers and the low coefficient of variation for the range of Cu-Equivalent value of alveolar bone from optimal kVp and exposure time for each x-ray machine.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11b
• /
• pp.181-184
• /
• 2001

Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STD structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters. we studied the correlation between CMP thickness of STI using high selectivity slurry. DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased. the N-poly foot is deteriorated. and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point,, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by $100\AA$. 3.2 $u\AA$ of IDSN is getting better in base 1 condition. In POE 50% condition. 1.7 $u\AA$ is improved. and 0.7 $u\AA$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.181-184
• /
• 2001

Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STI) structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters, we studied the correlation between CMP thickness of STI using high selectivity slurry, DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased, the N-poly foot is deteriorated, and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by 100 ${\AA}$, 3.2 u${\AA}$ of IDSN is getting better in base 1 condition. In POE 50% condition, 1.7 u${\AA}$ is improved, and 0.7 u${\AA}$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

• Journal of the Korean Geotechnical Society
• /
• v.26 no.10
• /
• pp.39-47
• /
• 2010

In order to investigate the effect of variation characteristics of compression index on the spatial distribution of consolidation settlement, this study presents the estimation methods of the distribution of consolidation settlement and compares the estimated settlements. When the variation of compression index is considerable, the ordinary cokriging is more reliable in estimating the compression index than ordinary kriging because smoothing effect of ordinary cokriging is smaller than that of ordinary kriging. The spatial distribution of consolidation settlement estimated by considering both the variation of compression index and void ratio (CASE-1) is different from that estimated by using the mean value of all soil properties (CASE-2). The settlement of CASE-1 shows the larger variation at short distances rather than that of CASE-2. Whereas the spatial settlement distribution of CASE-1 is affected by the spatial distributions of compression index as well as the thickness of consolidation layer, that of CASE-2 is significantly influenced by the distribution of consolidation layer thickness.

• Journal of Magnetics
• /
• v.13 no.2
• /
• pp.65-69
• /
• 2008

The magneto impedance (MI) behaviors of patterned $Co_{30}Fe_{34}Ni_{36}$ microwire were investigated with respect to its shape variation. After preparing $Co_{30}Fe_{34}Ni_{36}$ microwires using electrodeposition and photolithography methods, impedance measurements were conducted to compare the MI ratios of the devices with different aspect ratios. As a result, the anisotropy field and transverse permeability were found to be strongly affected by the aspect ratio of the device. The external field value at the maximum impedance and maximum sensitivity of the device was found to increase with increasing device width, which was attributed to the increased transverse anisotropy with decreasing aspect ratio. While an increase in the thickness also contributed to an increase in the MI ratio, a variation in the thickness not only increased the anisotropic field, but the variation in the MI ratio was as also affected by the skin effect. Conversely, the MI ratios of the present devices were hardly affected by variations in the length. Considering the typical aspect ratios of our devices, it was expected that the length effect would emerge when the aspect ratio was reduced to less than 10. Nevertheless, our results show that for the practical application of MI devices, the MI characteristics can be optimized by tailoring the aspect ratio of the devices.

• Korean Journal of Optics and Photonics
• /
• v.15 no.4
• /
• pp.293-298
• /
• 2004

We investigate the effect of the wing width and thickness of a Double-Sided Deep-Ridge(DSDR) vertical directional coupler on the coupling length dependent on the polarization, We have found that the DSDR vertical directional coupler without a wing does not have polarization independent coupling lengths. The variation of the coupling length of TE and TM modes and the difference between the coupling lengths of the two modes are negligible as the wing width increases beyond the specific wing width for the same wing thickness. Thus, we can see that a DSDR vertical directional coupler has a wing width larger than the minimum wing width to obtain the polarization independent coupling length. The minimum wing width increases as the wing thickness increases for the same core thickness and as the core thickness decreases for the same wing width. Also, we have found that the minimum wing thickness is determined by the core thickness and the minimum wing thickness decreases as the core thickness increases.

• Restorative Dentistry and Endodontics
• /
• v.19 no.1
• /
• pp.73-84
• /
• 1994

Using a model system that can compare the before and after of canal preparation in the same tooth, we measured the area of the cross section, and canal wall thickness of the distal portion of the mesial root of the mandibular molar, and compared the amount of reduction in the canal using hand flared preparation the Gates-Glidden drill flared preparation according to the changes in the MAF. The results were as follows. 1. After canal preparation, the canal wall thickness had no significant difference between the hand flared preparation and Gates-Glidden drill flared preparation. 2. The canal wall thickness, after canal preparation, there was no significant difference between the sizes of the MAF. 3. The area variation range of each cross section of root had no significant difference between MAF size and methods of canal preparation. 4. After canal preparation, the frequency of the canal wall thickness under 0.5mm showed 3.5mm below the furcation to be the most frequent with statistical significance(p<0.05). 2mm below the furcation and 5mm below the furcation followed but there was no statistical significance. 5. The danger zone of the mesial root of the mandibular molar seems to be around 3.5mm.