• Journal of Advanced Marine Engineering and Technology
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• 제39권8호
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• pp.801-806
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• 2015

The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

• Journal of Advanced Marine Engineering and Technology
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• 제40권2호
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• 조명전기설비학회논문지
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• 제29권1호
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• pp.15-21
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• 2015

The purpose of this paper is to analyze thermal characteristics of the heat sinks to maximize the thermal diffusivity for LED floodlight. The 2 kind of samples were prepared by vapor chamber manufacturing technology using the heat pipe principle. It was analyzed the maximum temperature reduction effect and the thermal diffusion from the heat source depending on the types of chambers with 3 kind of working fluids. As a result, it was confirmed that thermal conductivity 23% increased, GVC-R type than IVC-R type.

• 설비공학논문집
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• 제16권12호
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• pp.1107-1116
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• 2004

In this paper, the effects of diverse parameters on the operation of loop heat pipe (LHP), such as particle diameter of sintered porous wick, wick porosity, vapor line diameter, thickness of wick and heating capacity were investigated by a theoretical analysis. A LHP has a wick only in its evaporator for the circulation of working fluid, and utilizes a porous wick structure of which pore size is very small to obtain a large capillary force. The working fluid is water and the material of sintered porous wick is copper. For these different parameters, capillary pressure, pressure drop in wick, pressure drops and temperature distribution were analyzed by a theoretical design method of LHP.

• 대한기계학회논문집B
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• 제34권12호
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• pp.1079-1085
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• 2010

평판형 증발부를 갖는 루프히트파이프(LHP)에 대한 정상상태 해석모델을 제시하였다. 관련문헌의 고찰에 기초하여 LHP 의 주요 부분인 증발부, 액체저장조(보상챔버), 증기이송관, 액체이송관 및 응축부에서 온도와 압력을 예측할 수 있도록 계산과정을 제시하였으며, LHP 에서 유일하게 모세관 구조물을 가지는 증발부의 해석에 중점을 두었다. 증발부에서 액체 -기체 경계면 부근에서 압력과 온도의 영향을 고려하기 위해 박막이론을 사용하였으며, 수정된 기체분자운동이론에서 응축경계면 온도를 산정하는데 있어서 독특한 방법을 도입하였다. 응축부에서는 상변화 경계면을 단순화하여 처리함으로써 응축부 형상 변화에 상대적인 융통성을 구비하도록 하였다. 본 연구의 LHP 정상상태 해석 모델은 문헌 상의 실험결과에 의해 타당성이 증명되었다. 해석모델에 의한 예측치는 실험치와 비교할 때 절대온도를 기준으로 최대 상대오차 3% 이내로서 합리적으로 잘 일치하였다.

• 전자통신동향분석
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• 제38권6호
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• 자원리싸이클링
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• 제9권4호
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• pp.28-36
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• 2000

본 연구는 입자가 혼합된 용제를 이중판형 열교환기 내에서 가열 및 증발과정을 통해 건조이자와 용제로 분리하여 회수하기 위한 연속식 순간 진공건조 시스템 해석에관한 것이다. 진공건조시스템은 용제 공급펌프, 이중관형 열교환기, 진공 스프레이 챔버 및 응축기로 구성된다. 연속적으로 공급되는 용제는 이중관형 열교환기 내에서 가열, 팽창 및 증발되며 관 출구부에서 팽창된 증기가 진공 스프레이 챔버 내로 분사되고 증기는 응축기로 수송되어 용제로 회수되고 입자는 관성력에 의해 증기로부터 분리되어 건조된다ㅣ. 안료입자가 함유된 벤젠 및 알킬벤젠의 분리 및 회수성능 실험을 수행한 결과, 습분양 1.1%로 건조된 안료입자를 94% 회수하였고, 99.9 wt%의 고순도 벤젠을 88% 회수하였다. 평균직경이 $6.5\mu\textrm{m}$인 안료입자를 진공건조시스템의 이중관형 열교환기에서 관출구부의 고속 분사에 의한 폭발적 분산력에 의해 입경이 14%감소된 $5.6\mu\textrm{m}$ 크기의 건조 안료입자를 회수하였다. 따라서 진공건조시스템은 용제에 함유된 입자를 건조 및 분리하여 미분제 제품으로 히수하는데 효율적이며 폐용제 정제용으로 적용이 가능하다.