• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.331-331
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• 2012

In this study, we investigated morphology observation of nanostructured Ti-25Ta-xZr alloys. Ti-25Ta-(3wt%~15 wt%) Zr alloys were prepared by a vacuum arc-melting furnace. Formation of nanotubular structure was achieved by an electrochemical method in 1M $H_3PO_4$ electrolytes containing 0.8%wt.% NaF. Nanotube morphology depended on alloying elements.

• Nuclear Engineering and Technology
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• v.50 no.7
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• pp.1184-1189
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• 2018

Pyroprocessing uses various molten salts during electrochemical unit processes. Reaction products after the electrochemical processes must contain a significant amount of residual salts to be separated. Vacuum distillation is a common method to separate the residual salts; however, its high operation temperature may cause side reactions. In this study, a simple rotation technique using centrifugal force was suggested to separate the residual salts from the reaction products at relatively low temperature compared to the distillation technique. When a reaction product container with porous wall rotates inside a vessel heated above the melting point of the residual salt, the residual salt in the liquid phase is separated through centrifugal force. It was shown that the $LiNO_3-Al_2O_3$ mixture can be separated by this technique to leave solid $Al_2O_3$ inside the container, with a separation efficiency of 99.4%.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.4
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• pp.179-184
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• 2021

Two types of secondary hardening martensitic steels, 10Co-14Ni and 6Co-5Ni, were produced by vacuum induction melting to investigate the effect of ausforming process on mechanical properties. According to the results of present study, the alloy samples ausformed at low temperature indicated a rather low hardness level in overall aging time despite the refinement of martensite lath width. As the result can closely be related with the presence of primary carbides precipitated within the initial austenite matrix, we confirmed that, in ultrahigh strength secondary hardening martensitic alloy steels, the ausforming process can rather limit the degree of secondary hardening during the subsequent aging treatment.

• Journal of the Mineralogical Society of Korea
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• v.18 no.4 s.46
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• pp.289-299
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• 2005

Annealing experiments on albite powders, thin sections, and TEM specimens have been performed utilizing an optical microscope heating stage. Sample orientations were determined by optical microscope and XRD, and then confirmed by TEM diffraction patterns. Partial melting of samples occurred at $1030^{\circ}C$-l2 hr for powder, but at $1060^{\circ}C$-12 hr for TEM specimen. It is difficult to get TEM images of albite microstructures above this temperature due to thickening and the amorphous phase of the melted part. Correlative studies between optical microscopy and TEM indicated that the $1050^{\circ}C$-12 hr annealing in ambient condition was most adequate to observe tweed microstructures in albite through TEM. In situ TEM heating experiments for direct observation of tweed microstructures in albite may require annealing at slightly higher temperatures than $1050^{\circ}C$ considering the high vacuum condition inside TEM.

• Journal of Powder Materials
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• v.18 no.2
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• pp.141-148
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• 2011

Carbon material shows relatively high strength at high temperature in vacuum atmosphere and can be easily removed as CO or $CO_2$ gas in oxidation atmosphere. Using these characteristics, we have investigated the applicability of carbon mold for precision casting of high melting point metal such as nickel. Disc shape carbon mold with cylindrical pores was prepared and Ni-base super alloy (CM247LC) was used as casting material. The effects of electroless Nickel plating on wettability and cast parameters such as temperature and pressure on castability were investigated. Furthermore, the proper condition for removal of carbon mold by evaporation in oxidation atmosphere was also examined. The SEM observation of the interface between carbon mold and casting materials (CM247LC), which was infiltrated at temperature up to $1600^{\circ}C$, revealed that there was no particular product at the interface. Carbon mold was effectively eliminated by exposure in oxygen rich atmosphere at $705^{\circ}C$ for 3 hours and oxidation of casting materials was restrained during raising and lowering the temperature by using inert gas. It means that the carbon can be applicable to precision casting as mold material.

• Nuclear Engineering and Technology
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• v.54 no.7
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• pp.2376-2385
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• 2022

Two groups of oxide dispersion-strengthened reduced-activation ferritic/martensitic steels (A and B) were prepared by adding Y, Ti, and Zr into steels through vacuum induction melting to investigate the inclusions, microstructures, mechanical properties of the alloys. Results showed that particles with Y, Ti, and Zr easily formed. Massive, Zr-rich inclusions were found in B steel. Density of micron inclusions in A steel was 1.42 × 10¹⁴ m^-3, and density of nanoparticles was 3.61 × 10¹⁶ m^-3. More and finer MX carbides were found in steel tempered at 650 ℃, and yield strengths (YS) of A and B steel were 714±2 and 664±3.5 MPa. Thermomechanical processing (TMP) retained many dislocations, which improved the mechanical properties. YSs of A and B treated by TMP were 725±3 and 683±4 MPa. The existence of massive Zr-rich inclusions in B steels interrupted the continuity of the matrix and produced microcracks (fracture), which caused a reduction in mechanical properties. The presence of fine prior austenite grain size and inclusions was attributed to the low DBTTs of the A steels; DBTTs of A650 and A700 alloy were -79 and -65 ℃. Tempering temperature reduction and TMP are simple, readily useable methods that can lead to a superior balance of strength and impact toughness in industry applications.

• Journal of the Semiconductor & Display Technology
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• v.21 no.3
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• pp.74-79
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• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.203-207
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• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• Journal of the Korean Vacuum Society
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• v.13 no.2
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• pp.86-91
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• 2004

Transiton-metal gallides attract wide interest as a candidate for high-temperature structural materials. In a wide composition range, in which it was known that Co-Ga alloy have CsCl (B2) crystallographic structure, a systematic study on the correlation between physical properties and electronic structures of Co-gallides was performed. $Co_{l-x}Ga$ $_{x}$ alloys ($0.35\leq$x$\leq0.55$) were prepared by arc-melting method and were annealed at $1000 ^{\circ}C$ for 48hour to increase the homogeneity. In this composition range all the prepared alloys have the CsCl (B2) structure. The chemical states and the electronic structure were studied by using x-ray photoemission spectroscopy (XPS), and x-ray absorption near-edge structure (XANES), and exhibit different physical properties depending on the composition. During the annealing, a significant oxidation has happened and all the oxygen atoms are incorporated with the Ga atoms to form a $Ga_2O_3$ phase. In a view point of electronic structure, the $Co_{l-x}Ga$ $_{x}$ alloys were formed by the Ga(p) - Co(d) hybridization.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.271-272
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• 2012

Bulk Metallic Glasses (BMGs or amorphous alloy) exhibit high strength and good corrosion resistance. Applications of thin films and micro parts of BMGs have been used a lot since its inception in the research of BMGs. However, Application and fabrication of BMGs are limited to make structural materials. Thin films of BMGs which is sputtered on the surface of structural materials by sputtering process is used to improve limits about application of BMGs. In order to investigate the difference of properties between designed alloys and thin films, we identified that thin films deposited on the surface that have the characteristic of the amorphous films and the composition of designed alloys. Zr-Cu (Cu=30, 35, 38, 40, 50 at.%) and Zr-Cu-Al (Al=10 at.% fixed, Cu=26, 30, 34, 38 at.%) alloys were fabricated with Zr (99.7% purity), Cu (99.997% purity), and Al (99.99% purity) as melting 5 times by arc melting method before rods 2mm in diameter was manufactured. In order to analyze GFA (Glass Forming Ability), rods were observed by Optical Microscopy and SEM and $T_g$, $T_x$, ($T_x$ is crystallization temperature and $T_g$ is the glass transition temperature) and Tm were measured by DTA and DSC. Powder was manufactured by Gas Atomizer and target was sintered using powder in large supercooled liquid region ($=T_x-T_g$) by SPS(Spark Plasma Sintering). Amorphous foil was prepared by RSP process with 5 gram alloy button. The composition of the foil and sputtered thin film was analyzed by EDS and EPMA. In the result of DSC curve, binary alloys ($Zr_{62}Cu_{38}$, $Zr_{60}Cu_{40}$, $Zr_{50}Cu_{50}$) and ternary alloys ($Zr_{64}Al_{10}Cu_{26}$, $Zr_{56}Al_{10}Cu_{34}$, $Zr_{52}Al_{10}Cu_{38}$) have $T_g$ except for $Zr_{70}Cu_{30}$ and $Zr_{60}Al_{10}Cu_{30}$. The compositions with $T_g$ made into powders. Figure shows XRD data of thin film showed similar hollow peak.