• Proceedings of the KSME Conference
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• 2000.11b
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• pp.247-254
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• 2000

The base pressure of vacuum vessel of the KSTAR (Korea Superconducting Tokamak Advanced Research) Tokamak is to be a ultra high vacuum, $10^{-6}{\sim}10^{-7}Pa$, to produce clean plasma with low impurity containments. For this purpose, the KSTAR vacuum vessel and plasma facing components need to be baked up to at least $250^{\circ}C,\;350^{\circ}C$ respectively, within 24 hours by hot nitrogen gas from a separate baking/cooling line system to remove impurities from the plasma-material interaction surfaces before plasma operation. Here by applying the implicit numerical method to the heat balance equations of the system, overall temperature distributions of the KSTAR vacuum vessel and plasma facing components are obtained during the whole baking process. The model for 2-dimensional baking analysis are segmented into 9 imaginary sectors corresponding to each plasma facing component and has up-down symmetry. Under the resulting combined loads including dead weight, baking gas pressure, vacuum pressure and thermal loads, thermal stresses in the vacuum vessel during bakeout are calculated by using the ANSYS code. It is found that the vacuum vessel and its supports are structurally rigid based on the thermal stress analyses.

• Smart Structures and Systems
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• v.24 no.6
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• pp.759-768
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• 2019

In nuclear fusion reactors, the key structural component (i.e., the plasma-facing component) undergoes high heat flux cyclic loading. To ensure the safety of fusion reactors, an experimental study on the temperature-induced creep of stainless steel under heat flux cyclic loading was performed in the present work. The strains were measured using a stereo digital image correlation technique (3D-DIC). The influence of the heat haze was eliminated, owing to the use of a vacuum environment. The specimen underwent heat flux cycles ($500^{\circ}C-1000^{\circ}C$) with different mechanical preloads (0 kN, 10 kN, 30 kN, and 50 kN). The results revealed that, for a relatively large preload (for example, 50 kN), a single temperature cycle can induce a residual strain of up to $15000{\mu}{\varepsilon}$.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.111-111
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• 2012

In this talk, we represent a novel approach to investigating intra-nanorod surface plasmon coupling with control over block compositions. The multi-component rod-like nanostructures, which consist of optically active components (Au and Ag) and optically less active component (for example, Ni) in UV-vis-NIR spectral window, showed interesting optical response depending on each block length and the total length of the structure. By controlling the composition and relative lengths of the blocks that comprise these structures, we can tailor the overall optical properties. Depending on the relative fraction of Au and Ag blocks, the intensity of the transverse modes varied without noticeable peak shifts. However, the strong intraparticle surface plasmon coupling resulted in the collective appearance of longitudinal LSP modes, including higher-order modes. The experimental observations were confirmed by theoretical calculation, using a discrete dipole approximation method. In addition, we will briefly discuss how single nanorod solar cells can be synthesized by using by using electrochemical deposition and AAO hard templates.

• Vacuum Magazine
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• v.1 no.2
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• pp.24-29
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• 2014

Display is a key component in electronic devices. OLED is growing very fast recently due to the explosion of the smart phone market although still LCD is the dominating display technology in the display market at the moment. Also needs for the large area and high resolution TVs and flexible displays are increasing these days. Especially flexible display is expected to be one of the key technologies in mobile devices requiring small device size and large display size. Contrary to the conventional displays, flexible display requires organic materials for the substrate, the active driving element and also for the display element. Plastic film as a substrate, organic semiconductor as an active component of the transistor and organic light emitting materials or electronic paper as a display element are studied actively. In this article, mainly backplane technologies such as substrates and the transistor materials for flexible display will be introduced.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.182-182
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• 2012

Plasma etching is used in various semiconductor processing steps. In plasma etcher, optical- emission spectroscopy (OES) is widely used for in-situ endpoint detection. However, the sensitivity of OES is decreased if polymer is deposited on viewport or the proportion of exposed area on the wafer is too small. Because of these problems, the object is to investigate the suitability of using plasma impedance monitoring (PIM) and self plasma optical emission spectrocopy (SPOES) with statistical approach for in-situ endpoint detection. The endpoint was determined by impedance signal variation from I-V monitor (VI probe) and optical emission signal from SPOES. However, the signal variation at the endpoint is too weak to determine endpoint when $SiO_2$ and SiNx layers are etched by fluorocarbon on inductive coupled plasma (ICP) etcher, if the proportion of $SiO_2$ and SiNx area on Si wafer are small. Therefore, modified principal component analysis (mPCA) is applied to them for increasing sensitivity. For verifying this method, detected endpoint from impedance monitoring is compared with optical emission spectroscopy.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.32-32
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• 2011

Plasma etching is used in microelectronic processing for patterning of micro- and nano-scale devices. Commonly, optical emission spectroscopy (OES) is widely used for real-time endpoint detection for plasma etching. However, if the viewport for optical-emission monitoring becomes blurred by polymer film due to prolonged use of the etching system, optical-emission monitoring becomes impossible. In addition, when the exposed area ratio on the wafer is small, changes in the optical emission are so slight that it is almost impossible to detect the endpoint of etching. For this reason, as a simple method of detecting variations in plasma without contamination of the reaction chamber at low cost, a method of measuring plasma impedance is being examined. The object in this research is to investigate the suitability of using plasma impedance monitoring (PIM) with statistical approach for real-time endpoint detection of $SiO_2$ etching. The endpoint was determined by impedance signal variation from I-V monitor (VI probe). However, the signal variation at the endpoint is too weak to determine endpoint when $SiO_2$ film on Si wafer is etched by fluorocarbon plasma on inductive coupled plasma (ICP) etcher. Therefore, modified principal component analysis (mPCA) is applied to them for increasing sensitivity. For verifying this method, detected endpoint from impedance analysis is compared with optical emission spectroscopy (OES). From impedance data, we tried to analyze physical properties of plasma, and real-time endpoint detection can be achieved.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.11
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• pp.1359-1367
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• 2004

The demand of vacuum pump has been increased in the process of semi-conduct manufacturing, as a core component. The response of the system for vacuum pump performance test can be utilized to assess the system and to obtain the reliability of the apparatus for the test. The system consists of gas supply tank, pressure chamber, measurement chamber and transmission line. Transient analysis for compressible fluid has been conducted to evaluate the dynamic characteristic of the volume terminated transmission line. Numerical approach based on the method of characteristics is used for the analysis. The response is evaluated with the important parameters for the system: i.e., length and diameter of the line, volume of the terminal tank. Using the numerical results, pumping speeds are calculated and then compared to the experimental results.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.204-204
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• 1999

The plasma source ion implantation(PSII) technique which is a method using high negative voltage pulse in plasma system has the potential to change the surface properties of polymer. PSII technique increase the surface free energy by introducing polar functional groups on the surface so that it improves reactivity, hydrophilicity, adhension, biocompatability, etc. However, the mobility of polymer chains enables the modified surface layers to adapt their composition to interfacial force. This hydrophobic recovery interrupts the stability of modified surfaces to keep for the long time. In this study, poly(methyl methacrylate)(PMMA), poly(2-hydroxyethyl methacrylate)(PHEMA), and polu(2-hydroxypropyl methacylate)(PHPMA) for contact lens application, were modified to improve the wettability with PSII technique and were investigated the surface stabilities. Polymer film was prepared with solution casting(3 wt.% solution) and was annealed at 11$0^{\circ}C$ under vacuum oven to remove solvent completely and to eliminate physical ageing. The thickness of the film measured by scanning electron microscopy (SEM) and surface profilometer was about 10${\mu}{\textrm}{m}$. Polymers were treated with different kinds of gases, pulse frequency, pulse with, pulse voltage, and treatment time. Even though PMMA, PHEMA, and PHPMA have similar repeat unit structure, the optimal treatment conditions and the tendency to hydrophobic recovery were different. PHPMA, more hydrophilic polymer than PMMA and PHEMA showd better wettability and stability after mild treatment. Surface tensions were obtained by water and diiodomethane contact angle measurements to monitor the relation between hydrophobic recovery and polymer structure. Different ion species in plasma change the polar component and dispersion component of polymer surface. For better wettability surface, the increase of polar component was a dominant factor. We also characterized modified polymer surfaces using x-ray photoelectron spectroscopy(XPS), secondary ion mass spectrometry(SIMS), Fourier Transform infrared spectroscopy(FT-IR), and SEM.

• Vacuum Magazine
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• v.2 no.4
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• pp.27-32
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• 2015

Plasma diagnosis and multivariate analysis techniques for plasma processes are reviewed. The principles and applications of optical emission spectroscopy (OES) and VI probe are discussed briefly. The research results of principal component analysis (PCA), one of the widely used multivariate analysis techniques for plasma process monitoring is discussed in this article.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.8 s.251
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• pp.772-779
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• 2006

Window is a critical component in the design of energy-efficient buildings. To minimize the heat loss, insulation performance of the glazing has to be improved. Manufacturing of vacuum glazing has been motivated by the possibility of making windows of very good thermal insulation properties for such applications. It is made by maintaining vacuum in the gap between two glass panes. Pillars are placed between them to withstand the atmospheric pressure. Edge covers are applied to reduce conduction through the edge. Accurate measurements have been made of the radiative heat transfer, the pillar conduction and the gas conduction using a guarded hot plate apparatus. Vacuum glazing is found to have low thermal conductance roughly below $1W/m^2K$. Among the heat transfer modes of residual gas conduction, conduction through support pillar and the radiative heat transfer between the glass panes, the last one is the most dominant to the overall thermal conductance. Vacuum glazing using very low emittance AI-coated glass has an overall thermal conductance of about $0.7W/m^2K$.