• 한국신뢰성학회지:신뢰성응용연구
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• 제5권4호
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• pp.413-425
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• 2005

As an alternative to traditional life testing, degradation tests can be effective in assessing product reliability when measurements of degradation leading to failure can be observed. This article presents an accelerated degradation testing for vacuum fluorescent displays (VFDs). The accelerated degradation model is based on Arrhenius-lifetime relationship for cathode temperatures. We compare the results between accelerated degradation test and test at normal use condition. Accelerated degradation test for display devices is observed as an efficient method to warrantee product reliability to customers, as well as a tool to save time and costs.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 추계학술대회 논문집 전기물성,응용부문
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• pp.160-163
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• 2003

This paper represent a test method for the reliability assessment on the indoor vacuum circuit breakers used in the distribution system by an accelerated life test. In order to guarantee the lifetime in service of the vacuum circuit breaker, additional test methods are suggested. Multiple closing-opening operation test under no load condition as a mechanical endurance test and a check of the quality in the vacuum interrupter are adopted to assure the long-term reliability of the vacuum circuit breaker.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.244.1-244.1
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• 2016

Recently, the technology for flexible electronics such as flexible smart phone, foldable displays, and bendable battery is under active development. With approaching the real commercialization of flexible electronics, the electrical and mechanical reliability of flexible electronics have become significantly important because they will be used under various mechanical deformations such as bending, twisting, stretching, and so on. These mechanical deformations result in performance degradation of electronic devices due to several mechanical problems such as cracking, delamination, and fatigue. Therefore, the understanding of relationship between mechanical loading and electrical performance is one of the most critical issues in flexible electronics for expecting the lifetime of products. Here, we have investigated the effect of monotonic tensile and cyclic deformations on metal interconnect to provide a guideline for improving the reliability of flexible interconnect.

• 한국군사과학기술학회지
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• 제13권4호
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• pp.542-550
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• 2010

Cooled infrared detector is widely used as the core part in a variety of the thermal imaging systems. For the selection of the highly reliable cooled infrared detector with good performance, it is necessary for us to possess the characterization methods of the well defined performance index of cooled infrared detector. In this paper, various performance index of the cooled infrared detector including reliability as well as the optical and cooling performance of cooled infrared detector are defined and their characterization methods will be investigated and implemented systematically.

• 한국진공학회지
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• 제2권2호
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• pp.188-198
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• 1993

두께가 6~10 nm인 게이트 산화막의 계면에 염소(Cl)를 도입시킨 n-MOS capacitor 및 n-MOSFET을 제잘하여 물성적인 방법(SIMS, ESCA)과 전기적인 방법에 의해서 소자의 특성을 분석, 평가하였다. Last step TCA법을 이용하여 성장시킨 산화막은 No TCA법으로 성장시킨 것보다 mobility가 7% 정도 증가하였고, 결함 밀도도 감소하였다. Time-zero-dielectric-breakdown(TZDB)으로 측정한 결과, Cl를 도입한 막의 파괴 전계(breakdon field)는 18 MV/cm인데, 이것은 Cl을 도입하지 않은 것보다 약 0.6 MV/cm 정도 높은 값이다. 또한 time-dependent-dielectric-breakdown(TDDB) 결과로부터 수명이 20년 이상인 것으로 평가되었고, hot carrier 신뢰성 측정으로부터 평가한 소자의 수명도 양호한 것으로 나타났다. 이상의 결과에서 Cl을 계면에 도입시킨 게이트 산화막을 가진 소자가 좋은 특성을 나타내고 있으므로 Last step TCA법을 종래의 산화막 성장 방법 대신에 사용하면 MOSFET 소자의 새로운 게이트 절연막 성장법으로서 대단히 유용할 것으로 생각된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.380-380
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• 2010

Currently, organic light-emitting diodes (OLEDs) have been proven of their readiness for commercialization in terms of lifetime and efficiency. In accordance with emerging new technologies, enhancement of light efficiency and extension of application fields are required. Particularly inverted structures, in which electron injection occurs at bottom and hole injection on top, show crucial advantages due to their easy integration with Si-based driving circuits for active matrix OLED as well as large open area for brighter illumination. In order to get better performance and process reliability, usually a proper buffer layer for carrier injection is needed. In inverted top emission OLED, the buffer layer should protect underlying organic materials against destructive particles during the electrode deposition, in addition to increasing their efficiency by reducing carrier injection barrier. For hole injection layers, there are several requirements for the buffer layer, such as high transparency, high work function, and reasonable electrical conductivity. As a buffer material, a few kinds of transition metal oxides for inverted OLED applications have been successfully utilized aiming at efficient hole injection properties. Among them, we chose 2 nm of $WO_3$ between NPB [N,N'-bis(1-naphthyl)-N,N'-diphenyl-1,1'-biphenyl-4,4'-diamine] and Au (or Al) films. The interfacial energy-level alignment and chemical reaction as a function of film coverage have been measured by using in-situ ultraviolet and X-ray photoelectron spectroscopy. It turned out that the $WO_3$ interlayer substantially reduces the hole injection barrier irrespective of the kind of electrode metals. It also avoids direct chemical interaction between NPB and metal atoms. This observation clearly validates the use of $WO_3$ interlayer as hole injection for inverted OLED applications.

• 한국진공학회지
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• 제21권3호
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• pp.164-170
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• 2012

청색 발광다이오드(LED) InGaN/GaN의 방사 피크 파장에 따른 LED 소자의 성능 저하를 광학적 및 전기적 특성을 고려하여 조사하였다. 방사 피크 파장이 437~452 nm인 LED 소자에 전류를 각각 60 mA, 75 mA, 그리고 90 mA로 구동하여 장시간 동안 스트레스를 주었다. 형광체의 유무에 따라서 LED 소자의 광 감쇠 특성을 관측하였다. 형광체가 없는 소자의 광 감쇠 특성은 피크 파장이 단파장일수록 급속하게 떨어진다. 형광체가 있는 소자는 형광체가 없는 것보다 감쇠 특성이 둔감해진다. 전기적 특성은 방사 피크 파장에 의존하지 않고, 스트레스 시간에 따른 LED의 내부 저항이 서서히 증가하는 현상으로 나타난다. 피크 파장에 따른 외형변화는 동일 전류 조건에서 단파장일 때 열화현상이 심하게 발생한다. 이는 청색 발광다이오드에서 발생한 빛의 파장이 단파장영역으로 갈수록 칩 외의 재료에서 단파장 광 흡수가 증가하여 열화현상이 가속화되는 것으로 분석된다. 따라서 LED 소자의 장수명을 얻기 위해서는 청색 칩의 방사 피크 파장과 소자재료의 광 열화해석이 중요하다.