• The Journal of Information Technology
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• v.2 no.2
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• pp.235-250
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• 1999

The test of digital VLSI devices is to insure that the device will perform all of its designed functions while in the worst-case environments. According to increasing the integration of the communication device, there are important consideration about the improvement of the reliability in the product. To improve the reliability of the device, the test parameters and test time are increased. There are basically three kinds of tests: functional, DC parametric, and AC parametric. There are no pin-to-pin short test and pin-to-pin leakage test in the present test items to analysis the characteristics and reliability of the device. The purpose of the paper is to model the pin-to-pin phenomenon and propose to modify the test method and to test the new pin-to-pin DC parameters. These modified and additive test items were applied to product test and confirmed to improve the reliability of product test.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.176-186
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• 1996

As the density of VLSI increases, the conventional logic testing is not sufficient to completely detect the new faults generated in design and fabrication processing. Recently, IDDQ testing becomes very attractive since it can overcome the limitations of logic testing. In this paper, G-ATPG (gyeongsang automatic test pattern genrator) is designed which is able to be adapted to IDDQ testing for combinational CMOS VLSI. In G-ATPG, stuck-at, transistor stuck-on, GOS (gate oxide short)or bridging faults which can occur within priitive gate or XOR is modelled to primitive fault patterns and the concept of a fault-sensitizing gate is used to simulate only gates that need to sensitize the faulty gate because IDDQ test does not require the process of fault propagation. Primitive fault patterns are graded to reduce CPU time for the gates in a circuit whenever a test pattern is generated. the simulation results in bench mark circuits show that CPU time and fault coverage are enhanced more than the conventional ATPG using IDDQ test.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.3
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• pp.26-33
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• 1984

This paper proposes a new LSI/VLSI logic design structure which improves shift register latches in conventional LSSD. Test patterns are easily generated and fault coverage is enhanced by using the design structure. The new parallel shift register latch can be applied to the design of easily testable PLA's. In this case, the number of test patterns is decreased and decoders which are added to the feedback inputs in conventional PLA's using LSSD are not necessary.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.3
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• pp.1-15
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• 1998

In this paper, we propose a partial scan test method which can be applied to large VLSI designs. In this method, it is not necessary to hold neither scanned nor unscanned flip-flops during scan in, test application,or scan out. This test method requires almost identical design for testability modification and test wave form when compared to the full scan test method, and the method is applicable to large VLSI chips. The well known FAN algorithm has been modified to devise to sequential ATPG algorithm which is effective for the proposed test method. In addition, a partial scan algorithm which is effective for the proposed test method. In addition, a partial algorithm determined a maximal set of flip-flops which gives high fault coverage when they are unselected. The experimental resutls show that the proposed method allow as large as 20% flip-flops to remain unscanned without much decrease in the full scan fault coverage.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.11
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• pp.140-148
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• 1993

High Integration ratio of CMOS circuits incredily increases the test cost during the design and fabrication processes because of the FET fault(Stuck-on faults and Stuck-off faults) which are due to the operational characteristics of CMOS circuits. This paper proposes a test generation algorithm for an arbitrarily large CMOS circuit, which can unify the test steps during the design and fabrication procedure and be applied to both static and dynaic circuits. This algorithm uses the logic equations set for the subroutines resulted from arbitrarily dividing the full circuit hierarchically or horizontally. Also it involves a driving procedure from output stage to input stage, in which to drive a test set corresponding to a subcircuit, only the subcircuits connected to that to be driven are used as the driving resource. With this algorithm the test cost for the large circuit such as VLSI can be reduced very much.

• 전기의세계
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• v.32 no.6
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• pp.331-337
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• 1983

VLSI시대에 있어서 IC제작시 Test직전 까지의 Technology상 어떠한 문제점이 대두되며 이와 같은 문제점에 어떻게 대응하여 나가는가에 관한 것을 논하려고 한다.

• The Transactions of the Korea Information Processing Society
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• v.2 no.3
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• pp.425-432
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• 1995

In this paper we propose a design and implementation technique of a universal automatic test pattern generator(UATPG) which is well suited for VLSI digital circuits. UATPG is designed to extend the capabilities of the existing APTG and to provide a convenient environment to computer-aided design(CAD) users. We employ heuristic techniques in line justification and fault propagation for functional gates during test pattern generation for a target fault. In addition, the flip-flops associated with design for testability (DFT) are exploited for pseudo PIs and pseudo POs to enhance the testabilities of VLSI circuits. As a result, UATPG shows a good enhancement in convenient usage and performance.

• Journal of KIISE:Computer Systems and Theory
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• v.31 no.3_4
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• pp.160-169
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• 2004

With an emergence of SOC from developed IC technology, the VLSI design has required the core re-use technique and modular test development. To minimize the cost of testing SOC, an efficient method is required to optimize the test time and area overhead in conjunction for the core test wrapper, which is one of the important elements for SOC test architecture. In this paper, we propose an efficient design strategy of core test wrapper to achieve the minimum cost for SOC testing. The proposed strategy adopted advantages of traditional methods and more developed to be successfully used in practice.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.891-894
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• 1999

According to increasing the integration of the device, there are important consideration about the improvement of the reliability in the product. To improve the reliability of the device, the test parameters and test time are increased. There are no pin-to-pin short test and pin-to-pin leakage test in the present test items to analysis the characteristics and reliability of the device. The purpose of the paper is to model the pin-to-pin phenomenon and propose to modify the test method present and to test the new pin-to-pin DC parameters. These modified and additive test items are applied to product test and confirmed to improve the reliability of product test.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.4
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• pp.292-301
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• 2001

IDDQ Testing is a very effective testing method to detect many kinds of physical defects occurred in CMOS VLSI circuits. In this paper, we consider the most commonly occurring bridging faults in current CMOS technologies and develop pattern generator for IDDQ testing using efficient IDDQ test algorithms. The complete set of bridging faults between every pair of all nodes(internal and external nodes) within circuit under test is assumed as target fault model. The merit of considering the complete bridging fault set is that layout information is not necessary. Implemented test pattern generator uses a new neighbor searching algorithm and fault collapsing schemes to achieve fast run time, high fault coverage, and compact test sets. Experimental results for ISCAS benchmark circuits demonstrate higher efficiency than those of previous methods.