• Journal of Bio-Environment Control
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• v.18 no.3
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• pp.215-224
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• 2009

A survey on the actual state of heating, cooling, ventilation, and air-flow and experimental measurement of temperature and humidity distribution in tomato greenhouse were performed to provide fundamental data required in the development of air-flow control technology. In single-span plastic houses, which account for most of 136 tomato greenhouses surveyed, roof windows, ventilation and air-flow fans were installed in a low rate, and installation specs of those facilities showed a very large deviation. There were no farms installed greenhouse cooling facilities. In the hot air heating system, which account for most of heating type, installation specs of hot air duct showed also a large deviation. The exhaust air temperature and wind speed in hot air duct also were measured to have a big difference depending on the distance from the heater. We are using the maximum difference as indicator to determine whether temperature distribution is uniform. However if the temperature slope is not identical in greenhouse, it can't represent the uniformity. We analyzed relation between the maximum difference and the uniformity of temperature and humidity distribution. The uniformity was calculated using the mean and standard deviation of data from 12 measuring points. They showed high correlation but were represented differently by linear in the daytime and quadratic in the nighttime. It could see that the uniformity of temperature and humidity distribution was much different according to greenhouse type and heating method. The installation guidelines for ventilation and air-flow fan, the spread of greenhouse cooling technology for year-round stable production, and improvement of air duct and heating system, etc. are needed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.10
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• pp.2572-2576
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• 2009

The wafer prober is used in mass production process of semiconductor chips. The chuck in wafer prober must have a uniform temperature distribution when the chuck is heated or cooled. The temperature distribution of prober chuck is measured by using a thermocouple when the chuck is cooled. The temperature distribution is also calculated by using a CFD program, FLUENT. The measured temperature and calculated temperature show similar distributions. A modified coolant circuit distribution for the improving temperature uniformity is suggested based on the numerical analysis results.

• Journal of Bio-Environment Control
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• v.28 no.4
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• pp.335-341
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• 2019

In order to provide basic data for uniformization of temperature distribution in heating greenhouses, heating experiments were performed in two greenhouses with a hot water heating system. By analyzing heat transfer characteristics and improving pipes layout, measures to reduce the variation of pipe surface temperature and to improve the uniformity were derived. As a result of analyzing the temperature distributions of two different greenhouses and examining the maximum deviation and uniformity, it was found that the temperature deviation of greenhouses with a large amount of hot water flow and a short heating pipe was small and the uniformity was high. And it was confirmed that the temperature deviation was reduced and the uniformity was improved when the circulating fan was operated. The correlation between the surface temperature of the heating pipe and the indoor air temperature was a positive correlation and statistically significant(p<0.01) in both greenhouses. It was confirmed that the indoor temperature distribution in a hot water heating greenhouse was influenced by the surface temperature distribution of heating pipe, and the uniformity of indoor temperature distribution could be improved by arranging the heating pipe to minimize the temperature deviation. Analysis of the heat transfer characteristics of heating pipe showed that the temperature deviation increased as the pipe length became longer and the temperature deviation became smaller as the flow rate in pipe increased. Therefore, it was considered that the temperature distribution and the uniformity of environment in a greenhouse could be improved by arranging the heating pipe to shorten the length and controlling the flow velocity in pipe. In order to control the temperature deviation of one branch pipe within $3^{\circ}C$ in the tube rail type hot water heating system most used in domestic greenhouses, when the flow velocity in the pipe is 0.2, 0.4, 0.6, 0.8, $1.0m{\cdot}s^{-1}$, the length of a heating pipe should be limited to 40, 80, 120, 160, 200m, respectively.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.561-564
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.19-24
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• 2021

As the size of semiconductor devices decreases, the etching pattern becomes very narrow and a deep high aspect ratio process becomes important. The cryogenic etching process enables high aspect ratio etching by suppressing the chemical reaction of reactive ions on the sidewall while maintaining the process temperature of -100℃. ESC is an important part for temperature control in cryogenic etching equipment. Through the cooling path inside the ESC, liquid nitrogen is used as cooling water to create a cryogenic environment. And since the ESC directly contacts the wafer, it affects the temperature uniformity of the wafer. The temperature uniformity of the wafer is closely related to the yield. In this study, the cooling path was designed and analyzed so that the wafer could have a uniform temperature distribution. The optimal cooling path conditions were obtained through the analysis of the shape of the cooling path and the change in the speed of the coolant. Through this study, by designing ESC with optimal temperature uniformity, it can be expected to maximize wafer yield in mass production and further contribute to miniaturization and high performance of semiconductor devices.

• Journal of the Korean Society of Visualization
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• v.16 no.3
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• pp.59-64
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• 2018

Numerical simulations were carried out to analyze the flow characteristics of the wind tunnel. Flow field characteristics with velocity uniformity at the test sections are largely affected by inlet conditions of air flow rate and temperature. Axial average velocity of the flow field inside the test area was almost linearly decreased by 0.026% each 1m. The uniformity distributions of axial velocity showed the highest reduction rate of about 24% between nozzle outlets 1 ~ 2m. In addition, average velocity and the uniformity are increased with air temperature in the wind tunnel due to density variation. The results of this paper are expected to be useful for the basic design of wind tunnel and to be used for efficient design.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.72-77
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• 2016

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.73-73
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• 2008

In this work, the study on the $SiO_2$ film non-uniformity by PECVD (Plasma Enhanced Chemical Vapor Deposition) was performed. Plasma diagnostics was analyzed by a DLP(Double Langmuir Probe) and a probe-type QMS(Quadrupole Mass Spectrometer) in order to investigate the spatial distribution of the plasma species in the chamber. The relationship between the plasma species and the depositing rate of the films was examined. On the basis of this work, it was confirmed that O radical density mainly contributed to the increase in the depositing rate of the $SiO_2$ films and the electron temperature in the plasma had a main effect on the formation of the oxygen radicals.

• International Journal of Advanced Culture Technology
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• v.10 no.3
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• pp.295-306
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• 2022

The NOx removal performance of the SCR process depends on various factors such as catalytic factors (catalyst composition, shape, space velocity, etc.), temperature and flow rate distribution of the exhaust gas. Among them, the uniformity of the flow flowing into the catalyst bed plays the most important role. In this study, the flow characteristics in the SCR reactor in the design stage were simulated using a three-dimensional numerical analysis technique to confirm the uniformity of the airflow. Due to the limitation of the installation space, the shape of the inlet duct was compared with the two types of inlet duct shape because there were many curved sections of the inlet duct and the duct size margin was not large. The effect of inlet duct shape, guide vane or mixer installation, and venturi shape change on SCR reactor internal flow, airflow uniformity, and space utilization rate of ammonia concentration were studied. It was found that the uniformity of the airflow reaching the catalyst layer was greatly improved when an inlet duct with a shape that could suppress drift was applied and guide vanes were installed in the curved part of the inlet duct to properly distribute the process gas. In addition, the space utilization rate was greatly improved when the duct at the rear of the nozzle was applied as a venturi type rather than a mixer for uniform distribution of ammonia gas.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.7
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• pp.837-844
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• 2003

The exhaust gas flow in the inlet collector of close coupled catalyst(CCC) adapted to the exhaust manifold is very complex flow because the exhaust gas is a pulsation flow with several port flow. The distribution of gas flow and temperature in inlet collector effect to the efficiency of catalytic converter. In this study, it measures temperatures on several point in inlet collector with two kind of inlet collector volume. And it analyzes with CFD to exhaust manifold and close coupled catalyst for temperature and flow. Comparing to measured and analyzed result, it find increasing of collector volume effects to catalyst temperature distribution and uniformity of catalytic converter