• 한국항공우주학회지
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• 제44권5호
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• pp.455-462
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• 2016

적외선 검출기와 같은 우주용 영상센서는 작동 유무 및 시간경과에 따라 센서의 응답특성이 변하기 때문에 영상품질이 저하된다. 이러한 영상센서의 비균일 응답특성을 보정하기 위하여 궤도상에서 보정용 흑체시스템을 이용하여 주기적인 보정을 실시 할 수 있도록 해야 한다. 본 논문에서는 저온에서 고온에 이르는 다양한 기준온도에서의 높은 온도균일도 확보 및 흑체의 대표표면온도 추정이 용이하고, 초경량, 저전력, 고정밀도의 흑체 시스템을 구현하기 위해 MEMS(Micro Electro Mechanical Systems)기반의 흑체시스템을 제안하였으며, 열해석을 통해 성능을 입증하였다.

• International Journal of Advanced Culture Technology
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• 제10권3호
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• pp.295-306
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• 2022

The NOx removal performance of the SCR process depends on various factors such as catalytic factors (catalyst composition, shape, space velocity, etc.), temperature and flow rate distribution of the exhaust gas. Among them, the uniformity of the flow flowing into the catalyst bed plays the most important role. In this study, the flow characteristics in the SCR reactor in the design stage were simulated using a three-dimensional numerical analysis technique to confirm the uniformity of the airflow. Due to the limitation of the installation space, the shape of the inlet duct was compared with the two types of inlet duct shape because there were many curved sections of the inlet duct and the duct size margin was not large. The effect of inlet duct shape, guide vane or mixer installation, and venturi shape change on SCR reactor internal flow, airflow uniformity, and space utilization rate of ammonia concentration were studied. It was found that the uniformity of the airflow reaching the catalyst layer was greatly improved when an inlet duct with a shape that could suppress drift was applied and guide vanes were installed in the curved part of the inlet duct to properly distribute the process gas. In addition, the space utilization rate was greatly improved when the duct at the rear of the nozzle was applied as a venturi type rather than a mixer for uniform distribution of ammonia gas.

• 한국수소및신에너지학회논문집
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• 제31권6호
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• pp.614-621
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• 2020

Recently, as the fine dust is increased and the emission regulations of diesel engines are strengthened, interest in diesel soot filtration devices is rapidly increased. In particular, there is a demand for technology development for higher efficiency of diesel exhaust gas after-treatment devices. As part of this, many studies conducted to increase the exhaust gas treatment efficiency by improving the flow uniformity of the exhaust gas in the DPF and reducing the pressure drop between the inlet and outlet of disel particle filter (DPF). In this study, computational fluid dynamics (CFD) simulation was performed when exhaust gas flows into the canning reduction device equipped with a 13" asymmetric DPF in order to maintain the flow uniformity in the diesel exhaust system and reduce the pressure. In particular, a study was conducted to find the geometry with the smallest pressure drop and the highest flow uniformity by simulating the DPF I/O ratio, exhaust gas temperature, inlet-outlet pressure and flow uniformity according to the geometry and hole size of distributor.

• 한국세라믹학회지
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• 제47권3호
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• pp.262-267
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• 2010

a-SiC has been thought as an ideal candidate for conventional silicon at many applications. However, the uniformity problem of deposition has been a obstacle for conventional use of a-SiC:H films. a-SiC:H films were deposited on (100) silicon wafer by RPECVD system in various temperature. HMDS and $H_2$ gas were used as a precursor and a carrier gas, respectively. The flow rate of HMDS source and $C_2H_2$ dilution gas was fixed in order to study the carbon effect on the film stoichiometric and bonding properties. The plasma power varied from 200 to 400W. We used three types of source delivery line to control the uniformity and film properties of deposited film. We showed that the change of source delivery line has effect on the film uniformity of deposited film and this change of line did not affect on film properties. Also, the change of deposition conditions has effect on the film uniformity.

• 한국초전도ㆍ저온공학회논문지
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• 제25권4호
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• pp.24-27
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• 2023

Until now, many research activities have been conducted to commercialize high-temperature superconducting (HTS) wires for electric applications. Most of all researchers have focused on enhancing the piece length, critical current density, mechanical strength, and throughput of HTS wires. Recently, HTS magnet for generating high magnetic field shows degraded performance due to the deformation of HTS wire by high electro-magnetic force. The deformation can be derived from widthwise thickness non-uniformity of HTS wire mainly caused by wet processes such as electro-polishing of metal substrate and electro-plating of copper. Gradient sputtering process is designed to improve the thickness uniformity of HTS wire along the width direction. Copper stabilizing layer is deposited on HTS wire covered with specially designed mask. In order to evaluate the thickness uniformity of HTS wire after gradient sputtering process, the thickness distribution across the width is measured by using the optical microscope. The results show that the gradient deposition process is an effective method for improving the thickness uniformity of HTS wire.

• 한국분무공학회지
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• 제24권2호
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• pp.51-57
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• 2019

In this study, the spray atomization characteristics of urea injector used in SCR system for construction machinery was analyzed, and the uniformity index at the front of mixer and NOx conversion efficiency were evaluated through numerical analysis. Spray visualization and droplet size/velocity measurement were performed and the measured results were used to verify the spray analysis model to calculate the uniformity index in the exhaust gas after-treatment system. For the flow analysis, STAR-CCM, a three-dimensional CFD, was used and the uniformity index of the SCR system at the front of the mixer was calculated using the droplet dissociation model and the wall collision model. Finally, the DeNOx performance for the average condition of the NRTC driving mode was calculated to understand the NOx conversion efficiency reflecting the exhaust gas temperature. The simulation results show that the uniformity index at the front of mixer was calculated as 0.862 and DeNOx efficiency was 75.9%.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.2606-2611
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• 2003

Comprehensive study on the control system design for a RTP process has been conducted. The purpose of the control system is to maintain maximum temperature uniformity across the silicon wafer achieving precise tracking for various reference trajectories. The study has been carried out in two stages: thermal balance modeling on the basis of a semi-empirical radiation model, and optimal iterative learning controller design on the basis of a linear state space model. First, we found through steady state radiation modeling that the fourth power of wafer temperatures, lamp powers, and the fourth power of chamber wall temperature are related by an emissivity-independent linear equation. Next, for control of the MIMO system, a state space modeland LQG-based two-stage batch control technique was derived and employed to reduce the heavy computational demand in the original two-stage batch control technique. By accommodating the first result, a linear state space model for the controller design was identified between the lamp powers and the fourth power of wafer temperatures as inputs and outputs, respectively. The control system was applied to an experimental RTP equipment. As a consequence, great uniformity improvement could be attained over the entire time horizon compared to the original multi-loop PID control. In addition, controller implementation was standardized and facilitated by completely eliminating the tedious and lengthy control tuning trial.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2007년도 동계학술발표대회 논문집
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• pp.635-639
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• 2007

In this study, optimal design and test of flat-plate heat pipe were carried out in order to improve both thermal response and surface temperature uniformity of heating plate. Experimental results show that the thermal response of flat-plate heat pipe is faster than that of a conventional heating type ones along with less weight and cost. The surface temperature uniformity is also improved.

• 한국연소학회지
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• 제15권2호
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• pp.27-33
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• 2010

Recently, much attention has been paid to utilizing highly preheated air up to $1,000^{\circ}C$ through waste gas in industrial furnaces. The regenerative burner technology has shown to provide significant reduction in energy consumption (up to 60%), downsizing of the equipment (about 30%) and lower emissions (about 30%) while maintaining high thermal performance of the system since 2000. The object of this study is to develop the flameless regenerative burner for industrial furnaces based on the FLOX(Flameless Oxidation) principle and it has been designed and manufactured as pilot scale. Performance tests are experimentally done and their results are discussed. They showed 1) a very good uniformity in temperature distribution, 2) about 100 ppm in NOx at the temperature $1,300^{\circ}C$, 3) about 95% in temperature efficiency. Besides, the regenerative burner has advantage in easy maintenance and high usage rate of regenerator due to the separate and portable type of heat exchanger.

• 반도체디스플레이기술학회지
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• 제12권4호
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• pp.39-44
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• 2013

In the semiconductor heat-treatment process, the temperature uniformity determines the film quality of a wafer. This film quality effects on the overall yield rate. The heat transfer of the wafer surface in the heat-treatment process equipment is occurred by convection and radiation complexly. Because of this, there is the nonlinearity between the wafer temperature and reactor. Therefore, the accurate prediction of temperature on the wafer surface is difficult without the direct measurement. The thermal camera and the T/C wafer are general ways to confirm the temperature uniformity on the heat-treatment process. As above ways have limit to measure the temperature in the precise domain under the micro-scale. In this study, we developed the thin film type temperature sensor using the MEMS technology to establish the system which can measure the temperature under the micro-scale. We combined the experiment and numerical analysis to verify and calibrate the system. Finally, we measured the temperature on the wafer surface on the semiconductor process using the developed system, and confirmed the temperature variation by comparison with the commercial T/C wafer.