• 대한기계학회논문집B
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• 제41권10호
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• pp.667-673
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• 2017

공개소스 전산유체 해석 라이브러리인 OpenFOAM을 이용하여 음극 지지체형 고체산화물 연료전지의 온도균일성에 관한 연구를 수행하였다. 3가지 유형의 유동흐름(병행류, 대향류, 직교류)에 대하여 수치해석이 이루어졌다. 다공성 물질내에서의 기체의 흐름은 유효확산계수를 이용하여 계산하였고 분리판의 리브 영향도 고려하였다. 전기화학반응의 계산을 위하여 실험식으로부터 얻은 집중내부저항 모델이 사용되었다. 수치해석 결과 대향류가 가장 균일한 온도분포를 나타내었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.509-512
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• 2006

In this paper, we proposed the novel device and process design to enhance the uniformity of low-temperature poly-Si TFTs fabricated by sequential lateral solidification (SLS). The proposed design schemes can avert the conventional two-shot SLS process-induced issues. Moreover, different design considerations between conventional excimer laser crystallization and the SLS process were also proposed and discussed.

• 한국자동차공학회논문집
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• 제8권3호
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• pp.46-55
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• 2000

Four types of different flow inlet models were tested to improve the flow uniformity at the inlet of the radiator and to prevent thermal damages of auxiliary units from the hot air in the bus engine room. Measurements and numerical calculations were performed and their results were in a good agreement with each other. Simultaneously temperature measurements were carried out under the conditions of actual bus driving. As designing the new flow inlet at the partition board which seperates the engine space and radiator space, flow circulation can be achieved and fresh air comes into the engine room from the bottom. It was proved that new inlet makes the one air temperature cooling down in the engine room, the other uniformity improvement.

• 한국결정성장학회지
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• 제10권2호
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• pp.91-95
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• 2000

8인치 쵸크랄스키 실리콘 단결성 성장에 있어서, 계면에서의 온도기울기, 산소, 농도 및, 반경방향의 산소농도 분포에 미치는 아르곤 가스 유동의 영향을 조사하였다. 아르곤의 유입량을 증가시킴에 따라 계면 근처 결정내 온도기울기가 증가하였으며. 결정내 산소농도는 감소하였다. 한편, 반경방향의 산소농도 균일성은 악화됨이 관찰되었다. 실험 결과를 종합하여 볼 때, 아르곤 유동이 산소 농도 및 균일 분포성 등의 결정 특성에 중요한 영향을 미치는 성장 공정변수임을 확인할 수 있었다.

• 반도체디스플레이기술학회지
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• 제17권3호
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• pp.85-89
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• 2018

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials and inner coolant path on the chuck surface. Finally this study suggests the best cooling condition of electrostatic chuck.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.278-283
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• 2003

Analysis has been carried out to investigate the temperature variation and the uniformity of the temperature distribution of the glass panel by infrared radiant heating. Halogen lamps are used to heat the panel and located near the top and bottom of the rectangular chamber. The thermal energy is transfered only by radiation and the radiation exchange occurs only on the solid surfaces and is considered by using the view factor. The results show that the uniformity of the temperature distribution of the panel is improved but the time for heating increases as the wall reflectivity is large. The temperature difference reaches a maximum in the early stage of the heating process and then decreases until it reaches the uniform steady-state value.

• 열처리공학회지
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• 제21권6호
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• pp.300-306
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• 2008

Solid state diffusion brazing of aluminum castings (AC4C) and wrought alloys (Al6061) was conducted in order to improve thermal conductivity and temperature uniformity of the aluminum heater which was generally fabricated by casting method. Tensile strength and thermal conductivity are raised with increasing brazing temperature, obtaining 122.5 MPa and $206W/m{\cdot}K$ at $540^{\circ}C$ 5hrs brazing conditions, respectively. The diffusion brazed heater, shows maximum temperature difference of $4^{\circ}C$, exhibits a enhanced temperature uniformity compared with the cast heater having the maximum temperature difference of $11^{\circ}C$.

• 한국표면공학회지
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• 제46권6호
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• pp.283-289
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• 2013

The experimental study for the temperature uniformity on the wafer using liquid-vapor phase heat transfer mechanism is performed. For the experiment, the heater plate which is consist of stainless steel container, working fluid and electrical heater is designed, manufactured and tested at the range of 600 to $850^{\circ}C$. The results showed that the phase change type heater plate was much more uniform and stable temperature on the heater plate surface and wafer than the uniform heat flux type heater plate at the atmospheric condition. Also, the results of 300 mm outer diameter of heater plate showed that the same temperature uniformity compared with 230 mm.

• 반도체디스플레이기술학회지
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• 제15권3호
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• pp.72-77
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• 2016

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.311-318
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• 2001

A three-dimensional numerical analysis of the flow and heat transfer characteristic of wood-flour-filled polypropylene melt in an extrusion die was carried out Used for this analysis were Finite Concept Method based on FVM, unstructured grid and non-Newtonian fluid viscosity model. Temperature and flow fields are closely coupled through temperature dependent viscosity and viscous dissipation. With large Peclet, Nahme, Brinkman numbers, viscous heating caused high temperature belt near die housing, Changing taper plate thickness and examining some predefined parameters at die exit investigated the effect of taper plate on velocity and temperature uniformities. In the presence of taper plate, uniformity at die exit could be improved and there existed an optimum thickness to maximize it.