• Journal of Biosystems Engineering
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• v.32 no.6
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• pp.422-429
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• 2007

To prevent deterioration of agricultural products during cold transportation, optimized temperature control is essential. Because the control of temperature and thermal uniformity of transported products are mainly governed by cooling air flow pattern in the transportation equipment, the accurate understanding and removal of appearance of stagnant air zone by poor ventilation is key to design of optimized cooling environment. The objectives of this study were to develop simulation model to predict the airflow and heat transfer phenomena in the cold container and to evaluate the effect of fan blowing velocity on the temperature level and uniformity of products using the CFD approach. Comparison of CFD prediction with PIV measurement showed that RSM turbulent model reveals the more reasonable results than standard $k-{\varepsilon}$ model. The increment of fan blowing velocity improved the temperature uniformity of product and reduced almost linearly the averaged temperature of product.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.49 no.2
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• pp.62-67
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• 2000

The uniformity of temperature on a wafer is one of the most important parameters to control the RTP (Rapid Thermal Process) with proper input signals. Since it is impossible to achieve the uniformity of temperature without exact estimation of temperature at all points on the wafer, the difficulty of understanding internal dynamics and structural complexities of the RTP is a primary obstacle to accurately measure the distributed temperatures on the wafer. Furthermore, it is also hard to accomplish desirable estimation because only few pyrometers have been commonly available in the general equipments. In the paper, a thermal model based on the chamber geometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through certain simulation and experiments. The work can be usefully contributed to building a run-by-run or a real-time controls of the RTP.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.6
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• pp.647-653
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• 1988

A rapid thermal annealing system using tungsten halogen lamp has been designed and assembled. A control scheme where the temperature control is executed with calculated wafer temperature by considering the thermocouple delay rather than measured thermocouple temperature,is proposed. This control scheme gives more accurate control of the wafer temperature. In addition, the distribution of transmitted light power to the wafer in the system has been simulated, and lamp interval modification has been able to give more uniform light power distribution. Considering incident light spectrum, absorption, reflection, radiation of silicon, etc., temperature profile has been simulated. When the light power uniformity on the 3" wafer is below 1%, the temperature uniformity is about 2%.

• Journal of Bio-Environment Control
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• v.28 no.4
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• pp.335-341
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• 2019

In order to provide basic data for uniformization of temperature distribution in heating greenhouses, heating experiments were performed in two greenhouses with a hot water heating system. By analyzing heat transfer characteristics and improving pipes layout, measures to reduce the variation of pipe surface temperature and to improve the uniformity were derived. As a result of analyzing the temperature distributions of two different greenhouses and examining the maximum deviation and uniformity, it was found that the temperature deviation of greenhouses with a large amount of hot water flow and a short heating pipe was small and the uniformity was high. And it was confirmed that the temperature deviation was reduced and the uniformity was improved when the circulating fan was operated. The correlation between the surface temperature of the heating pipe and the indoor air temperature was a positive correlation and statistically significant(p<0.01) in both greenhouses. It was confirmed that the indoor temperature distribution in a hot water heating greenhouse was influenced by the surface temperature distribution of heating pipe, and the uniformity of indoor temperature distribution could be improved by arranging the heating pipe to minimize the temperature deviation. Analysis of the heat transfer characteristics of heating pipe showed that the temperature deviation increased as the pipe length became longer and the temperature deviation became smaller as the flow rate in pipe increased. Therefore, it was considered that the temperature distribution and the uniformity of environment in a greenhouse could be improved by arranging the heating pipe to shorten the length and controlling the flow velocity in pipe. In order to control the temperature deviation of one branch pipe within $3^{\circ}C$ in the tube rail type hot water heating system most used in domestic greenhouses, when the flow velocity in the pipe is 0.2, 0.4, 0.6, 0.8, $1.0m{\cdot}s^{-1}$, the length of a heating pipe should be limited to 40, 80, 120, 160, 200m, respectively.

• Journal of Industrial Technology
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• v.20 no.B
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• pp.63-70
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• 2000

One aims to find out how the operation condition of secondary inlet angle effects the temperature distribution inside a small incinerator. A finite volume commercial code, PHONICS, is used to simulate the temperature field in an incinerator. The computational grid system is constructed by Multi-Block technique. The governing equations based on the curvilinear coordinates are used. Numerical experiments are done with the five variations of secondary air inlet. The temperature distribution is quantified by the statistical deviation of temperature in an incinerator. The computational analysis says that the certain angle of secondary air inlet could improve the uniformity of temperature distribution in an incinerator.

• Journal of Bio-Environment Control
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• v.18 no.3
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• pp.215-224
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• 2009

A survey on the actual state of heating, cooling, ventilation, and air-flow and experimental measurement of temperature and humidity distribution in tomato greenhouse were performed to provide fundamental data required in the development of air-flow control technology. In single-span plastic houses, which account for most of 136 tomato greenhouses surveyed, roof windows, ventilation and air-flow fans were installed in a low rate, and installation specs of those facilities showed a very large deviation. There were no farms installed greenhouse cooling facilities. In the hot air heating system, which account for most of heating type, installation specs of hot air duct showed also a large deviation. The exhaust air temperature and wind speed in hot air duct also were measured to have a big difference depending on the distance from the heater. We are using the maximum difference as indicator to determine whether temperature distribution is uniform. However if the temperature slope is not identical in greenhouse, it can't represent the uniformity. We analyzed relation between the maximum difference and the uniformity of temperature and humidity distribution. The uniformity was calculated using the mean and standard deviation of data from 12 measuring points. They showed high correlation but were represented differently by linear in the daytime and quadratic in the nighttime. It could see that the uniformity of temperature and humidity distribution was much different according to greenhouse type and heating method. The installation guidelines for ventilation and air-flow fan, the spread of greenhouse cooling technology for year-round stable production, and improvement of air duct and heating system, etc. are needed.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.116-120
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• 2017

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.561-564
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.9
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• pp.831-835
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• 2000

The uniformity of themperature on a wafer is a wafer is one the most important parameters to conterol the RTF(Rapid Thermal Process) with proper input signals. It is impossible to achieve the uniformity of temperature without the exact estimation of temperature ar all points on the wafer. There fore, it is difficult to understand the internal dynamics as well as the structural complexities of the RTP, which is aprimary obstacle to measure the distributed temperatures on the wafer accurately. Furthermore, it is also hard to accomplish desirable estimation because only a few pyrometers are available in the general equipments. In the paper, a thermal model based on the chamber grometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through simulation and experiments. The proposed work can be utilized to building a run-by -run or a real-time control of the RTP.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.481-482
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• 2013