• Journal of Advanced Marine Engineering and Technology
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• v.30 no.2
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• pp.275-283
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• 2006

Experiment and three dimensional numerical investigations of incompressible turbulent flow through square channels with one- and two-sided ribbed walls are performed to determine pressure drop and heat transfer. The CFX(version 5.7) software package is used for the computation. The ribbed walls have a $45^{\circ}$ inclined square rib. Uniform heat flux is maintained on whole inner heat transfer channel area. The numerical results coincide with experimental data that obtained for $7,600{\le}Re{\le}24.900$, the pitch-to-rib height ratio (p/e) of 8.0. and the rib height-to-channel hydraulic diameter ratio ($e/D_h$) of 0.0667. The results show that values of local heat transfer coefficient and friction factor in the channel with two-sided ribbed wall are higher than those in the channel with one-sided ribbed walls.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.5 s.176
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• pp.1323-1330
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• 2000

Recently, injection molding process became more popular than ever to produce large quantities of high precision products or optical products. Especially, optical disk that was made by injection mol ding process has been used for many years as a music play media or computer sub-device. The density of data in disk media has been increased continuously. But those optical disks can cause sensorial problems because of high birefringence or deformation from the residual stresses in the media. Therefore, it is necessary to study the effects of various process conditions on the final bireffingence structure in injection-molded disks for producing precision injection-molded products. In the present paper we have focussed on the effect of holding and compression pressures on the optical anisotropy remaining in the MOD by examining the gapwise distribution of birefringence and extinction angle. The effect of holding pressure was found to form the inner two bireffingence peaks. But the effect of compression pressure on the bireffingence distribution was found to make the uniform distribution near the center in the gapwise direction. Finally, the value of the birefringence near the wall decreased as the mold temperature increased.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.773-779
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• 2015

The laser Powder Bed Fusion (PBF) system is currently recognized as a leading process. Due to the various materials employed such as thermoplastic, metal and ceramic composite powder, the application's use extends to machinery, automobiles, and medical devices. The PBF system's surface quality of prototypes and processing time are significantly affected by several parameters such as laser power, laser beam size, heat temperature and laminate thickness. In order to develop a more elaborate and rapid system, this study developed a new PBF system and sintering process. It contains a 3-axis dynamic focusing scanner system that maintains a uniform laser beam size throughout the system unlike the $f{\theta}$ lens. In this study, experiments were performed to evaluate the effects of various laser scanning parameters and fabricating parameters on the fusion process, in addition to fabricating various 3D objects using a PA-12 starting material.

• Steel and Composite Structures
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• v.33 no.6
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• pp.805-822
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• 2019

In this work, a simple four-variable integral plate theory is employed for examining the thermal buckling properties of functionally graded material (FGM) sandwich plates. The proposed kinematics considers integral terms which include the effect of transverse shear deformations. Material characteristics and thermal expansion coefficient of the ceramic-metal FGM sandwich plate faces are supposed to be graded in the thickness direction according to a "simple power-law" variation in terms of the "volume fractions" of the constituents. The central layer is always homogeneous and consists of an isotropic material. The thermal loads are supposed as uniform, linear, and nonlinear temperature rises within the thickness direction. The influences of geometric ratios, gradient index, loading type, and type sandwich plate on the buckling properties are examined and discussed in detail.

• Applied Chemistry for Engineering
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• v.28 no.6
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• pp.691-695
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• 2017

Optimization study was carried out to improve the durability of the gas diffusion layer (GDL) in alkaline fuel cell cathode by the use of highly stable PDMS superhydrophobic coating. Two different commercial GDLs were selected as substrates. Coating temperature and viscosity of PDMS were controlled for the stability of structure in microporous layer of GDL as well as uniform coating according to thermal characteristics of GDL. Regardless of PDMS viscosity, highly stable superhydrophobicities were obtained with both GDLs at $200^{\circ}C$. After the accelerated test, however, 28BC GDL coated with 1000 CS PDMS showed the best durability with the lowest loss of superhydrophobicity.

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.224-227
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• 2015

In this study, 2 wt% Cr-doped Ni thin films were deposited using DC sputtering on a bare Si substrate using a 4 inch target at room temperature. In order to obtain ultrathin films from Cr-doped Ni thin films with high electrical properties and uniform surface, the micro-structure and electrical properties were investigated as a function of deposition time. For all deposition times, the Cr-doped Ni thin films had low average resistivity and small surface roughness. However, the resistivity of the Cr-doped Ni thin films at various ranges showed large differences for deposition times below 90 s. From the results, 120 s is considered as the appropriate deposition time for Cr-doped Ni thin films to obtain the lowest resistivity, a low surface roughness, and a small difference of resistivity. The Cr-doped Ni thin films are prospective materials for microdevices as ultrathin film electrodes.

• Transactions of Materials Processing
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• v.14 no.2 s.74
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• pp.126-132
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• 2005

The isothermal forging design of a Ti-6Al-4V wing shape was performed by 3D FE simulation. The design focuses on near-net shape forming by the single stage. The process variables such as the die design, pre-form shape and size, ram speed and forging temperature were investigated. The main design priorities were to minimize forging loads and to distribute strain uniformly in a given forging condition. The FE simulation results for the final process design were compared with the isothermal forging tests. The instability of deformation was evaluated using a processing map based on the dynamic materials model(DMM), including flow stability criteria. Finally, a modified process design for producing a uniform Ti-6Al-4V wing product without forming defects was suggested.

• Transactions of Materials Processing
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• v.15 no.8 s.89
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• pp.591-596
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• 2006

Torsion testing was employed to investigate the deformation and recrystallization behavior of coarse-grained Alloy 718, and the results are compared with the compression testing results. Mechanical testing was conducted on bulk Alloy718 samples within the temperature ranges, $1000^{\circ}C{\sim}1100^{\circ}C$. The strain gradient formed in the torsion specimens resulted in a recrystallization behavior which varied along the radial direction from the center to the surface. The flow curves based on effective stress and effective strain as obtained by Fields and Backofen's isotropic deformation theory and the dynamic recrystallization within the compression tested samples and torsion tested samples are different. The different deformation and recrystallization behavior can be rationalized by the fact that the deformation in the coarse-grained torsion specimens is not uniform and thus the strain gradient within the specimens cannot be analytically predicted by FE simulation. Thus, the extent of recrystallization cannot be properly predicted by the established recrystallization equations based on compression tests.